
Carl J. Arbes
Examiner (ID: 227, Phone: (571)272-4563 , Office: P/3729 )
| Most Active Art Unit | 3729 |
| Art Unit(s) | 3206, 3726, 3202, 3201, 2103, 3727, 3729, 2899, 2831 |
| Total Applications | 4677 |
| Issued Applications | 4192 |
| Pending Applications | 65 |
| Abandoned Applications | 435 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6230547
[patent_doc_number] => 20100184305
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-22
[patent_title] => 'COMPENSATION OF THERMAL EXPANSION IN SMT INTERCONNECTS'
[patent_app_type] => utility
[patent_app_number] => 12/357836
[patent_app_country] => US
[patent_app_date] => 2009-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1659
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0184/20100184305.pdf
[firstpage_image] =>[orig_patent_app_number] => 12357836
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/357836 | Method of compensating for thermal expansion in SMT interconnects | Jan 21, 2009 | Issued |
Array
(
[id] => 8230863
[patent_doc_number] => 08196300
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-12
[patent_title] => 'Manufacturing method of electric contact and manufacturing equipment of electric contact'
[patent_app_type] => utility
[patent_app_number] => 12/866727
[patent_app_country] => US
[patent_app_date] => 2009-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 8628
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[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/196/08196300.pdf
[firstpage_image] =>[orig_patent_app_number] => 12866727
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/866727 | Manufacturing method of electric contact and manufacturing equipment of electric contact | Jan 15, 2009 | Issued |
Array
(
[id] => 6471089
[patent_doc_number] => 20100040984
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-18
[patent_title] => 'METHOD OF FABRICATING MICRO ELECTRO-MECHANICAL COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 12/350746
[patent_app_country] => US
[patent_app_date] => 2009-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5346
[patent_no_of_claims] => 38
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[pdf_file] => publications/A1/0040/20100040984.pdf
[firstpage_image] =>[orig_patent_app_number] => 12350746
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/350746 | METHOD OF FABRICATING MICRO ELECTRO-MECHANICAL COMPONENT | Jan 7, 2009 | Abandoned |
Array
(
[id] => 4499070
[patent_doc_number] => 07971348
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Method for manufacturing component-embedded substrate'
[patent_app_type] => utility
[patent_app_number] => 12/348358
[patent_app_country] => US
[patent_app_date] => 2009-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 47
[patent_no_of_words] => 9449
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 157
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/971/07971348.pdf
[firstpage_image] =>[orig_patent_app_number] => 12348358
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/348358 | Method for manufacturing component-embedded substrate | Jan 4, 2009 | Abandoned |
Array
(
[id] => 6383477
[patent_doc_number] => 20100162561
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-01
[patent_title] => 'SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS'
[patent_app_type] => utility
[patent_app_number] => 12/346997
[patent_app_country] => US
[patent_app_date] => 2008-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 1584
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0162/20100162561.pdf
[firstpage_image] =>[orig_patent_app_number] => 12346997
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/346997 | Sliding package retention device for LGA sockets | Dec 30, 2008 | Issued |
Array
(
[id] => 5550949
[patent_doc_number] => 20090284935
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-19
[patent_title] => 'STRUCTURE AND MANUFACTURING PROCESS FOR CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/345386
[patent_app_country] => US
[patent_app_date] => 2008-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3031
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0284/20090284935.pdf
[firstpage_image] =>[orig_patent_app_number] => 12345386
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/345386 | Manufacturing process for a circuit board | Dec 28, 2008 | Issued |
Array
(
[id] => 6285934
[patent_doc_number] => 20100157568
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-06-24
[patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/342266
[patent_app_country] => US
[patent_app_date] => 2008-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 6349
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20100157568.pdf
[firstpage_image] =>[orig_patent_app_number] => 12342266
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/342266 | Method of manufacturing a semiconductor device | Dec 22, 2008 | Issued |
Array
(
[id] => 7653501
[patent_doc_number] => 20110302770
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-15
[patent_title] => 'METHOD OF MANUFACTURE OF IC CONTACTLESS COMMUNICATION DEVICES'
[patent_app_type] => utility
[patent_app_number] => 12/998916
[patent_app_country] => US
[patent_app_date] => 2008-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2785
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0302/20110302770.pdf
[firstpage_image] =>[orig_patent_app_number] => 12998916
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/998916 | Method of manufacture of IC contactless communication devices | Dec 16, 2008 | Issued |
Array
(
[id] => 5582308
[patent_doc_number] => 20090101510
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-23
[patent_title] => 'High density printed circuit board and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 12/314783
[patent_app_country] => US
[patent_app_date] => 2008-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3771
[patent_no_of_claims] => 6
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[pdf_file] => publications/A1/0101/20090101510.pdf
