
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5230560
[patent_doc_number] => 20070292667
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/810758
[patent_app_country] => US
[patent_app_date] => 2007-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 6982
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0292/20070292667.pdf
[firstpage_image] =>[orig_patent_app_number] => 11810758
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/810758 | Molded polymer comprising silicone and at least one metal trace | Jun 5, 2007 | Issued |
Array
(
[id] => 5088032
[patent_doc_number] => 20070227671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-04
[patent_title] => 'Adhesive Structure and Method for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 11/758280
[patent_app_country] => US
[patent_app_date] => 2007-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2276
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0227/20070227671.pdf
[firstpage_image] =>[orig_patent_app_number] => 11758280
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/758280 | Adhesive structure and method for manufacturing the same | Jun 4, 2007 | Issued |
Array
(
[id] => 285896
[patent_doc_number] => 07550825
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Interlayer dielectric and pre-applied die attach adhesive materials'
[patent_app_type] => utility
[patent_app_number] => 11/758089
[patent_app_country] => US
[patent_app_date] => 2007-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 11088
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 34
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/550/07550825.pdf
[firstpage_image] =>[orig_patent_app_number] => 11758089
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/758089 | Interlayer dielectric and pre-applied die attach adhesive materials | Jun 4, 2007 | Issued |
Array
(
[id] => 149538
[patent_doc_number] => 07681991
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-23
[patent_title] => 'Composite ceramic substrate for micro-fluid ejection head'
[patent_app_type] => utility
[patent_app_number] => 11/757573
[patent_app_country] => US
[patent_app_date] => 2007-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 4661
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/681/07681991.pdf
[firstpage_image] =>[orig_patent_app_number] => 11757573
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/757573 | Composite ceramic substrate for micro-fluid ejection head | Jun 3, 2007 | Issued |
Array
(
[id] => 8176496
[patent_doc_number] => 08178213
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-15
[patent_title] => 'Method for applying a coating material and coating for a metallic surface'
[patent_app_type] => utility
[patent_app_number] => 12/309651
[patent_app_country] => US
[patent_app_date] => 2007-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2000
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/178/08178213.pdf
[firstpage_image] =>[orig_patent_app_number] => 12309651
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/309651 | Method for applying a coating material and coating for a metallic surface | Jun 3, 2007 | Issued |
Array
(
[id] => 5062761
[patent_doc_number] => 20070224400
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-27
[patent_title] => 'CERAMIC SUBSTRATE, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING CERAMIC SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 11/755144
[patent_app_country] => US
[patent_app_date] => 2007-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 7563
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20070224400.pdf
[firstpage_image] =>[orig_patent_app_number] => 11755144
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/755144 | Ceramic substrate, electronic apparatus, and method for producing ceramic substrate | May 29, 2007 | Issued |
Array
(
[id] => 4548934
[patent_doc_number] => 07820274
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-26
[patent_title] => 'Prepreg and conductive layer-laminated substrate for printed wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/755374
[patent_app_country] => US
[patent_app_date] => 2007-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 9484
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 171
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/820/07820274.pdf
[firstpage_image] =>[orig_patent_app_number] => 11755374
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/755374 | Prepreg and conductive layer-laminated substrate for printed wiring board | May 29, 2007 | Issued |
Array
(
[id] => 5364198
[patent_doc_number] => 20090301757
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-10
[patent_title] => 'METHOD AND SYSTEM FOR COMPOSITE BOND WIRES'
[patent_app_type] => utility
[patent_app_number] => 12/302492
[patent_app_country] => US
[patent_app_date] => 2007-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2860
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0301/20090301757.pdf
[firstpage_image] =>[orig_patent_app_number] => 12302492
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/302492 | Method and system for composite bond wires | May 24, 2007 | Issued |
Array
(
[id] => 8675117
[patent_doc_number] => 08383230
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-02-26
[patent_title] => 'Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/805972
[patent_app_country] => US
[patent_app_date] => 2007-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 7634
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11805972
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/805972 | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board | May 23, 2007 | Issued |
Array
(
[id] => 5165368
[patent_doc_number] => 20070286953
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'Solution processible materials and their use in electronic devices'
[patent_app_type] => utility
[patent_app_number] => 11/803450
[patent_app_country] => US
[patent_app_date] => 2007-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3662
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0286/20070286953.pdf
[firstpage_image] =>[orig_patent_app_number] => 11803450
