
Carl W. Whitehead Jr.
Examiner (ID: 6801)
| Most Active Art Unit | 2503 |
| Art Unit(s) | 2815, 2503, 2813 |
| Total Applications | 662 |
| Issued Applications | 472 |
| Pending Applications | 16 |
| Abandoned Applications | 174 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3638347
[patent_doc_number] => 05610441
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-11
[patent_title] => 'Angle defined trench conductor for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/444465
[patent_app_country] => US
[patent_app_date] => 1995-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 1457
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/610/05610441.pdf
[firstpage_image] =>[orig_patent_app_number] => 444465
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/444465 | Angle defined trench conductor for a semiconductor device | May 18, 1995 | Issued |
Array
(
[id] => 3500866
[patent_doc_number] => 05532514
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-02
[patent_title] => 'High frequency semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/443449
[patent_app_country] => US
[patent_app_date] => 1995-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 17
[patent_no_of_words] => 5853
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 248
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/532/05532514.pdf
[firstpage_image] =>[orig_patent_app_number] => 443449
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/443449 | High frequency semiconductor device | May 17, 1995 | Issued |
Array
(
[id] => 3662359
[patent_doc_number] => 05627408
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-06
[patent_title] => 'Wire bonding structure for semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/444039
[patent_app_country] => US
[patent_app_date] => 1995-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 9750
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/627/05627408.pdf
[firstpage_image] =>[orig_patent_app_number] => 444039
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/444039 | Wire bonding structure for semiconductor devices | May 17, 1995 | Issued |
Array
(
[id] => 3594338
[patent_doc_number] => 05585669
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-17
[patent_title] => 'Semiconductor chip card having selective encapsulation'
[patent_app_type] => 1
[patent_app_number] => 8/444141
[patent_app_country] => US
[patent_app_date] => 1995-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3314
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/585/05585669.pdf
[firstpage_image] =>[orig_patent_app_number] => 444141
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/444141 | Semiconductor chip card having selective encapsulation | May 17, 1995 | Issued |
Array
(
[id] => 3575853
[patent_doc_number] => 05539252
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-23
[patent_title] => 'Fastener with onboard memory'
[patent_app_type] => 1
[patent_app_number] => 8/441929
[patent_app_country] => US
[patent_app_date] => 1995-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 5
[patent_no_of_words] => 2632
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/539/05539252.pdf
[firstpage_image] =>[orig_patent_app_number] => 441929
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/441929 | Fastener with onboard memory | May 15, 1995 | Issued |
Array
(
[id] => 3702057
[patent_doc_number] => 05677549
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-14
[patent_title] => 'Semiconductor device having a plurality of crystalline thin film transistors'
[patent_app_type] => 1
[patent_app_number] => 8/439937
[patent_app_country] => US
[patent_app_date] => 1995-05-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 4549
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/677/05677549.pdf
[firstpage_image] =>[orig_patent_app_number] => 439937
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/439937 | Semiconductor device having a plurality of crystalline thin film transistors | May 11, 1995 | Issued |
Array
(
[id] => 3665273
[patent_doc_number] => 05656857
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-12
[patent_title] => 'Semiconductor device with insulating resin layer and substrate having low sheet resistance'
[patent_app_type] => 1
[patent_app_number] => 8/439552
[patent_app_country] => US
[patent_app_date] => 1995-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 3167
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/656/05656857.pdf
[firstpage_image] =>[orig_patent_app_number] => 439552
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/439552 | Semiconductor device with insulating resin layer and substrate having low sheet resistance | May 10, 1995 | Issued |
Array
(
[id] => 3694430
[patent_doc_number] => 05604383
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-18
[patent_title] => 'Stabilized power supply device using a flip chip as an active component'
[patent_app_type] => 1
[patent_app_number] => 8/439579
[patent_app_country] => US
[patent_app_date] => 1995-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 16
[patent_no_of_words] => 6782
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/604/05604383.pdf
[firstpage_image] =>[orig_patent_app_number] => 439579
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/439579 | Stabilized power supply device using a flip chip as an active component | May 10, 1995 | Issued |
Array
(
[id] => 3651819
[patent_doc_number] => 05637914
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-10
[patent_title] => 'Lead frame and semiconductor device encapsulated by resin'
[patent_app_type] => 1
