Search

Carl W. Whitehead Jr.

Examiner (ID: 6801)

Most Active Art Unit
2503
Art Unit(s)
2815, 2503, 2813
Total Applications
662
Issued Applications
472
Pending Applications
16
Abandoned Applications
174

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3125977 [patent_doc_number] => 05384480 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-01-24 [patent_title] => 'Clear-mold solid-state imaging device using a charge coupled device' [patent_app_type] => 1 [patent_app_number] => 8/006923 [patent_app_country] => US [patent_app_date] => 1993-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2956 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/384/05384480.pdf [firstpage_image] =>[orig_patent_app_number] => 006923 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/006923
Clear-mold solid-state imaging device using a charge coupled device Jan 21, 1993 Issued
Array ( [id] => 3087308 [patent_doc_number] => 05280191 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-01-18 [patent_title] => 'Lightwave packaging for pairs of optical devices having thermal dissipation means' [patent_app_type] => 1 [patent_app_number] => 8/001931 [patent_app_country] => US [patent_app_date] => 1993-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2541 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/280/05280191.pdf [firstpage_image] =>[orig_patent_app_number] => 001931 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/001931
Lightwave packaging for pairs of optical devices having thermal dissipation means Jan 6, 1993 Issued
Array ( [id] => 3034467 [patent_doc_number] => 05343073 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-08-30 [patent_title] => 'Lead frames having a chromium and zinc alloy coating' [patent_app_type] => 1 [patent_app_number] => 8/001014 [patent_app_country] => US [patent_app_date] => 1993-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4757 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/343/05343073.pdf [firstpage_image] =>[orig_patent_app_number] => 001014 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/001014
Lead frames having a chromium and zinc alloy coating Jan 5, 1993 Issued
Array ( [id] => 2959537 [patent_doc_number] => 05243221 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-09-07 [patent_title] => 'Aluminum metallization doped with iron and copper to prevent electromigration' [patent_app_type] => 1 [patent_app_number] => 8/001203 [patent_app_country] => US [patent_app_date] => 1993-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1822 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/243/05243221.pdf [firstpage_image] =>[orig_patent_app_number] => 001203 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/001203
Aluminum metallization doped with iron and copper to prevent electromigration Jan 4, 1993 Issued
Array ( [id] => 3432229 [patent_doc_number] => 05455457 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-03 [patent_title] => 'Package for semiconductor elements having thermal dissipation means' [patent_app_type] => 1 [patent_app_number] => 8/000596 [patent_app_country] => US [patent_app_date] => 1993-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3626 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/455/05455457.pdf [firstpage_image] =>[orig_patent_app_number] => 000596 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/000596
Package for semiconductor elements having thermal dissipation means Jan 4, 1993 Issued
Array ( [id] => 3040863 [patent_doc_number] => 05373172 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-12-13 [patent_title] => 'Semiconducting diamond light-emitting element' [patent_app_type] => 1 [patent_app_number] => 8/000544 [patent_app_country] => US [patent_app_date] => 1993-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2284 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/373/05373172.pdf [firstpage_image] =>[orig_patent_app_number] => 000544 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/000544
Semiconducting diamond light-emitting element Jan 3, 1993 Issued
Array ( [id] => 4010030 [patent_doc_number] => 05859455 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-12 [patent_title] => 'Non-volatile semiconductor memory cell with control gate and floating gate and select gate located above the channel' [patent_app_type] => 1 [patent_app_number] => 7/999609 [patent_app_country] => US [patent_app_date] => 1992-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 4171 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/859/05859455.pdf [firstpage_image] =>[orig_patent_app_number] => 999609 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/999609
Non-volatile semiconductor memory cell with control gate and floating gate and select gate located above the channel Dec 30, 1992 Issued
Array ( [id] => 3079865 [patent_doc_number] => 05323025 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-06-21 [patent_title] => 'Pyroelectric IR-sensor having a low thermal conductive ceramic substrate' [patent_app_type] => 1 [patent_app_number] => 7/998891 [patent_app_country] => US [patent_app_date] => 1992-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 1963 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/323/05323025.pdf [firstpage_image] =>[orig_patent_app_number] => 998891 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/998891
Pyroelectric IR-sensor having a low thermal conductive ceramic substrate Dec 28, 1992 Issued
07/991229 SEMICONDUCTOR DEVICE HAVING A PATTERNED METAL LAYER Dec 15, 1992 Abandoned