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/803450 | Solution processible materials and their use in electronic devices | May 13, 2007 | Abandoned |
Array
(
[id] => 4859417
[patent_doc_number] => 20080268267
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-30
[patent_title] => 'Combined solderable multi-purpose surface finishes on circuit boards and method of manufacture of such boards'
[patent_app_type] => utility
[patent_app_number] => 11/796458
[patent_app_country] => US
[patent_app_date] => 2007-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3771
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0268/20080268267.pdf
[firstpage_image] =>[orig_patent_app_number] => 11796458
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/796458 | Combined solderable multi-purpose surface finishes on circuit boards and method of manufacture of such boards | Apr 26, 2007 | Abandoned |
Array
(
[id] => 5223001
[patent_doc_number] => 20070252267
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-01
[patent_title] => 'Heat sink substrate and production method for the same'
[patent_app_type] => utility
[patent_app_number] => 11/790390
[patent_app_country] => US
[patent_app_date] => 2007-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 11155
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0252/20070252267.pdf
[firstpage_image] =>[orig_patent_app_number] => 11790390
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/790390 | Heat sink substrate and production method for the same | Apr 24, 2007 | Issued |
Array
(
[id] => 5210216
[patent_doc_number] => 20070248800
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Multilayer board having layer configuration indicator portion'
[patent_app_type] => utility
[patent_app_number] => 11/785794
[patent_app_country] => US
[patent_app_date] => 2007-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2017
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0248/20070248800.pdf
[firstpage_image] =>[orig_patent_app_number] => 11785794
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785794 | Multilayer board having layer configuration indicator portion | Apr 19, 2007 | Abandoned |
Array
(
[id] => 4663485
[patent_doc_number] => 20080254392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-16
[patent_title] => 'FLEXIBLE CIRCUIT WITH COVER LAYER'
[patent_app_type] => utility
[patent_app_number] => 11/735167
[patent_app_country] => US
[patent_app_date] => 2007-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 6055
[patent_no_of_claims] => 30
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0254/20080254392.pdf
[firstpage_image] =>[orig_patent_app_number] => 11735167
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/735167 | Flexible circuit with cover layer | Apr 12, 2007 | Issued |
Array
(
[id] => 5209238
[patent_doc_number] => 20070247822
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'METHOD FOR THE PRODUCTION OF A PRINTED CIRCUIT STRUCTURE AS WELL AS A PRINTED CIRCUIT STRUCTURE THUS PRODUCED'
[patent_app_type] => utility
[patent_app_number] => 11/734387
[patent_app_country] => US
[patent_app_date] => 2007-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0247/20070247822.pdf
[firstpage_image] =>[orig_patent_app_number] => 11734387
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/734387 | METHOD FOR THE PRODUCTION OF A PRINTED CIRCUIT STRUCTURE AS WELL AS A PRINTED CIRCUIT STRUCTURE THUS PRODUCED | Apr 11, 2007 | Abandoned |
Array
(
[id] => 4663300
[patent_doc_number] => 20080254207
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-16
[patent_title] => 'ELECTRICALLY CONDUCTIVE SUBSTRATE WITH HIGH HEAT CONDUCTIVITY'
[patent_app_type] => utility
[patent_app_number] => 11/733994
[patent_app_country] => US
[patent_app_date] => 2007-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 880
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0254/20080254207.pdf
[firstpage_image] =>[orig_patent_app_number] => 11733994
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/733994 | Electrically conductive substrate with high heat conductivity | Apr 10, 2007 | Issued |
Array
(
[id] => 4509924
[patent_doc_number] => 07915527
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-03-29
[patent_title] => 'Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings'
[patent_app_type] => utility
[patent_app_number] => 11/784158
[patent_app_country] => US
[patent_app_date] => 2007-04-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/915/07915527.pdf
[firstpage_image] =>[orig_patent_app_number] => 11784158
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/784158 | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings | Apr 4, 2007 | Issued |
Array
(
[id] => 6581575
[patent_doc_number] => 20100047588
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-25
[patent_title] => 'Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 12/295767
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/295767 | Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same | Apr 3, 2007 | Abandoned |
Array
(
[id] => 4640047
[patent_doc_number] => 08018074
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-13
[patent_title] => 'Components joining method and components joining structure'
[patent_app_type] => utility
[patent_app_number] => 12/279026
[patent_app_country] => US
[patent_app_date] => 2007-04-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/018/08018074.pdf
[firstpage_image] =>[orig_patent_app_number] => 12279026
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/279026 | Components joining method and components joining structure | Apr 2, 2007 | Issued |
Array
(
[id] => 173609
[patent_doc_number] => 07658988
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-09
[patent_title] => 'Printed circuits prepared from filled epoxy compositions'
[patent_app_type] => utility
[patent_app_number] => 11/732344
[patent_app_country] => US
[patent_app_date] => 2007-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/658/07658988.pdf
[firstpage_image] =>[orig_patent_app_number] => 11732344
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/732344 | Printed circuits prepared from filled epoxy compositions | Apr 2, 2007 | Issued |