[firstpage_image] =>[orig_patent_app_number] => 12314783
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/314783 | Method of manufacturing high density printed circuit board | Dec 15, 2008 | Issued |
Array
(
[id] => 7700770
[patent_doc_number] => 20110225820
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-22
[patent_title] => 'METHOD FOR CRIMPING TERMINAL TO ALUMINUM ELECTRIC WIRE'
[patent_app_type] => utility
[patent_app_number] => 12/809220
[patent_app_country] => US
[patent_app_date] => 2008-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 3832
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0225/20110225820.pdf
[firstpage_image] =>[orig_patent_app_number] => 12809220
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/809220 | Method for crimping terminal to aluminum electric wire | Dec 15, 2008 | Issued |
Array
(
[id] => 6229188
[patent_doc_number] => 20100263204
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-10-21
[patent_title] => 'HIGH TEMPERATURE COMPOSITE TAPE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/746956
[patent_app_country] => US
[patent_app_date] => 2008-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2372
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[pdf_file] => publications/A1/0263/20100263204.pdf
[firstpage_image] =>[orig_patent_app_number] => 12746956
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/746956 | HIGH TEMPERATURE COMPOSITE TAPE AND METHOD FOR MANUFACTURING THE SAME | Nov 25, 2008 | Abandoned |
Array
(
[id] => 4452643
[patent_doc_number] => 07891091
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-22
[patent_title] => 'Method of enabling selective area plating on a substrate'
[patent_app_type] => utility
[patent_app_number] => 12/315066
[patent_app_country] => US
[patent_app_date] => 2008-11-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/891/07891091.pdf
[firstpage_image] =>[orig_patent_app_number] => 12315066
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/315066 | Method of enabling selective area plating on a substrate | Nov 24, 2008 | Issued |
Array
(
[id] => 5352023
[patent_doc_number] => 20090183367
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-23
[patent_title] => 'SELF-LOCKING WIRE TERMINAL AND SHAPE MEMORY WIRE TERMINATION SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/323207
[patent_app_country] => US
[patent_app_date] => 2008-11-25
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[patent_drawing_sheets_cnt] => 26
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[firstpage_image] =>[orig_patent_app_number] => 12323207
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/323207 | Method of manufacturing self-locking wire terminal | Nov 24, 2008 | Issued |
Array
(
[id] => 156952
[patent_doc_number] => 07673386
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-09
[patent_title] => 'Flip-chip component production method'
[patent_app_type] => utility
[patent_app_number] => 12/277927
[patent_app_country] => US
[patent_app_date] => 2008-11-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/277927 | Flip-chip component production method | Nov 24, 2008 | Issued |
Array
(
[id] => 6229191
[patent_doc_number] => 20100263207
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[patent_title] => 'Panelizing Method for Printed Circuit Board Manufacturing'
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[patent_app_number] => 12/743843
[patent_app_country] => US
[patent_app_date] => 2008-11-25
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[firstpage_image] =>[orig_patent_app_number] => 12743843
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/743843 | Panelizing Method for Printed Circuit Board Manufacturing | Nov 24, 2008 | Abandoned |
Array
(
[id] => 5561062
[patent_doc_number] => 20090133914
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-28
[patent_title] => 'METHOD FOR PRODUCING AN INTEGRATED DEVICE AND A DEVICE PRODUCED THEREBY'
[patent_app_type] => utility
[patent_app_number] => 12/275276
[patent_app_country] => US
[patent_app_date] => 2008-11-21
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0133/20090133914.pdf
[firstpage_image] =>[orig_patent_app_number] => 12275276
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/275276 | Method for producing an integrated device | Nov 20, 2008 | Issued |
Array
(
[id] => 8150170
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[patent_kind] => B2
[patent_issue_date] => 2012-05-01
[patent_title] => 'Method of making a circuit structure of a circuit board'
[patent_app_type] => utility
[patent_app_number] => 12/270718
[patent_app_country] => US
[patent_app_date] => 2008-11-13
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[pdf_file] => patents/08/166/08166652.pdf
[firstpage_image] =>[orig_patent_app_number] => 12270718
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/270718 | Method of making a circuit structure of a circuit board | Nov 12, 2008 | Issued |
Array
(
[id] => 6559019
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[patent_issue_date] => 2010-10-28
[patent_title] => 'System and Method for Marking any Non-Living or Living Objects, and Marking Element and Use of Same for Marking any Objects, in particular for Object Control and Object Management'
[patent_app_type] => utility
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Array
(
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[patent_issue_date] => 2011-12-27
[patent_title] => 'Method for hermetic electrical connections'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2008-11-11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/268667 | Method for hermetic electrical connections | Nov 10, 2008 | Issued |
Array
(
[id] => 6279647
[patent_doc_number] => 20100119352
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-13
[patent_title] => 'Camera Module Insertion Machine With Gripper'
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 12266808
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/266808 | Camera module insertion machine with gripper | Nov 6, 2008 | Issued |