[patent_app_number] => 8/438467
[patent_app_country] => US
[patent_app_date] => 1995-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 20
[patent_no_of_words] => 7263
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 17
[patent_words_short_claim] => 28
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/637/05637914.pdf
[firstpage_image] =>[orig_patent_app_number] => 438467
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/438467 | Lead frame and semiconductor device encapsulated by resin | May 9, 1995 | Issued |
Array
(
[id] => 3741232
[patent_doc_number] => 05698903
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'Bond pad option for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/437811
[patent_app_country] => US
[patent_app_date] => 1995-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2691
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/698/05698903.pdf
[firstpage_image] =>[orig_patent_app_number] => 437811
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/437811 | Bond pad option for integrated circuits | May 8, 1995 | Issued |
| 08/434359 | METAL-SEMICONDUCTOR CONTACT FORMED USING NITROGEN PLASMA | May 4, 1995 | Abandoned |
Array
(
[id] => 3788794
[patent_doc_number] => 05821614
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Card type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/435465
[patent_app_country] => US
[patent_app_date] => 1995-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 30
[patent_no_of_words] => 11959
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/821/05821614.pdf
[firstpage_image] =>[orig_patent_app_number] => 435465
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/435465 | Card type semiconductor device | May 4, 1995 | Issued |
Array
(
[id] => 3740629
[patent_doc_number] => 05698863
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-16
[patent_title] => 'Optically controlled light modulator device'
[patent_app_type] => 1
[patent_app_number] => 8/434679
[patent_app_country] => US
[patent_app_date] => 1995-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3609
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/698/05698863.pdf
[firstpage_image] =>[orig_patent_app_number] => 434679
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/434679 | Optically controlled light modulator device | May 3, 1995 | Issued |
| 08/431590 | MOLDED ENCAPSULATED ELECTRONIC COMPONENT | Apr 30, 1995 | Abandoned |
Array
(
[id] => 3612439
[patent_doc_number] => 05589703
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-31
[patent_title] => 'Edge die bond semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/431217
[patent_app_country] => US
[patent_app_date] => 1995-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 3771
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/589/05589703.pdf
[firstpage_image] =>[orig_patent_app_number] => 431217
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/431217 | Edge die bond semiconductor package | Apr 27, 1995 | Issued |
Array
(
[id] => 3699425
[patent_doc_number] => 05619068
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-08
[patent_title] => 'Externally bondable overmolded package arrangements'
[patent_app_type] => 1
[patent_app_number] => 8/430665
[patent_app_country] => US
[patent_app_date] => 1995-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2101
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/619/05619068.pdf
[firstpage_image] =>[orig_patent_app_number] => 430665
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/430665 | Externally bondable overmolded package arrangements | Apr 27, 1995 | Issued |
Array
(
[id] => 3554595
[patent_doc_number] => 05572069
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-05
[patent_title] => 'Conductive epoxy grid array semiconductor packages'
[patent_app_type] => 1
[patent_app_number] => 8/429627
[patent_app_country] => US
[patent_app_date] => 1995-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 2809
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/572/05572069.pdf
[firstpage_image] =>[orig_patent_app_number] => 429627
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/429627 | Conductive epoxy grid array semiconductor packages | Apr 26, 1995 | Issued |
Array
(
[id] => 3627514
[patent_doc_number] => 05612556
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-18
[patent_title] => 'Monolithic integration of microwave silicon devices and low loss transmission lines'
[patent_app_type] => 1
[patent_app_number] => 8/427761
[patent_app_country] => US
[patent_app_date] => 1995-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 1543
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/612/05612556.pdf
[firstpage_image] =>[orig_patent_app_number] => 427761
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/427761 | Monolithic integration of microwave silicon devices and low loss transmission lines | Apr 24, 1995 | Issued |
| 08/428695 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD | Apr 24, 1995 | Abandoned |
Array
(
[id] => 3896467
[patent_doc_number] => 05834843
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-10
[patent_title] => 'Multi-chip semiconductor chip module'
[patent_app_type] => 1
[patent_app_number] => 8/427111
[patent_app_country] => US
[patent_app_date] => 1995-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 47
[patent_no_of_words] => 7105
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/834/05834843.pdf
[firstpage_image] =>[orig_patent_app_number] => 427111
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/427111 | Multi-chip semiconductor chip module | Apr 20, 1995 | Issued |