| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2845360
[patent_doc_number] => 05161000
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-03
[patent_title] => 'High-frequency thick-film semiconductor circuit'
[patent_app_type] => 1
[patent_app_number] => 7/643099
[patent_app_country] => US
[patent_app_date] => 1991-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 1532
[patent_no_of_claims] => 3
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[patent_words_short_claim] => 279
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/161/05161000.pdf
[firstpage_image] =>[orig_patent_app_number] => 643099
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/643099 | High-frequency thick-film semiconductor circuit | Jan 21, 1991 | Issued |
Array
(
[id] => 2782828
[patent_doc_number] => 05132779
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-21
[patent_title] => 'Housing for semiconductor device with occlusion gas removed'
[patent_app_type] => 1
[patent_app_number] => 7/641499
[patent_app_country] => US
[patent_app_date] => 1991-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 18
[patent_no_of_words] => 4114
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/132/05132779.pdf
[firstpage_image] =>[orig_patent_app_number] => 641499
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/641499 | Housing for semiconductor device with occlusion gas removed | Jan 14, 1991 | Issued |
| 07/638487 | ELECTRONIC PACKAGING SHAPED BEAM LEAD FABRICATION | Jan 3, 1991 | Abandoned |
Array
(
[id] => 3596129
[patent_doc_number] => 05521425
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-28
[patent_title] => 'Tape automated bonded (TAB) circuit'
[patent_app_type] => 1
[patent_app_number] => 7/633591
[patent_app_country] => US
[patent_app_date] => 1990-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 3079
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 258
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/521/05521425.pdf
[firstpage_image] =>[orig_patent_app_number] => 633591
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/633591 | Tape automated bonded (TAB) circuit | Dec 20, 1990 | Issued |
Array
(
[id] => 2756330
[patent_doc_number] => 05031028
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-09
[patent_title] => 'Heat sink assembly'
[patent_app_type] => 1
[patent_app_number] => 7/633154
[patent_app_country] => US
[patent_app_date] => 1990-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3734
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 128
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/031/05031028.pdf
[firstpage_image] =>[orig_patent_app_number] => 633154
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/633154 | Heat sink assembly | Dec 20, 1990 | Issued |
Array
(
[id] => 2904763
[patent_doc_number] => 05218215
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-08
[patent_title] => 'Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path'
[patent_app_type] => 1
[patent_app_number] => 7/630113
[patent_app_country] => US
[patent_app_date] => 1990-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 4297
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 209
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/218/05218215.pdf
[firstpage_image] =>[orig_patent_app_number] => 630113
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/630113 | Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path | Dec 18, 1990 | Issued |
Array
(
[id] => 2862377
[patent_doc_number] => 05113241
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-12
[patent_title] => 'Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles'
[patent_app_type] => 1
[patent_app_number] => 7/627573
[patent_app_country] => US
[patent_app_date] => 1990-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 2179
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/113/05113241.pdf
[firstpage_image] =>[orig_patent_app_number] => 627573
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/627573 | Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles | Dec 13, 1990 | Issued |
| 07/627413 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Dec 13, 1990 | Abandoned |
| 07/625410 | SEMICONDUCTOR LEAD FRAME | Dec 10, 1990 | Abandoned |
Array
(
[id] => 2964047
[patent_doc_number] => 05198695
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-30
[patent_title] => 'Semiconductor wafer with circuits bonded to a substrate'
[patent_app_type] => 1
[patent_app_number] => 7/624783
[patent_app_country] => US
[patent_app_date] => 1990-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2516
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/198/05198695.pdf
[firstpage_image] =>[orig_patent_app_number] => 624783
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/624783 | Semiconductor wafer with circuits bonded to a substrate | Dec 9, 1990 | Issued |
| 07/622284 | SEMICONDUCTOR DEVICE HAVING PIN PHOTODIODES | Dec 6, 1990 | Abandoned |
Array
(
[id] => 2811849
[patent_doc_number] => 05115300
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-19
[patent_title] => 'High-power semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/622591
[patent_app_country] => US
[patent_app_date] => 1990-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 2359
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/115/05115300.pdf
[firstpage_image] =>[orig_patent_app_number] => 622591
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/622591 | High-power semiconductor device | Dec 4, 1990 | Issued |
| 07/622059 | SEMICONDUCTOR DEVICE HAVING A PAD ARRAY CARRIER PACKAGE | Dec 3, 1990 | Abandoned |
| 07/620871 | SEMICONDUCTOR PACKAGE HAVING ISOLATED HEATSINK BONDING PADS | Dec 2, 1990 | Abandoned |
Array
(
[id] => 2741251
[patent_doc_number] => 05051813
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-24
[patent_title] => 'Plastic-packaged semiconductor device having lead support and alignment structure'
[patent_app_type] => 1
[patent_app_number] => 7/619108
[patent_app_country] => US
[patent_app_date] => 1990-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2371
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/051/05051813.pdf
[firstpage_image] =>[orig_patent_app_number] => 619108
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/619108 | Plastic-packaged semiconductor device having lead support and alignment structure | Nov 26, 1990 | Issued |
Array
(
[id] => 2797466
[patent_doc_number] => 05136363
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-08-04
[patent_title] => 'Semiconductor device with bump electrode'
[patent_app_type] => 1
[patent_app_number] => 7/617380
[patent_app_country] => US
[patent_app_date] => 1990-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 2055
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 271
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/136/05136363.pdf
[firstpage_image] =>[orig_patent_app_number] => 617380
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/617380 | Semiconductor device with bump electrode | Nov 25, 1990 | Issued |
Array
(
[id] => 2810330
[patent_doc_number] => 05124782
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-23
[patent_title] => 'Integrated circuit package with molded cell'
[patent_app_type] => 1
[patent_app_number] => 7/617500
[patent_app_country] => US
[patent_app_date] => 1990-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 3021
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 162
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/124/05124782.pdf
[firstpage_image] =>[orig_patent_app_number] => 617500
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/617500 | Integrated circuit package with molded cell | Nov 20, 1990 | Issued |
Array
(
[id] => 2857032
[patent_doc_number] => 05105258
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-14
[patent_title] => 'Metal system for semiconductor die attach'
[patent_app_type] => 1
[patent_app_number] => 7/616970
[patent_app_country] => US
[patent_app_date] => 1990-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1162
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/105/05105258.pdf
[firstpage_image] =>[orig_patent_app_number] => 616970
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/616970 | Metal system for semiconductor die attach | Nov 20, 1990 | Issued |
Array
(
[id] => 2798434
[patent_doc_number] => 05103291
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-07
[patent_title] => 'Hermetically sealed package for electronic components'
[patent_app_type] => 1
[patent_app_number] => 7/616665
[patent_app_country] => US
[patent_app_date] => 1990-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 3012
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/103/05103291.pdf
[firstpage_image] =>[orig_patent_app_number] => 616665
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/616665 | Hermetically sealed package for electronic components | Nov 20, 1990 | Issued |
| 07/615869 | CHIP CARRIER HAVING IMPROVED THROUGH HOLE CONDUCTORS AND A METHOD OF MANUFACTURING SAME | Nov 19, 1990 | Abandoned |