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Carl W. Whitehead Jr.

Examiner (ID: 6801)

Most Active Art Unit
2503
Art Unit(s)
2815, 2503, 2813
Total Applications
662
Issued Applications
472
Pending Applications
16
Abandoned Applications
174
Applications
StatisticsSubscription-Only

Applications

Application numberTitle of the applicationFiling DateStatus
07/920164 ELECTRON EMITTING SEMICONDUCTOR DEVICE Jul 26, 1992 Abandoned
07/914275 MULTI-STAGE MICRO-ENCAPSULATION IC PROCESS AND A MICRO-ENCAPSULATED IC WITH A TOWER OF BONDED GOLD BALLS AT EACH BOND PAD SITE Jul 14, 1992 Abandoned
07/913319 PAD ARRAY SEMICONDUCTOR DEVICE HAVING A HEAT SINK WITH DIE RECEIVING CAVITY Jul 14, 1992 Abandoned
Array ( [id] => 2959518 [patent_doc_number] => 05243220 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-09-07 [patent_title] => 'Semiconductor device having miniaturized contact electrode and wiring structure' [patent_app_type] => 1 [patent_app_number] => 7/912216 [patent_app_country] => US [patent_app_date] => 1992-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2397 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/243/05243220.pdf [firstpage_image] =>[orig_patent_app_number] => 912216 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/912216 		Semiconductor device having miniaturized contact electrode and wiring structure Jul 9, 1992 Issued
07/904684 STRESS-FREE SEMICONDUCTOR LEADFRAME DESIGN Jun 25, 1992 Abandoned
Array ( [id] => 3051887 [patent_doc_number] => 05304842 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-04-19 [patent_title] => 'Dissimilar adhesive die attach for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/904785 [patent_app_country] => US [patent_app_date] => 1992-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2944 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/304/05304842.pdf [firstpage_image] =>[orig_patent_app_number] => 904785 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/904785 		Dissimilar adhesive die attach for semiconductor devices Jun 25, 1992 Issued
07/900869 CMOS TRANSISTOR WITH TWO-LAYER INVERSE-T TUNGSTEN GATE STRUCTURE Jun 17, 1992 Abandoned
Array ( [id] => 3017638 [patent_doc_number] => 05309027 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-05-03 [patent_title] => 'Encapsulated semiconductor package having protectant circular insulators' [patent_app_type] => 1 [patent_app_number] => 7/898641 [patent_app_country] => US [patent_app_date] => 1992-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1466 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/309/05309027.pdf [firstpage_image] =>[orig_patent_app_number] => 898641 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/898641 		Encapsulated semiconductor package having protectant circular insulators Jun 14, 1992 Issued
Array ( [id] => 3487126 [patent_doc_number] => 05446314 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-29 [patent_title] => 'Low profile metal-ceramic-metal packaging' [patent_app_type] => 1 [patent_app_number] => 8/157721 [patent_app_country] => US [patent_app_date] => 1992-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3709 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/446/05446314.pdf [firstpage_image] =>[orig_patent_app_number] => 157721 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/157721 		Low profile metal-ceramic-metal packaging Jun 8, 1992 Issued
07/895995 INTEGRATED CIRCUIT PACKAGE Jun 7, 1992 Abandoned
Array ( [id] => 3761334 [patent_doc_number] => 05721453 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-24 [patent_title] => 'Integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 7/895990 [patent_app_country] => US [patent_app_date] => 1992-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2192 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/721/05721453.pdf [firstpage_image] =>[orig_patent_app_number] => 895990 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/895990 		Integrated circuit package Jun 7, 1992 Issued
07/894031 MULTI-LAYER TAB TAPE HAVING DISTINCT SIGNAL, POWER AND GROUND PLANES, SEMICONDUCTOR DEVICE ASSEMBLY EMPLOYING SAME, APPARATUS FOR AND METHOD OF ASSEMBLING SAME Jun 3, 1992 Abandoned
Array ( [id] => 3049722 [patent_doc_number] => 05287002 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-15 [patent_title] => 'Planar multi-layer metal bonding pad' [patent_app_type] => 1 [patent_app_number] => 7/889807 [patent_app_country] => US [patent_app_date] => 1992-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2568 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/287/05287002.pdf [firstpage_image] =>[orig_patent_app_number] => 889807 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/889807 		Planar multi-layer metal bonding pad May 28, 1992 Issued
07/887515 LOW RESISTANCE SILICIDED SUBSTRATE CONTACT May 20, 1992 Abandoned
07/884815 SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE May 17, 1992 Abandoned
07/883119 HETERO-JUNCTION BI-POLAR TRANSISTOR May 13, 1992 Abandoned
07/881097 METALLIZATION COMPOSITE HAVING NICKEL INTERMEDIATE/INTERFACE May 10, 1992 Abandoned
Array ( [id] => 2896448 [patent_doc_number] => 05270555 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-14 [patent_title] => 'Pyroelectric IR-sensor with a molded inter connection device substrate having a low thermal conductivity coefficient' [patent_app_type] => 1 [patent_app_number] => 7/879473 [patent_app_country] => US [patent_app_date] => 1992-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2073 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/270/05270555.pdf [firstpage_image] =>[orig_patent_app_number] => 879473 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/879473 		Pyroelectric IR-sensor with a molded inter connection device substrate having a low thermal conductivity coefficient May 6, 1992 Issued
07/877723 DIELECTRICS DIVIDING WAFER May 3, 1992 Abandoned
07/876097 HIGH-DENSITY SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF Apr 29, 1992 Abandoned
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