Carson Gross

Array ( [id] => 9009963 [patent_doc_number] => 08525264 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-09-03 [patent_title] => 'Photonic modulator with a semiconductor contact' [patent_app_type] => utility [patent_app_number] => 13/561738 [patent_app_country] => US [patent_app_date] => 2012-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 27 [patent_no_of_words] => 10293 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13561738 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9277873 [patent_doc_number] => 20140027841 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-01-30 [patent_title] => 'HIGH VOLTAGE FIELD BALANCE METAL OXIDE FIELD EFFECT TRANSISTOR (FBM)' [patent_app_type] => utility [patent_app_number] => 13/561523 [patent_app_country] => US [patent_app_date] => 2012-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 6688 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13561523 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10832045 [patent_doc_number] => 08860219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-14 [patent_title] => 'Chip assembly and chip assembling method' [patent_app_type] => utility [patent_app_number] => 13/559621 [patent_app_country] => US [patent_app_date] => 2012-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1064 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13559621 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9118320 [patent_doc_number] => 20130285243 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-31 [patent_title] => 'EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD' [patent_app_type] => utility [patent_app_number] => 13/559622 [patent_app_country] => US [patent_app_date] => 2012-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 889 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13559622 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8493258 [patent_doc_number] => 20120292666 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-22 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/560230 [patent_app_country] => US [patent_app_date] => 2012-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5657 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13560230 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9677594 [patent_doc_number] => 08816507 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-26 [patent_title] => 'Package-on-Package structures having buffer dams and method for forming the same' [patent_app_type] => utility [patent_app_number] => 13/559153 [patent_app_country] => US [patent_app_date] => 2012-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 3168 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13559153 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10858204 [patent_doc_number] => 08884409 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-11 [patent_title] => 'Wafer backside doping for thermal neutron shielding' [patent_app_type] => utility [patent_app_number] => 13/559291 [patent_app_country] => US [patent_app_date] => 2012-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2730 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13559291 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9153498 [patent_doc_number] => 08586404 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-19 [patent_title] => 'Method for reducing contact resistance of CMOS image sensor' [patent_app_type] => utility [patent_app_number] => 13/556869 [patent_app_country] => US [patent_app_date] => 2012-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 2723 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13556869 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8465203 [patent_doc_number] => 20120270371 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-25 [patent_title] => 'Method for Encapsulating Microelectronic Devices' [patent_app_type] => utility [patent_app_number] => 13/533635 [patent_app_country] => US [patent_app_date] => 2012-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3521 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13533635 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10004127 [patent_doc_number] => 09048226 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-02 [patent_title] => 'Chip assembly and chip assembling method' [patent_app_type] => utility [patent_app_number] => 13/527858 [patent_app_country] => US [patent_app_date] => 2012-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1123 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13527858 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8453343 [patent_doc_number] => 20120264288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-18 [patent_title] => 'METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/495586 [patent_app_country] => US [patent_app_date] => 2012-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 15986 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13495586 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9027074 [patent_doc_number] => 08536657 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-17 [patent_title] => 'Non-volatile semiconductor memory device and process of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/493137 [patent_app_country] => US [patent_app_date] => 2012-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 34 [patent_no_of_words] => 6429 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13493137 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8406027 [patent_doc_number] => 20120238091 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-20 [patent_title] => 'SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA' [patent_app_type] => utility [patent_app_number] => 13/481550 [patent_app_country] => US [patent_app_date] => 2012-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5198 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13481550 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10590739 [patent_doc_number] => 09312361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-12 [patent_title] => 'Semiconductor devices and methods for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/578872 [patent_app_country] => US [patent_app_date] => 2012-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 26 [patent_no_of_words] => 6744 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13578872 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8370658 [patent_doc_number] => 20120220056 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-30 [patent_title] => 'MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS' [patent_app_type] => utility [patent_app_number] => 13/467671 [patent_app_country] => US [patent_app_date] => 2012-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6165 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13467671 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9286035 [patent_doc_number] => 08642363 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-04 [patent_title] => 'Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology' [patent_app_type] => utility [patent_app_number] => 13/466660 [patent_app_country] => US [patent_app_date] => 2012-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 40 [patent_no_of_words] => 9411 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13466660 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10888060 [patent_doc_number] => 08912055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-16 [patent_title] => 'Method for manufacturing a hybrid MOSFET device and hybrid MOSFET obtainable thereby' [patent_app_type] => utility [patent_app_number] => 13/462694 [patent_app_country] => US [patent_app_date] => 2012-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 3345 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13462694 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9135024 [patent_doc_number] => 20130295739 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-11-07 [patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/461532 [patent_app_country] => US [patent_app_date] => 2012-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5005 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13461532 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9119692 [patent_doc_number] => 20130286614 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-31 [patent_title] => 'COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER' [patent_app_type] => utility [patent_app_number] => 13/459924 [patent_app_country] => US [patent_app_date] => 2012-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3556 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13459924 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9552134 [patent_doc_number] => 08759182 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-24 [patent_title] => 'Manufacturing method for semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/459740 [patent_app_country] => US [patent_app_date] => 2012-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 29 [patent_no_of_words] => 7369 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13459740 [rel_patent_id] =>[rel_patent_doc_number] =>)