
Carl J. Arbes
Examiner (ID: 227, Phone: (571)272-4563 , Office: P/3729 )
| Most Active Art Unit | 3729 |
| Art Unit(s) | 3206, 3726, 3202, 3201, 2103, 3727, 3729, 2899, 2831 |
| Total Applications | 4677 |
| Issued Applications | 4192 |
| Pending Applications | 65 |
| Abandoned Applications | 435 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 962433
[patent_doc_number] => 06948242
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-27
[patent_title] => 'Process for producing a contact-making device'
[patent_app_type] => utility
[patent_app_number] => 10/213750
[patent_app_country] => US
[patent_app_date] => 2002-08-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 5266
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/948/06948242.pdf
[firstpage_image] =>[orig_patent_app_number] => 10213750
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/213750 | Process for producing a contact-making device | Aug 5, 2002 | Issued |
Array
(
[id] => 1013113
[patent_doc_number] => 06892450
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-05-17
[patent_title] => 'Method of mounting light emitting device and method of fabricating image display unit'
[patent_app_type] => utility
[patent_app_number] => 10/213200
[patent_app_country] => US
[patent_app_date] => 2002-08-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 30
[patent_no_of_words] => 6267
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/892/06892450.pdf
[firstpage_image] =>[orig_patent_app_number] => 10213200
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/213200 | Method of mounting light emitting device and method of fabricating image display unit | Aug 4, 2002 | Issued |
Array
(
[id] => 1089253
[patent_doc_number] => 06823582
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-30
[patent_title] => 'Apparatus and method for force mounting semiconductor packages to printed circuit boards'
[patent_app_type] => B1
[patent_app_number] => 10/211440
[patent_app_country] => US
[patent_app_date] => 2002-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2287
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/823/06823582.pdf
[firstpage_image] =>[orig_patent_app_number] => 10211440
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/211440 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Aug 1, 2002 | Issued |
Array
(
[id] => 1145237
[patent_doc_number] => 06763582
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-20
[patent_title] => 'Throttle valve unit with drive unit receptacle and drive unit contact'
[patent_app_type] => B2
[patent_app_number] => 10/208798
[patent_app_country] => US
[patent_app_date] => 2002-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 3241
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/763/06763582.pdf
[firstpage_image] =>[orig_patent_app_number] => 10208798
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/208798 | Throttle valve unit with drive unit receptacle and drive unit contact | Jul 31, 2002 | Issued |
Array
(
[id] => 7379711
[patent_doc_number] => 20040020044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-05
[patent_title] => 'Apparatus and method for making electrical connectors'
[patent_app_type] => new
[patent_app_number] => 10/208538
[patent_app_country] => US
[patent_app_date] => 2002-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 9768
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0020/20040020044.pdf
[firstpage_image] =>[orig_patent_app_number] => 10208538
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/208538 | Apparatus and method for making electrical connectors | Jul 29, 2002 | Issued |
Array
(
[id] => 1140310
[patent_doc_number] => 06769174
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-03
[patent_title] => 'Leadframeless package structure and method'
[patent_app_type] => B2
[patent_app_number] => 10/205692
[patent_app_country] => US
[patent_app_date] => 2002-07-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 13
[patent_no_of_words] => 3150
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/769/06769174.pdf
[firstpage_image] =>[orig_patent_app_number] => 10205692
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/205692 | Leadframeless package structure and method | Jul 25, 2002 | Issued |
Array
(
[id] => 6778870
[patent_doc_number] => 20030049951
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-13
[patent_title] => 'Microelectronic contact structures, and methods of making same'
[patent_app_type] => new
[patent_app_number] => 10/202768
[patent_app_country] => US
[patent_app_date] => 2002-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 17298
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 31
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0049/20030049951.pdf
[firstpage_image] =>[orig_patent_app_number] => 10202768
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/202768 | Microelectronic contact structures, and methods of making same | Jul 24, 2002 | Issued |
Array
(
[id] => 6410019
[patent_doc_number] => 20020182925
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Backshell assembly'
[patent_app_type] => new
[patent_app_number] => 10/205877
[patent_app_country] => US
[patent_app_date] => 2002-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5365
[patent_no_of_claims] => 43
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0182/20020182925.pdf
[firstpage_image] =>[orig_patent_app_number] => 10205877
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/205877 | Backshell assembly | Jul 23, 2002 | Issued |
Array
(
[id] => 1103921
[patent_doc_number] => 06807732
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-10-26
[patent_title] => 'Methods for modifying inner-layer circuit features of printed circuit boards'
[patent_app_type] => B2
[patent_app_number] => 10/202738
[patent_app_country] => US
[patent_app_date] => 2002-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 17
[patent_no_of_words] => 3120
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/807/06807732.pdf
[firstpage_image] =>[orig_patent_app_number] => 10202738
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/202738 | Methods for modifying inner-layer circuit features of printed circuit boards | Jul 23, 2002 | Issued |
Array
(
[id] => 6680475
[patent_doc_number] => 20030116339
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-26
[patent_title] => 'Electric-component mounting system, and printed-circuit board fabricating process'
[patent_app_type] => new
[patent_app_number] => 10/200291
[patent_app_country] => US
