Search

Carl W. Whitehead Jr.

Examiner (ID: 6801)

Most Active Art Unit
2503
Art Unit(s)
2815, 2503, 2813
Total Applications
662
Issued Applications
472
Pending Applications
16
Abandoned Applications
174

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2845360 [patent_doc_number] => 05161000 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-11-03 [patent_title] => 'High-frequency thick-film semiconductor circuit' [patent_app_type] => 1 [patent_app_number] => 7/643099 [patent_app_country] => US [patent_app_date] => 1991-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 1532 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 279 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/161/05161000.pdf [firstpage_image] =>[orig_patent_app_number] => 643099 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/643099
High-frequency thick-film semiconductor circuit Jan 21, 1991 Issued
Array ( [id] => 2782828 [patent_doc_number] => 05132779 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-07-21 [patent_title] => 'Housing for semiconductor device with occlusion gas removed' [patent_app_type] => 1 [patent_app_number] => 7/641499 [patent_app_country] => US [patent_app_date] => 1991-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 4114 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/132/05132779.pdf [firstpage_image] =>[orig_patent_app_number] => 641499 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/641499
Housing for semiconductor device with occlusion gas removed Jan 14, 1991 Issued
07/638487 ELECTRONIC PACKAGING SHAPED BEAM LEAD FABRICATION Jan 3, 1991 Abandoned
Array ( [id] => 3596129 [patent_doc_number] => 05521425 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-28 [patent_title] => 'Tape automated bonded (TAB) circuit' [patent_app_type] => 1 [patent_app_number] => 7/633591 [patent_app_country] => US [patent_app_date] => 1990-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 3079 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 258 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/521/05521425.pdf [firstpage_image] =>[orig_patent_app_number] => 633591 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/633591
Tape automated bonded (TAB) circuit Dec 20, 1990 Issued
Array ( [id] => 2756330 [patent_doc_number] => 05031028 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-07-09 [patent_title] => 'Heat sink assembly' [patent_app_type] => 1 [patent_app_number] => 7/633154 [patent_app_country] => US [patent_app_date] => 1990-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3734 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/031/05031028.pdf [firstpage_image] =>[orig_patent_app_number] => 633154 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/633154
Heat sink assembly Dec 20, 1990 Issued
Array ( [id] => 2904763 [patent_doc_number] => 05218215 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-08 [patent_title] => 'Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path' [patent_app_type] => 1 [patent_app_number] => 7/630113 [patent_app_country] => US [patent_app_date] => 1990-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4297 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/218/05218215.pdf [firstpage_image] =>[orig_patent_app_number] => 630113 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/630113
Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path Dec 18, 1990 Issued
Array ( [id] => 2862377 [patent_doc_number] => 05113241 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-12 [patent_title] => 'Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles' [patent_app_type] => 1 [patent_app_number] => 7/627573 [patent_app_country] => US [patent_app_date] => 1990-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2179 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/113/05113241.pdf [firstpage_image] =>[orig_patent_app_number] => 627573 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/627573
Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles Dec 13, 1990 Issued
07/627413 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Dec 13, 1990 Abandoned
07/625410 SEMICONDUCTOR LEAD FRAME Dec 10, 1990 Abandoned
Array ( [id] => 2964047 [patent_doc_number] => 05198695 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-03-30 [patent_title] => 'Semiconductor wafer with circuits bonded to a substrate' [patent_app_type] => 1 [patent_app_number] => 7/624783 [patent_app_country] => US [patent_app_date] => 1990-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2516 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/198/05198695.pdf [firstpage_image] =>[orig_patent_app_number] => 624783 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/624783
Semiconductor wafer with circuits bonded to a substrate Dec 9, 1990 Issued
07/622284 SEMICONDUCTOR DEVICE HAVING PIN PHOTODIODES Dec 6, 1990 Abandoned
Array ( [id] => 2811849 [patent_doc_number] => 05115300 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-19 [patent_title] => 'High-power semiconductor device' [patent_app_type] => 1 [patent_app_number] => 7/622591 [patent_app_country] => US [patent_app_date] => 1990-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2359 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/115/05115300.pdf [firstpage_image] =>[orig_patent_app_number] => 622591 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/622591
High-power semiconductor device Dec 4, 1990 Issued
07/622059 SEMICONDUCTOR DEVICE HAVING A PAD ARRAY CARRIER PACKAGE Dec 3, 1990 Abandoned
07/620871 SEMICONDUCTOR PACKAGE HAVING ISOLATED HEATSINK BONDING PADS Dec 2, 1990 Abandoned
Array ( [id] => 2741251 [patent_doc_number] => 05051813 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-09-24 [patent_title] => 'Plastic-packaged semiconductor device having lead support and alignment structure' [patent_app_type] => 1 [patent_app_number] => 7/619108 [patent_app_country] => US [patent_app_date] => 1990-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2371 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/051/05051813.pdf [firstpage_image] =>[orig_patent_app_number] => 619108 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/619108
Plastic-packaged semiconductor device having lead support and alignment structure Nov 26, 1990 Issued
Array ( [id] => 2797466 [patent_doc_number] => 05136363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-08-04 [patent_title] => 'Semiconductor device with bump electrode' [patent_app_type] => 1 [patent_app_number] => 7/617380 [patent_app_country] => US [patent_app_date] => 1990-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2055 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 271 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/136/05136363.pdf [firstpage_image] =>[orig_patent_app_number] => 617380 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/617380
Semiconductor device with bump electrode Nov 25, 1990 Issued
Array ( [id] => 2810330 [patent_doc_number] => 05124782 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-06-23 [patent_title] => 'Integrated circuit package with molded cell' [patent_app_type] => 1 [patent_app_number] => 7/617500 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3021 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/124/05124782.pdf [firstpage_image] =>[orig_patent_app_number] => 617500 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/617500
Integrated circuit package with molded cell Nov 20, 1990 Issued
Array ( [id] => 2857032 [patent_doc_number] => 05105258 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-14 [patent_title] => 'Metal system for semiconductor die attach' [patent_app_type] => 1 [patent_app_number] => 7/616970 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1162 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/105/05105258.pdf [firstpage_image] =>[orig_patent_app_number] => 616970 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/616970
Metal system for semiconductor die attach Nov 20, 1990 Issued
Array ( [id] => 2798434 [patent_doc_number] => 05103291 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-07 [patent_title] => 'Hermetically sealed package for electronic components' [patent_app_type] => 1 [patent_app_number] => 7/616665 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3012 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/103/05103291.pdf [firstpage_image] =>[orig_patent_app_number] => 616665 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/616665
Hermetically sealed package for electronic components Nov 20, 1990 Issued
07/615869 CHIP CARRIER HAVING IMPROVED THROUGH HOLE CONDUCTORS AND A METHOD OF MANUFACTURING SAME Nov 19, 1990 Abandoned
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