| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3710602
[patent_doc_number] => 05654570
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-05
[patent_title] => 'CMOS gate stack'
[patent_app_type] => 1
[patent_app_number] => 8/425945
[patent_app_country] => US
[patent_app_date] => 1995-04-19
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[pdf_file] => patents/05/654/05654570.pdf
[firstpage_image] =>[orig_patent_app_number] => 425945
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/425945 | CMOS gate stack | Apr 18, 1995 | Issued |
| 08/413185 | PROCESS FOR PREPARING SOLDERABLE INTEGRATED CIRCUIT LEAD FRAMES BY PLATING WITH TIN AND PALLADIUM | Mar 29, 1995 | Abandoned |
Array
(
[id] => 3654132
[patent_doc_number] => 05606181
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-25
[patent_title] => 'Edge emitting type light emitting diode array heads'
[patent_app_type] => 1
[patent_app_number] => 8/413094
[patent_app_country] => US
[patent_app_date] => 1995-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[pdf_file] => patents/05/606/05606181.pdf
[firstpage_image] =>[orig_patent_app_number] => 413094
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/413094 | Edge emitting type light emitting diode array heads | Mar 28, 1995 | Issued |
| 08/412138 | TAPE WITH SOLDER FORMS AND METHODS FOR TRANSFERRING SOLDER FORMS TO CHIP ASSEMBLIES | Mar 27, 1995 | Abandoned |
Array
(
[id] => 3571097
[patent_doc_number] => 05485037
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-16
[patent_title] => 'Semiconductor device having a thermal dissipator and electromagnetic shielding'
[patent_app_type] => 1
[patent_app_number] => 8/410381
[patent_app_country] => US
[patent_app_date] => 1995-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => patents/05/485/05485037.pdf
[firstpage_image] =>[orig_patent_app_number] => 410381
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/410381 | Semiconductor device having a thermal dissipator and electromagnetic shielding | Mar 26, 1995 | Issued |
| 08/410433 | OVERPASS MASK/INSULATOR FOR LOCAL INTERCONNECTS AND FABRICATION METHODS FOR THE SAME | Mar 22, 1995 | Abandoned |
| 08/406515 | SEMICONDUCTOR DEVICES HAVING A MESA STRUCTURE FOR IMPROVED SURFACE VOLTAGE BREAKDOWN CHARATERISTICS | Mar 16, 1995 | Abandoned |
Array
(
[id] => 3651849
[patent_doc_number] => 05629539
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-13
[patent_title] => 'Semiconductor memory device having cylindrical capacitors'
[patent_app_type] => 1
[patent_app_number] => 8/400887
[patent_app_country] => US
[patent_app_date] => 1995-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
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[pdf_file] => patents/05/629/05629539.pdf
[firstpage_image] =>[orig_patent_app_number] => 400887
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/400887 | Semiconductor memory device having cylindrical capacitors | Mar 7, 1995 | Issued |
Array
(
[id] => 3116202
[patent_doc_number] => 05465004
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-07
[patent_title] => 'Programmable semiconductor integrated circuits having fusible links'
[patent_app_type] => 1
[patent_app_number] => 8/400776
[patent_app_country] => US
[patent_app_date] => 1995-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/465/05465004.pdf
[firstpage_image] =>[orig_patent_app_number] => 400776
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/400776 | Programmable semiconductor integrated circuits having fusible links | Mar 5, 1995 | Issued |
Array
(
[id] => 3904114
[patent_doc_number] => 05751064
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-12
[patent_title] => 'Intermediate structure for integrated circuit devices'
[patent_app_type] => 1
[patent_app_number] => 8/398110
[patent_app_country] => US
[patent_app_date] => 1995-03-03
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[pdf_file] => patents/05/751/05751064.pdf
[firstpage_image] =>[orig_patent_app_number] => 398110
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/398110 | Intermediate structure for integrated circuit devices | Mar 2, 1995 | Issued |
Array
(
[id] => 3575552
[patent_doc_number] => 05539231
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-23
[patent_title] => 'Dynamic random access memory device having reduced stepped portions'
[patent_app_type] => 1
[patent_app_number] => 8/397341
[patent_app_country] => US
[patent_app_date] => 1995-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/539/05539231.pdf
