Search

Carl W. Whitehead Jr.

Examiner (ID: 6801)

Most Active Art Unit
2503
Art Unit(s)
2815, 2503, 2813
Total Applications
662
Issued Applications
472
Pending Applications
16
Abandoned Applications
174

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3710602 [patent_doc_number] => 05654570 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-05 [patent_title] => 'CMOS gate stack' [patent_app_type] => 1 [patent_app_number] => 8/425945 [patent_app_country] => US [patent_app_date] => 1995-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 4517 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/654/05654570.pdf [firstpage_image] =>[orig_patent_app_number] => 425945 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/425945
CMOS gate stack Apr 18, 1995 Issued
08/413185 PROCESS FOR PREPARING SOLDERABLE INTEGRATED CIRCUIT LEAD FRAMES BY PLATING WITH TIN AND PALLADIUM Mar 29, 1995 Abandoned
Array ( [id] => 3654132 [patent_doc_number] => 05606181 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-02-25 [patent_title] => 'Edge emitting type light emitting diode array heads' [patent_app_type] => 1 [patent_app_number] => 8/413094 [patent_app_country] => US [patent_app_date] => 1995-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 43 [patent_no_of_words] => 7774 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 19 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/606/05606181.pdf [firstpage_image] =>[orig_patent_app_number] => 413094 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/413094
Edge emitting type light emitting diode array heads Mar 28, 1995 Issued
08/412138 TAPE WITH SOLDER FORMS AND METHODS FOR TRANSFERRING SOLDER FORMS TO CHIP ASSEMBLIES Mar 27, 1995 Abandoned
Array ( [id] => 3571097 [patent_doc_number] => 05485037 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-01-16 [patent_title] => 'Semiconductor device having a thermal dissipator and electromagnetic shielding' [patent_app_type] => 1 [patent_app_number] => 8/410381 [patent_app_country] => US [patent_app_date] => 1995-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 23 [patent_no_of_words] => 8392 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/485/05485037.pdf [firstpage_image] =>[orig_patent_app_number] => 410381 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/410381
Semiconductor device having a thermal dissipator and electromagnetic shielding Mar 26, 1995 Issued
08/410433 OVERPASS MASK/INSULATOR FOR LOCAL INTERCONNECTS AND FABRICATION METHODS FOR THE SAME Mar 22, 1995 Abandoned
08/406515 SEMICONDUCTOR DEVICES HAVING A MESA STRUCTURE FOR IMPROVED SURFACE VOLTAGE BREAKDOWN CHARATERISTICS Mar 16, 1995 Abandoned
Array ( [id] => 3651849 [patent_doc_number] => 05629539 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-05-13 [patent_title] => 'Semiconductor memory device having cylindrical capacitors' [patent_app_type] => 1 [patent_app_number] => 8/400887 [patent_app_country] => US [patent_app_date] => 1995-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 58 [patent_no_of_words] => 13537 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 246 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/629/05629539.pdf [firstpage_image] =>[orig_patent_app_number] => 400887 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/400887
Semiconductor memory device having cylindrical capacitors Mar 7, 1995 Issued
Array ( [id] => 3116202 [patent_doc_number] => 05465004 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-11-07 [patent_title] => 'Programmable semiconductor integrated circuits having fusible links' [patent_app_type] => 1 [patent_app_number] => 8/400776 [patent_app_country] => US [patent_app_date] => 1995-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 3468 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/465/05465004.pdf [firstpage_image] =>[orig_patent_app_number] => 400776 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/400776
Programmable semiconductor integrated circuits having fusible links Mar 5, 1995 Issued
Array ( [id] => 3904114 [patent_doc_number] => 05751064 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Intermediate structure for integrated circuit devices' [patent_app_type] => 1 [patent_app_number] => 8/398110 [patent_app_country] => US [patent_app_date] => 1995-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 11 [patent_no_of_words] => 1683 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751064.pdf [firstpage_image] =>[orig_patent_app_number] => 398110 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/398110
Intermediate structure for integrated circuit devices Mar 2, 1995 Issued
Array ( [id] => 3575552 [patent_doc_number] => 05539231 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-07-23 [patent_title] => 'Dynamic random access memory device having reduced stepped portions' [patent_app_type] => 1 [patent_app_number] => 8/397341 [patent_app_country] => US [patent_app_date] => 1995-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 3879 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/539/05539231.pdf [firstpage_image] =>[orig_patent_app_number] => 397341 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/397341
