| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3125977
[patent_doc_number] => 05384480
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-24
[patent_title] => 'Clear-mold solid-state imaging device using a charge coupled device'
[patent_app_type] => 1
[patent_app_number] => 8/006923
[patent_app_country] => US
[patent_app_date] => 1993-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2956
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[pdf_file] => patents/05/384/05384480.pdf
[firstpage_image] =>[orig_patent_app_number] => 006923
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/006923 | Clear-mold solid-state imaging device using a charge coupled device | Jan 21, 1993 | Issued |
Array
(
[id] => 3087308
[patent_doc_number] => 05280191
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-18
[patent_title] => 'Lightwave packaging for pairs of optical devices having thermal dissipation means'
[patent_app_type] => 1
[patent_app_number] => 8/001931
[patent_app_country] => US
[patent_app_date] => 1993-01-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2541
[patent_no_of_claims] => 8
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[patent_words_short_claim] => 70
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/280/05280191.pdf
[firstpage_image] =>[orig_patent_app_number] => 001931
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/001931 | Lightwave packaging for pairs of optical devices having thermal dissipation means | Jan 6, 1993 | Issued |
Array
(
[id] => 3034467
[patent_doc_number] => 05343073
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-30
[patent_title] => 'Lead frames having a chromium and zinc alloy coating'
[patent_app_type] => 1
[patent_app_number] => 8/001014
[patent_app_country] => US
[patent_app_date] => 1993-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4757
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 44
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/343/05343073.pdf
[firstpage_image] =>[orig_patent_app_number] => 001014
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/001014 | Lead frames having a chromium and zinc alloy coating | Jan 5, 1993 | Issued |
Array
(
[id] => 2959537
[patent_doc_number] => 05243221
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-07
[patent_title] => 'Aluminum metallization doped with iron and copper to prevent electromigration'
[patent_app_type] => 1
[patent_app_number] => 8/001203
[patent_app_country] => US
[patent_app_date] => 1993-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1822
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/243/05243221.pdf
[firstpage_image] =>[orig_patent_app_number] => 001203
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/001203 | Aluminum metallization doped with iron and copper to prevent electromigration | Jan 4, 1993 | Issued |
Array
(
[id] => 3432229
[patent_doc_number] => 05455457
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-03
[patent_title] => 'Package for semiconductor elements having thermal dissipation means'
[patent_app_type] => 1
[patent_app_number] => 8/000596
[patent_app_country] => US
[patent_app_date] => 1993-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 3626
[patent_no_of_claims] => 24
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/455/05455457.pdf
[firstpage_image] =>[orig_patent_app_number] => 000596
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/000596 | Package for semiconductor elements having thermal dissipation means | Jan 4, 1993 | Issued |
Array
(
[id] => 3040863
[patent_doc_number] => 05373172
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-12-13
[patent_title] => 'Semiconducting diamond light-emitting element'
[patent_app_type] => 1
[patent_app_number] => 8/000544
[patent_app_country] => US
[patent_app_date] => 1993-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/05/373/05373172.pdf
[firstpage_image] =>[orig_patent_app_number] => 000544
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/000544 | Semiconducting diamond light-emitting element | Jan 3, 1993 | Issued |
Array
(
[id] => 4010030
[patent_doc_number] => 05859455
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-12
[patent_title] => 'Non-volatile semiconductor memory cell with control gate and floating gate and select gate located above the channel'
[patent_app_type] => 1
[patent_app_number] => 7/999609
[patent_app_country] => US
[patent_app_date] => 1992-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 20
[patent_no_of_words] => 4171
[patent_no_of_claims] => 14
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[patent_words_short_claim] => 188
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/859/05859455.pdf
[firstpage_image] =>[orig_patent_app_number] => 999609
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/999609 | Non-volatile semiconductor memory cell with control gate and floating gate and select gate located above the channel | Dec 30, 1992 | Issued |
Array
(
[id] => 3079865
[patent_doc_number] => 05323025
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-06-21
[patent_title] => 'Pyroelectric IR-sensor having a low thermal conductive ceramic substrate'
[patent_app_type] => 1
[patent_app_number] => 7/998891
[patent_app_country] => US
[patent_app_date] => 1992-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 1963
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 212
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/323/05323025.pdf
[firstpage_image] =>[orig_patent_app_number] => 998891
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/998891 | Pyroelectric IR-sensor having a low thermal conductive ceramic substrate | Dec 28, 1992 | Issued |
| 07/991229 | SEMICONDUCTOR DEVICE HAVING A PATTERNED METAL LAYER | Dec 15, 1992 | Abandoned |
Array
(
[id] => 2982858
[patent_doc_number] => 05252852
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-12