[firstpage_image] =>[orig_patent_app_number] => 397341
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/397341 | Dynamic random access memory device having reduced stepped portions | Mar 1, 1995 | Issued |
Array
(
[id] => 3583817
[patent_doc_number] => 05491363
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-02-13
[patent_title] => 'Low boiling point liquid coolant cooling structure for electronic circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/396900
[patent_app_country] => US
[patent_app_date] => 1995-03-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4450
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/491/05491363.pdf
[firstpage_image] =>[orig_patent_app_number] => 396900
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/396900 | Low boiling point liquid coolant cooling structure for electronic circuit package | Feb 28, 1995 | Issued |
Array
(
[id] => 3666839
[patent_doc_number] => 05625228
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-29
[patent_title] => 'High performance semiconductor package with area array leads'
[patent_app_type] => 1
[patent_app_number] => 8/395385
[patent_app_country] => US
[patent_app_date] => 1995-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/05/625/05625228.pdf
[firstpage_image] =>[orig_patent_app_number] => 395385
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/395385 | High performance semiconductor package with area array leads | Feb 26, 1995 | Issued |
| 08/394871 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | Feb 26, 1995 | Abandoned |
Array
(
[id] => 3652932
[patent_doc_number] => 05684326
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-04
[patent_title] => 'Emitter ballast bypass for radio frequency power transistors'
[patent_app_type] => 1
[patent_app_number] => 8/393683
[patent_app_country] => US
[patent_app_date] => 1995-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/684/05684326.pdf
[firstpage_image] =>[orig_patent_app_number] => 393683
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/393683 | Emitter ballast bypass for radio frequency power transistors | Feb 23, 1995 | Issued |
| 08/393607 | DEVICE HAVING BUMPED METALLIZED MEMBERS AND A METHOD FOR BUMPING SAID MEMBERS | Feb 22, 1995 | Abandoned |
Array
(
[id] => 3721635
[patent_doc_number] => 05616961
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-01
[patent_title] => 'Structure of contact between wiring layers in semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 8/391516
[patent_app_country] => US
[patent_app_date] => 1995-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
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[pdf_file] => patents/05/616/05616961.pdf
[firstpage_image] =>[orig_patent_app_number] => 391516
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/391516 | Structure of contact between wiring layers in semiconductor integrated circuit device | Feb 20, 1995 | Issued |
Array
(
[id] => 3669041
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Semiconductor device including via hole'
[patent_app_type] => 1
[patent_app_number] => 8/390135
[patent_app_country] => US
[patent_app_date] => 1995-02-17
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[firstpage_image] =>[orig_patent_app_number] => 390135
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/390135 | Semiconductor device including via hole | Feb 16, 1995 | Issued |
Array
(
[id] => 3106564
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[patent_issue_date] => 1995-09-05
[patent_title] => 'Semiconductor flipchip packaging having a perimeter wall'
[patent_app_type] => 1
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[patent_app_date] => 1995-02-15
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[firstpage_image] =>[orig_patent_app_number] => 389743
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/389743 | Semiconductor flipchip packaging having a perimeter wall | Feb 14, 1995 | Issued |
Array
(
[id] => 3596033
[patent_doc_number] => 05488257
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-30
[patent_title] => 'Multilayer molded plastic package using mesic technology'
[patent_app_type] => 1
[patent_app_number] => 8/384629
[patent_app_country] => US
[patent_app_date] => 1995-02-06
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[firstpage_image] =>[orig_patent_app_number] => 384629
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/384629 | Multilayer molded plastic package using mesic technology | Feb 5, 1995 | Issued |