[patent_app_date] => 2002-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 37489
[patent_no_of_claims] => 51
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20030116339.pdf
[firstpage_image] =>[orig_patent_app_number] => 10200291
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/200291 | Electric-component mounting system | Jul 22, 2002 | Issued |
Array
(
[id] => 6859867
[patent_doc_number] => 20030090875
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-15
[patent_title] => 'Electronic assembly having solder thermal interface between a die substrate and a heat spreader'
[patent_app_type] => new
[patent_app_number] => 10/200807
[patent_app_country] => US
[patent_app_date] => 2002-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2256
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20030090875.pdf
[firstpage_image] =>[orig_patent_app_number] => 10200807
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/200807 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Jul 21, 2002 | Issued |
Array
(
[id] => 6720929
[patent_doc_number] => 20030054618
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-20
[patent_title] => 'Angled edge connections for multichip structures'
[patent_app_type] => new
[patent_app_number] => 10/198818
[patent_app_country] => US
[patent_app_date] => 2002-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3915
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 173
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0054/20030054618.pdf
[firstpage_image] =>[orig_patent_app_number] => 10198818
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/198818 | Angled edge connections for multichip structures | Jul 17, 2002 | Issued |
Array
(
[id] => 1008092
[patent_doc_number] => 06898847
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-05-31
[patent_title] => 'Method for producing an electrical connection between a plug element and a printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 10/193989
[patent_app_country] => US
[patent_app_date] => 2002-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1723
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/898/06898847.pdf
[firstpage_image] =>[orig_patent_app_number] => 10193989
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/193989 | Method for producing an electrical connection between a plug element and a printed circuit board | Jul 14, 2002 | Issued |
Array
(
[id] => 6837040
[patent_doc_number] => 20030034380
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-20
[patent_title] => 'Method for removing solder bumps from LSI'
[patent_app_type] => new
[patent_app_number] => 10/192478
[patent_app_country] => US
[patent_app_date] => 2002-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 3891
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0034/20030034380.pdf
[firstpage_image] =>[orig_patent_app_number] => 10192478
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/192478 | Method for removing solder bumps from LSI | Jul 8, 2002 | Issued |
| 10/111870 | Method of producing a superconducting cable | Jul 2, 2002 | Abandoned |
Array
(
[id] => 6650120
[patent_doc_number] => 20030076276
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-04-24
[patent_title] => 'Methods and systems for embedding electrical components in a device including a frequency responsive structure'
[patent_app_type] => new
[patent_app_number] => 10/188909
[patent_app_country] => US
[patent_app_date] => 2002-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2398
[patent_no_of_claims] => 96
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 67
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0076/20030076276.pdf
[firstpage_image] =>[orig_patent_app_number] => 10188909
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/188909 | Methods and systems for embedding electrical components in a device including a frequency responsive structure | Jul 1, 2002 | Abandoned |
Array
(
[id] => 1263092
[patent_doc_number] => 06651318
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-11-25
[patent_title] => 'Method of manufacturing flexible interconnect cable'
[patent_app_type] => B2
[patent_app_number] => 10/186525
[patent_app_country] => US
[patent_app_date] => 2002-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 2546
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/651/06651318.pdf
[firstpage_image] =>[orig_patent_app_number] => 10186525
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/186525 | Method of manufacturing flexible interconnect cable | Jun 27, 2002 | Issued |
Array
(
[id] => 1137694
[patent_doc_number] => 06772513
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-08-10
[patent_title] => 'Method for making electro-fluidic connections in microfluidic devices'
[patent_app_type] => B1
[patent_app_number] => 10/184782
[patent_app_country] => US
[patent_app_date] => 2002-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 2861
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/772/06772513.pdf
[firstpage_image] =>[orig_patent_app_number] => 10184782
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/184782 | Method for making electro-fluidic connections in microfluidic devices | Jun 26, 2002 | Issued |
Array
(
[id] => 6752307
[patent_doc_number] => 20030000083
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-02
[patent_title] => 'Method of manufacturing wiring substrate'
[patent_app_type] => new
[patent_app_number] => 10/180097
[patent_app_country] => US
[patent_app_date] => 2002-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 7619
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20030000083.pdf
[firstpage_image] =>[orig_patent_app_number] => 10180097
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/180097 | Method of manufacturing wiring substrate | Jun 26, 2002 | Issued |
Array
(
[id] => 731714
[patent_doc_number] => 07032311
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-25
[patent_title] => 'Stabilized wire bonded electrical connections and method of making same'
[patent_app_type] => utility
[patent_app_number] => 10/179560
[patent_app_country] => US
[patent_app_date] => 2002-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 22
[patent_no_of_words] => 4965
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/032/07032311.pdf
[firstpage_image] =>[orig_patent_app_number] => 10179560
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/179560 | Stabilized wire bonded electrical connections and method of making same | Jun 24, 2002 | Issued |