
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5138936
[patent_doc_number] => 20070001152
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-04
[patent_title] => 'Conductive paste for multilayer electronic components and multilayer electronic component using same'
[patent_app_type] => utility
[patent_app_number] => 11/476177
[patent_app_country] => US
[patent_app_date] => 2006-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4740
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20070001152.pdf
[firstpage_image] =>[orig_patent_app_number] => 11476177
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/476177 | Conductive paste for multilayer electronic components and multilayer electronic component using same | Jun 26, 2006 | Issued |
Array
(
[id] => 159902
[patent_doc_number] => 07674984
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-09
[patent_title] => 'Wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/426399
[patent_app_country] => US
[patent_app_date] => 2006-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 7261
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/674/07674984.pdf
[firstpage_image] =>[orig_patent_app_number] => 11426399
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/426399 | Wiring board | Jun 25, 2006 | Issued |
Array
(
[id] => 5198942
[patent_doc_number] => 20070298260
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-27
[patent_title] => 'Multi-layer laminate substrates useful in electronic type applications'
[patent_app_type] => utility
[patent_app_number] => 11/472713
[patent_app_country] => US
[patent_app_date] => 2006-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5957
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0298/20070298260.pdf
[firstpage_image] =>[orig_patent_app_number] => 11472713
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/472713 | Multi-layer laminate substrates useful in electronic type applications | Jun 21, 2006 | Abandoned |
Array
(
[id] => 6532051
[patent_doc_number] => 20100015364
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'METHOD FOR STIFFING SYNTHETIC RIBBONS OF A SYNTHETIC TURF SURFACE'
[patent_app_type] => utility
[patent_app_number] => 11/917996
[patent_app_country] => US
[patent_app_date] => 2006-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2169
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0015/20100015364.pdf
[firstpage_image] =>[orig_patent_app_number] => 11917996
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/917996 | Method for stiffening synthetic ribbons of a synthetic turf surface | Jun 18, 2006 | Issued |
Array
(
[id] => 833302
[patent_doc_number] => 07396591
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-08
[patent_title] => 'Wiring substrate'
[patent_app_type] => utility
[patent_app_number] => 11/454412
[patent_app_country] => US
[patent_app_date] => 2006-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 2477
[patent_no_of_claims] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/396/07396591.pdf
[firstpage_image] =>[orig_patent_app_number] => 11454412
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/454412 | Wiring substrate | Jun 15, 2006 | Issued |
Array
(
[id] => 844099
[patent_doc_number] => 07388296
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-17
[patent_title] => 'Wiring substrate and bonding pad composition'
[patent_app_type] => utility
[patent_app_number] => 11/449107
[patent_app_country] => US
[patent_app_date] => 2006-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 6610
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/388/07388296.pdf
[firstpage_image] =>[orig_patent_app_number] => 11449107
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/449107 | Wiring substrate and bonding pad composition | Jun 7, 2006 | Issued |
Array
(
[id] => 5625075
[patent_doc_number] => 20060263580
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization'
[patent_app_type] => utility
[patent_app_number] => 11/438248
[patent_app_country] => US
[patent_app_date] => 2006-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 13222
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0263/20060263580.pdf
[firstpage_image] =>[orig_patent_app_number] => 11438248
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/438248 | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization | May 21, 2006 | Issued |
Array
(
[id] => 353300
[patent_doc_number] => 07492326
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2009-02-17
[patent_title] => 'Biodegradable radio frequency identification cards'
[patent_app_type] => utility
[patent_app_number] => 11/383633
[patent_app_country] => US
[patent_app_date] => 2006-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2773
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/492/07492326.pdf
[firstpage_image] =>[orig_patent_app_number] => 11383633
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/383633 | Biodegradable radio frequency identification cards | May 15, 2006 | Issued |
Array
(
[id] => 124205
[patent_doc_number] => 07705471
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-27
[patent_title] => 'Conductive bump structure of circuit board and method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/412310
[patent_app_country] => US
[patent_app_date] => 2006-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4774
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/705/07705471.pdf
[firstpage_image] =>[orig_patent_app_number] => 11412310
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/412310 | Conductive bump structure of circuit board and method for forming the same | Apr 26, 2006 | Issued |
Array
(
[id] => 576983
[patent_doc_number] => 07452612
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-11-18
[patent_title] => 'Wiring substrate'
[patent_app_type] => utility
[patent_app_number] => 11/412266
[patent_app_country] => US
