| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3485641
[patent_doc_number] => 05406125
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-11
[patent_title] => 'Semiconductor device having a metalized via hole'
[patent_app_type] => 1
[patent_app_number] => 8/000227
[patent_app_country] => US
[patent_app_date] => 1993-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3629
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[pdf_file] => patents/05/406/05406125.pdf
[firstpage_image] =>[orig_patent_app_number] => 000227
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/000227 | Semiconductor device having a metalized via hole | Apr 14, 1993 | Issued |
| 08/048888 | SEMICONDUCTOR DEVICE HAVING A THERMAL DISSIPATOR AND ELECTROMAGNETIC SHIELDING | Apr 11, 1993 | Pending |
Array
(
[id] => 3124289
[patent_doc_number] => 05381038
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-10
[patent_title] => 'Semiconductor device having passivation protrusions defining electrical bonding area'
[patent_app_type] => 1
[patent_app_number] => 8/047612
[patent_app_country] => US
[patent_app_date] => 1993-04-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 23
[patent_no_of_words] => 4487
[patent_no_of_claims] => 20
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[patent_words_short_claim] => 149
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/381/05381038.pdf
[firstpage_image] =>[orig_patent_app_number] => 047612
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/047612 | Semiconductor device having passivation protrusions defining electrical bonding area | Apr 7, 1993 | Issued |
| 08/043447 | MONOLITHIC INTEGRATED SENSOR CIRCUIT IN CMOS TECHNOLOGY | Apr 1, 1993 | Pending |
Array
(
[id] => 3024997
[patent_doc_number] => 05289034
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-02-22
[patent_title] => 'IC package having replaceable backup battery'
[patent_app_type] => 1
[patent_app_number] => 8/034584
[patent_app_country] => US
[patent_app_date] => 1993-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3699
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 229
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/289/05289034.pdf
[firstpage_image] =>[orig_patent_app_number] => 034584
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/034584 | IC package having replaceable backup battery | Mar 21, 1993 | Issued |
| 08/030619 | SEMICONDUCTOR DEVICE HAVING A MULTILAYERED WIRING STRUCTURE WITH DUMMY WIRING | Mar 11, 1993 | Pending |
| 08/033065 | P-I-N- PHOTODIODE WITH TRANSPARENT CONDUCTOR N+LAYER | Mar 9, 1993 | Pending |
| 08/027985 | MICRO METAL-WIRING STRUCTURE HABING STRESS INDUCED MIGRATION RESISTANCE | Mar 7, 1993 | Pending |
Array
(
[id] => 3493829
[patent_doc_number] => 05471090
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-28
[patent_title] => 'Electronic structures having a joining geometry providing reduced capacitive loading'
[patent_app_type] => 1
[patent_app_number] => 8/028023
[patent_app_country] => US
[patent_app_date] => 1993-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 15
[patent_no_of_words] => 4990
[patent_no_of_claims] => 24
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/471/05471090.pdf
[firstpage_image] =>[orig_patent_app_number] => 028023
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/028023 | Electronic structures having a joining geometry providing reduced capacitive loading | Mar 7, 1993 | Issued |
Array
(
[id] => 3487169
[patent_doc_number] => 05446317
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-29
[patent_title] => 'Single in-line package for surface mounting'
[patent_app_type] => 1
[patent_app_number] => 8/026809
[patent_app_country] => US
[patent_app_date] => 1993-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 4379
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/446/05446317.pdf
[firstpage_image] =>[orig_patent_app_number] => 026809
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/026809 | Single in-line package for surface mounting | Mar 4, 1993 | Issued |
Array
(
[id] => 3453124
[patent_doc_number] => 05424573
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-13
[patent_title] => 'Semiconductor package having optical interconnection access'
[patent_app_type] => 1
[patent_app_number] => 8/026037
[patent_app_country] => US
[patent_app_date] => 1993-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 8439
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/424/05424573.pdf
[firstpage_image] =>[orig_patent_app_number] => 026037
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/026037 | Semiconductor package having optical interconnection access | Mar 3, 1993 | Issued |
| 08/025462 | SEMICONDUCTOR INTEGRATED CIRCUIT | Mar 2, 1993 | Abandoned |
Array
(
[id] => 3049727
[patent_doc_number] => 05287003
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-02-15
[patent_title] => 'Resin-encapsulated semiconductor device having a passivation reinforcement hard polyimide film'
[patent_app_type] => 1
[patent_app_number] => 8/024918
[patent_app_country] => US
[patent_app_date] => 1993-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 2448
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/287/05287003.pdf
[firstpage_image] =>[orig_patent_app_number] => 024918
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/024918 | Resin-encapsulated semiconductor device having a passivation reinforcement hard polyimide film | Mar 1, 1993 | Issued |
Array
(
[id] => 3031951
[patent_doc_number] => 05317194
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-05-31
[patent_title] => 'Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink'
[patent_app_type] => 1
[patent_app_number] => 8/023862
[patent_app_country] => US
[patent_app_date] => 1993-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1574
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/317/05317194.pdf
[firstpage_image] =>[orig_patent_app_number] => 023862
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/023862 | Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink | Feb 24, 1993 | Issued |
| 08/021688 | MEMORY CARD HAVING TWO TYPES OF MEMORY INTEGRATED CIRCUITS CONNECTED TO RESPECTIVE CONNECTORS | Feb 23, 1993 | Abandoned |
Array
(
[id] => 4019579
[patent_doc_number] => 05880483
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-09
[patent_title] => 'Semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/026222
[patent_app_country] => US
[patent_app_date] => 1993-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 3926
[patent_no_of_claims] => 9
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/880/05880483.pdf
[firstpage_image] =>[orig_patent_app_number] => 026222
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/026222 | Semiconductor devices | Feb 22, 1993 | Issued |
Array
(
[id] => 3515011
[patent_doc_number] => 05563441
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Lead frame assembly including a semiconductor device and a resistance wire'
[patent_app_type] => 1
[patent_app_number] => 8/021063
[patent_app_country] => US
[patent_app_date] => 1993-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 2133
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 80
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563441.pdf
[firstpage_image] =>[orig_patent_app_number] => 021063
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/021063 | Lead frame assembly including a semiconductor device and a resistance wire | Feb 22, 1993 | Issued |
| 08/012655 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | Feb 2, 1993 | Abandoned |
| 08/011775 | COOLING STRUCTURE FOR ELECTRONIC CIRCUIT PACKAGE | Jan 31, 1993 | Abandoned |
Array
(
[id] => 3075877
[patent_doc_number] => 05336927
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-09
[patent_title] => 'Lead frame having electrically insulating tapes adhered to the inner leads'
[patent_app_type] => 1
[patent_app_number] => 8/008741
[patent_app_country] => US
[patent_app_date] => 1993-01-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 1627
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/336/05336927.pdf
[firstpage_image] =>[orig_patent_app_number] => 008741
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/008741 | Lead frame having electrically insulating tapes adhered to the inner leads | Jan 24, 1993 | Issued |