Dynamic random access memory device having reduced stepped portions Mar 1, 1995 Issued
Array ( [id] => 3583817 [patent_doc_number] => 05491363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-02-13 [patent_title] => 'Low boiling point liquid coolant cooling structure for electronic circuit package' [patent_app_type] => 1 [patent_app_number] => 8/396900 [patent_app_country] => US [patent_app_date] => 1995-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4450 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/491/05491363.pdf [firstpage_image] =>[orig_patent_app_number] => 396900 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/396900
Low boiling point liquid coolant cooling structure for electronic circuit package Feb 28, 1995 Issued
Array ( [id] => 3666839 [patent_doc_number] => 05625228 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-29 [patent_title] => 'High performance semiconductor package with area array leads' [patent_app_type] => 1 [patent_app_number] => 8/395385 [patent_app_country] => US [patent_app_date] => 1995-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 6284 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 387 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/625/05625228.pdf [firstpage_image] =>[orig_patent_app_number] => 395385 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/395385
High performance semiconductor package with area array leads Feb 26, 1995 Issued
08/394871 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Feb 26, 1995 Abandoned
Array ( [id] => 3652932 [patent_doc_number] => 05684326 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-04 [patent_title] => 'Emitter ballast bypass for radio frequency power transistors' [patent_app_type] => 1 [patent_app_number] => 8/393683 [patent_app_country] => US [patent_app_date] => 1995-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2192 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/684/05684326.pdf [firstpage_image] =>[orig_patent_app_number] => 393683 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/393683
Emitter ballast bypass for radio frequency power transistors Feb 23, 1995 Issued
08/393607 DEVICE HAVING BUMPED METALLIZED MEMBERS AND A METHOD FOR BUMPING SAID MEMBERS Feb 22, 1995 Abandoned
Array ( [id] => 3721635 [patent_doc_number] => 05616961 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-01 [patent_title] => 'Structure of contact between wiring layers in semiconductor integrated circuit device' [patent_app_type] => 1 [patent_app_number] => 8/391516 [patent_app_country] => US [patent_app_date] => 1995-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 40 [patent_no_of_words] => 5900 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/616/05616961.pdf [firstpage_image] =>[orig_patent_app_number] => 391516 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/391516
Structure of contact between wiring layers in semiconductor integrated circuit device Feb 20, 1995 Issued
Array ( [id] => 3669041 [patent_doc_number] => 05668413 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-16 [patent_title] => 'Semiconductor device including via hole' [patent_app_type] => 1 [patent_app_number] => 8/390135 [patent_app_country] => US [patent_app_date] => 1995-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4289 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/668/05668413.pdf [firstpage_image] =>[orig_patent_app_number] => 390135 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/390135
Semiconductor device including via hole Feb 16, 1995 Issued
Array ( [id] => 3106564 [patent_doc_number] => 05448114 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-09-05 [patent_title] => 'Semiconductor flipchip packaging having a perimeter wall' [patent_app_type] => 1 [patent_app_number] => 8/389743 [patent_app_country] => US [patent_app_date] => 1995-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 32 [patent_no_of_words] => 8697 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 266 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/448/05448114.pdf [firstpage_image] =>[orig_patent_app_number] => 389743 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/389743
Semiconductor flipchip packaging having a perimeter wall Feb 14, 1995 Issued
Array ( [id] => 3596033 [patent_doc_number] => 05488257 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-01-30 [patent_title] => 'Multilayer molded plastic package using mesic technology' [patent_app_type] => 1 [patent_app_number] => 8/384629 [patent_app_country] => US [patent_app_date] => 1995-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 16 [patent_no_of_words] => 3070 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/488/05488257.pdf [firstpage_image] =>[orig_patent_app_number] => 384629 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/384629
Multilayer molded plastic package using mesic technology Feb 5, 1995 Issued
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