Array ( [id] => 2982858 [patent_doc_number] => 05252852 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-12 [patent_title] => 'Semiconductor device having flip chip bonding pads matched with pin photodiodes in a symmetrical layout configuration' [patent_app_type] => 1 [patent_app_number] => 7/989877 [patent_app_country] => US [patent_app_date] => 1992-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 21 [patent_no_of_words] => 7068 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/252/05252852.pdf [firstpage_image] =>[orig_patent_app_number] => 989877 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/989877
Semiconductor device having flip chip bonding pads matched with pin photodiodes in a symmetrical layout configuration Dec 10, 1992 Issued
Array ( [id] => 3068692 [patent_doc_number] => 05311056 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-05-10 [patent_title] => 'Semiconductor device having a bi-level leadframe' [patent_app_type] => 1 [patent_app_number] => 7/989954 [patent_app_country] => US [patent_app_date] => 1992-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2153 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/311/05311056.pdf [firstpage_image] =>[orig_patent_app_number] => 989954 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/989954
Semiconductor device having a bi-level leadframe Dec 9, 1992 Issued
Array ( [id] => 2896644 [patent_doc_number] => 05270566 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-14 [patent_title] => 'Insulated gate semiconductor device' [patent_app_type] => 1 [patent_app_number] => 7/989958 [patent_app_country] => US [patent_app_date] => 1992-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1739 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/270/05270566.pdf [firstpage_image] =>[orig_patent_app_number] => 989958 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/989958
Insulated gate semiconductor device Dec 9, 1992 Issued
Array ( [id] => 3484640 [patent_doc_number] => 05457340 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-10 [patent_title] => 'Leadframe with power and ground planes' [patent_app_type] => 1 [patent_app_number] => 7/986951 [patent_app_country] => US [patent_app_date] => 1992-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5206 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/457/05457340.pdf [firstpage_image] =>[orig_patent_app_number] => 986951 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/986951
Leadframe with power and ground planes Dec 6, 1992 Issued
Array ( [id] => 2973683 [patent_doc_number] => 05258648 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-02 [patent_title] => 'Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery' [patent_app_type] => 1 [patent_app_number] => 7/982404 [patent_app_country] => US [patent_app_date] => 1992-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 4574 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/258/05258648.pdf [firstpage_image] =>[orig_patent_app_number] => 982404 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/982404
Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery Nov 26, 1992 Issued
07/981927 HIGH POWER DISSIPATION PLASTIC ENCAPSULATED PACKAGE FOR INTEGRATED CIRCUIT DIE Nov 23, 1992 Abandoned
Array ( [id] => 3012585 [patent_doc_number] => 05355017 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-10-11 [patent_title] => 'Lead frame having a die pad with metal foil layers attached to the surfaces' [patent_app_type] => 1 [patent_app_number] => 7/979489 [patent_app_country] => US [patent_app_date] => 1992-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 6917 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/355/05355017.pdf [firstpage_image] =>[orig_patent_app_number] => 979489 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/979489
Lead frame having a die pad with metal foil layers attached to the surfaces Nov 19, 1992 Issued
07/976708 A LEAD FRAME FOR A PACKAGE SEALED BY RESIN, AND A SEMICONDUCTOR DEVICE HAVING THE FRAME AND A METAL SUBSTRATE MOLDED WITH RESIN Nov 15, 1992 Abandoned
Array ( [id] => 3100492 [patent_doc_number] => 05293070 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-08 [patent_title] => 'Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules' [patent_app_type] => 1 [patent_app_number] => 7/973603 [patent_app_country] => US [patent_app_date] => 1992-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3954 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/293/05293070.pdf [firstpage_image] =>[orig_patent_app_number] => 973603 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/973603
Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules Nov 8, 1992 Issued
Array ( [id] => 3033480 [patent_doc_number] => 05349240 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-20 [patent_title] => 'Semiconductor device package having a sealing silicone gel with spherical fillers' [patent_app_type] => 1 [patent_app_number] => 7/965919 [patent_app_country] => US [patent_app_date] => 1992-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 2577 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/349/05349240.pdf [firstpage_image] =>[orig_patent_app_number] => 965919 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/965919
Semiconductor device package having a sealing silicone gel with spherical fillers Oct 25, 1992 Issued
Array ( [id] => 3038140 [patent_doc_number] => 05329158 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-07-12 [patent_title] => 'Surface mountable semiconductor device having self loaded solder joints' [patent_app_type] => 1 [patent_app_number] => 7/964488 [patent_app_country] => US [patent_app_date] => 1992-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3974 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/329/05329158.pdf [firstpage_image] =>[orig_patent_app_number] => 964488 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/964488
Surface mountable semiconductor device having self loaded solder joints Oct 20, 1992 Issued
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