[patent_app_date] => 2006-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 5037
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/452/07452612.pdf
[firstpage_image] =>[orig_patent_app_number] => 11412266
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/412266 | Wiring substrate | Apr 25, 2006 | Issued |
Array
(
[id] => 5834438
[patent_doc_number] => 20060246268
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-02
[patent_title] => 'PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 11/380008
[patent_app_country] => US
[patent_app_date] => 2006-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0246/20060246268.pdf
[firstpage_image] =>[orig_patent_app_number] => 11380008
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/380008 | Printed circuit board | Apr 24, 2006 | Issued |
Array
(
[id] => 5207574
[patent_doc_number] => 20070246158
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Wiring board, production process thereof and connection method using same'
[patent_app_type] => utility
[patent_app_number] => 11/408373
[patent_app_country] => US
[patent_app_date] => 2006-04-21
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[pdf_file] => publications/A1/0246/20070246158.pdf
[firstpage_image] =>[orig_patent_app_number] => 11408373
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/408373 | Wiring board, production process thereof and connection method using same | Apr 20, 2006 | Abandoned |
Array
(
[id] => 5661277
[patent_doc_number] => 20060251873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-09
[patent_title] => 'A METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 11/379744
[patent_app_country] => US
[patent_app_date] => 2006-04-21
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0251/20060251873.pdf
[firstpage_image] =>[orig_patent_app_number] => 11379744
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/379744 | Method of manufacturing a film printed circuit board | Apr 20, 2006 | Issued |
Array
(
[id] => 5850831
[patent_doc_number] => 20060234022
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-19
[patent_title] => 'Ceramic glaze coating structure of a chip element and method of forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/403777
[patent_app_country] => US
[patent_app_date] => 2006-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0234/20060234022.pdf
[firstpage_image] =>[orig_patent_app_number] => 11403777
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/403777 | Ceramic glaze coating structure of a chip element and method of forming the same | Apr 12, 2006 | Abandoned |
Array
(
[id] => 4807604
[patent_doc_number] => 20080171182
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-17
[patent_title] => 'Connection Method of a Flexible Printed Circuit Board with Two Printed Circuit Boards, and Electric or Electronic Component with Parts Connected by the Connection Method'
[patent_app_type] => utility
[patent_app_number] => 11/910685
[patent_app_country] => US
[patent_app_date] => 2006-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0171/20080171182.pdf
[firstpage_image] =>[orig_patent_app_number] => 11910685
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/910685 | Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method | Apr 10, 2006 | Issued |
Array
(
[id] => 5732514
[patent_doc_number] => 20060257631
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Probe pad structure in a ceramic space transformer'
[patent_app_type] => utility
[patent_app_number] => 11/399711
[patent_app_country] => US
[patent_app_date] => 2006-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0257/20060257631.pdf
[firstpage_image] =>[orig_patent_app_number] => 11399711
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/399711 | Probe pad structure in a ceramic space transformer | Apr 4, 2006 | Issued |
Array
(
[id] => 5914958
[patent_doc_number] => 20060237123
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-26
[patent_title] => 'Method of producing a sheet'
[patent_app_type] => utility
[patent_app_number] => 11/397879
[patent_app_country] => US
[patent_app_date] => 2006-04-03
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11397879
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/397879 | Method of producing a sheet | Apr 2, 2006 | Abandoned |
Array
(
[id] => 9468568
[patent_doc_number] => 08722199
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-05-13
[patent_title] => 'Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil'
[patent_app_type] => utility
[patent_app_number] => 11/910050
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11910050
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/910050 | Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil | Mar 30, 2006 | Issued |
Array
(
[id] => 5666777
[patent_doc_number] => 20060172127
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[patent_kind] => A1
[patent_issue_date] => 2006-08-03
[patent_title] => 'Laminate for forming a substrate with wires, substrate with wires and methods for producing them'
[patent_app_type] => utility
[patent_app_number] => 11/392731
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11392731
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/392731 | Laminate for forming a substrate with wires, substrate with wires and methods for producing them | Mar 29, 2006 | Abandoned |
Array
(
[id] => 211277
[patent_doc_number] => 07622183
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-24
[patent_title] => 'Multilayer printed wiring board with filled viahole structure'
[patent_app_type] => utility
[patent_app_number] => 11/385904
[patent_app_country] => US
[patent_app_date] => 2006-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/622/07622183.pdf
[firstpage_image] =>[orig_patent_app_number] => 11385904
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/385904 | Multilayer printed wiring board with filled viahole structure | Mar 21, 2006 | Issued |