Search

Cam N Nguyen

Examiner (ID: 5643, Phone: (571)272-1357 , Office: P/1736 )

Most Active Art Unit
1736
Art Unit(s)
1736, 1793, 1754
Total Applications
2328
Issued Applications
1758
Pending Applications
181
Abandoned Applications
389

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 11918577 [patent_doc_number] => 09786770 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-10 [patent_title] => 'Semiconductor device structure with non planar slide wall' [patent_app_type] => utility [patent_app_number] => 15/286988 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4909 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 309 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15286988 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/286988
Semiconductor device structure with non planar slide wall Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 11733162 [patent_doc_number] => 20170194605 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-07-06 [patent_title] => 'DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 15/287111 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6099 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287111 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287111
Display device and method of manufacturing the same Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 13057189 [patent_doc_number] => 10049993 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-14 [patent_title] => Microelectronics package with inductive element and magnetically enhanced mold compound component [patent_app_type] => utility [patent_app_number] => 15/287202 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 5172 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287202 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287202
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 11404875 [patent_doc_number] => 20170025413 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-01-26 [patent_title] => 'TRANSISTORS HAVING OFFSET CONTACTS FOR REDUCED OFF CAPACITANCE' [patent_app_type] => utility [patent_app_number] => 15/283175 [patent_app_country] => US [patent_app_date] => 2016-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6574 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15283175 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/283175
Transistors having offset contacts for reduced off capacitance Sep 29, 2016 Issued
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