[patent_title] => 'Semiconductor device having flip chip bonding pads matched with pin photodiodes in a symmetrical layout configuration'
[patent_app_type] => 1
[patent_app_number] => 7/989877
[patent_app_country] => US
[patent_app_date] => 1992-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
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[patent_no_of_words] => 7068
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[pdf_file] => patents/05/252/05252852.pdf
[firstpage_image] =>[orig_patent_app_number] => 989877
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/989877 | Semiconductor device having flip chip bonding pads matched with pin photodiodes in a symmetrical layout configuration | Dec 10, 1992 | Issued |
Array
(
[id] => 3068692
[patent_doc_number] => 05311056
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-05-10
[patent_title] => 'Semiconductor device having a bi-level leadframe'
[patent_app_type] => 1
[patent_app_number] => 7/989954
[patent_app_country] => US
[patent_app_date] => 1992-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2153
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[pdf_file] => patents/05/311/05311056.pdf
[firstpage_image] =>[orig_patent_app_number] => 989954
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/989954 | Semiconductor device having a bi-level leadframe | Dec 9, 1992 | Issued |
Array
(
[id] => 2896644
[patent_doc_number] => 05270566
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-12-14
[patent_title] => 'Insulated gate semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/989958
[patent_app_country] => US
[patent_app_date] => 1992-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 1739
[patent_no_of_claims] => 3
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[pdf_file] => patents/05/270/05270566.pdf
[firstpage_image] =>[orig_patent_app_number] => 989958
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/989958 | Insulated gate semiconductor device | Dec 9, 1992 | Issued |
Array
(
[id] => 3484640
[patent_doc_number] => 05457340
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-10
[patent_title] => 'Leadframe with power and ground planes'
[patent_app_type] => 1
[patent_app_number] => 7/986951
[patent_app_country] => US
[patent_app_date] => 1992-12-07
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[pdf_file] => patents/05/457/05457340.pdf
[firstpage_image] =>[orig_patent_app_number] => 986951
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/986951 | Leadframe with power and ground planes | Dec 6, 1992 | Issued |
Array
(
[id] => 2973683
[patent_doc_number] => 05258648
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-02
[patent_title] => 'Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery'
[patent_app_type] => 1
[patent_app_number] => 7/982404
[patent_app_country] => US
[patent_app_date] => 1992-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/258/05258648.pdf
[firstpage_image] =>[orig_patent_app_number] => 982404
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/982404 | Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery | Nov 26, 1992 | Issued |
| 07/981927 | HIGH POWER DISSIPATION PLASTIC ENCAPSULATED PACKAGE FOR INTEGRATED CIRCUIT DIE | Nov 23, 1992 | Abandoned |
Array
(
[id] => 3012585
[patent_doc_number] => 05355017
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-10-11
[patent_title] => 'Lead frame having a die pad with metal foil layers attached to the surfaces'
[patent_app_type] => 1
[patent_app_number] => 7/979489
[patent_app_country] => US
[patent_app_date] => 1992-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 20
[patent_no_of_words] => 6917
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/355/05355017.pdf
[firstpage_image] =>[orig_patent_app_number] => 979489
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/979489 | Lead frame having a die pad with metal foil layers attached to the surfaces | Nov 19, 1992 | Issued |
| 07/976708 | A LEAD FRAME FOR A PACKAGE SEALED BY RESIN, AND A SEMICONDUCTOR DEVICE HAVING THE FRAME AND A METAL SUBSTRATE MOLDED WITH RESIN | Nov 15, 1992 | Abandoned |
Array
(
[id] => 3100492
[patent_doc_number] => 05293070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-08
[patent_title] => 'Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules'
[patent_app_type] => 1
[patent_app_number] => 7/973603
[patent_app_country] => US
[patent_app_date] => 1992-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/05/293/05293070.pdf
[firstpage_image] =>[orig_patent_app_number] => 973603
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/973603 | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules | Nov 8, 1992 | Issued |
Array
(
[id] => 3033480
[patent_doc_number] => 05349240
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-09-20
[patent_title] => 'Semiconductor device package having a sealing silicone gel with spherical fillers'
[patent_app_type] => 1
[patent_app_number] => 7/965919
[patent_app_country] => US
[patent_app_date] => 1992-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/349/05349240.pdf
[firstpage_image] =>[orig_patent_app_number] => 965919
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/965919 | Semiconductor device package having a sealing silicone gel with spherical fillers | Oct 25, 1992 | Issued |
Array
(
[id] => 3038140
[patent_doc_number] => 05329158
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-07-12
[patent_title] => 'Surface mountable semiconductor device having self loaded solder joints'
[patent_app_type] => 1
[patent_app_number] => 7/964488
[patent_app_country] => US
[patent_app_date] => 1992-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/329/05329158.pdf
[firstpage_image] =>[orig_patent_app_number] => 964488
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/964488 | Surface mountable semiconductor device having self loaded solder joints | Oct 20, 1992 | Issued |