
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4977026
[patent_doc_number] => 20070218258
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-20
[patent_title] => 'Articles and methods including patterned substrates formed from densified, adhered metal powders'
[patent_app_type] => utility
[patent_app_number] => 11/385008
[patent_app_country] => US
[patent_app_date] => 2006-03-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 12019
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0218/20070218258.pdf
[firstpage_image] =>[orig_patent_app_number] => 11385008
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/385008 | Articles and methods including patterned substrates formed from densified, adhered metal powders | Mar 19, 2006 | Abandoned |
Array
(
[id] => 8363971
[patent_doc_number] => 08253035
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-08-28
[patent_title] => 'Plating processing method, light transmitting conductive film and electromagnetic wave shielding film'
[patent_app_type] => utility
[patent_app_number] => 11/908500
[patent_app_country] => US
[patent_app_date] => 2006-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 25644
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11908500
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/908500 | Plating processing method, light transmitting conductive film and electromagnetic wave shielding film | Mar 13, 2006 | Issued |
Array
(
[id] => 4999532
[patent_doc_number] => 20070042166
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Tape substrate having reinforcement layer for tape packages'
[patent_app_type] => utility
[patent_app_number] => 11/372115
[patent_app_country] => US
[patent_app_date] => 2006-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3105
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0042/20070042166.pdf
[firstpage_image] =>[orig_patent_app_number] => 11372115
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/372115 | Tape substrate having reinforcement layer for tape packages | Mar 9, 2006 | Abandoned |
Array
(
[id] => 5784611
[patent_doc_number] => 20060204650
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-14
[patent_title] => 'Electrical connector structure of circuit board and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/370532
[patent_app_country] => US
[patent_app_date] => 2006-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4881
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0204/20060204650.pdf
[firstpage_image] =>[orig_patent_app_number] => 11370532
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/370532 | Electrical connector structure of circuit board and method for fabricating the same | Mar 7, 2006 | Issued |
Array
(
[id] => 5780236
[patent_doc_number] => 20060202331
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-14
[patent_title] => 'Conductive bump structure of circuit board and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/370724
[patent_app_country] => US
[patent_app_date] => 2006-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 6264
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0202/20060202331.pdf
[firstpage_image] =>[orig_patent_app_number] => 11370724
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/370724 | Conductive bump structure of circuit board and method for fabricating the same | Mar 6, 2006 | Abandoned |
Array
(
[id] => 925960
[patent_doc_number] => 07317258
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-01-08
[patent_title] => 'Thermal interface apparatus, systems, and fabrication methods'
[patent_app_type] => utility
[patent_app_number] => 11/368708
[patent_app_country] => US
[patent_app_date] => 2006-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 2743
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/317/07317258.pdf
[firstpage_image] =>[orig_patent_app_number] => 11368708
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/368708 | Thermal interface apparatus, systems, and fabrication methods | Mar 5, 2006 | Issued |
Array
(
[id] => 43000
[patent_doc_number] => 07776426
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-17
[patent_title] => 'Ceramic circuit substrate and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/365887
[patent_app_country] => US
[patent_app_date] => 2006-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 20
[patent_no_of_words] => 9265
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/776/07776426.pdf
[firstpage_image] =>[orig_patent_app_number] => 11365887
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/365887 | Ceramic circuit substrate and manufacturing method thereof | Mar 1, 2006 | Issued |
Array
(
[id] => 5631215
[patent_doc_number] => 20060147684
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-06
[patent_title] => 'Layered board and manufacturing method of the same, electronic apparatus having the layered board'
[patent_app_type] => utility
[patent_app_number] => 11/364056
[patent_app_country] => US
[patent_app_date] => 2006-03-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 6548
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0147/20060147684.pdf
[firstpage_image] =>[orig_patent_app_number] => 11364056
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/364056 | Layered board and manufacturing method of the same, electronic apparatus having the layered board | Feb 28, 2006 | Abandoned |
Array
(
[id] => 141260
[patent_doc_number] => 07687137
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-30
[patent_title] => 'Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/365028
[patent_app_country] => US
[patent_app_date] => 2006-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 14793
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/687/07687137.pdf
[firstpage_image] =>[orig_patent_app_number] => 11365028
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/365028 | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor | Feb 27, 2006 | Issued |
Array
(
[id] => 5732547
[patent_doc_number] => 20060257664
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Printed Circuit Board Structure and Manufacturing Method Thereof'
[patent_app_type] => utility
[patent_app_number] => 11/307854
[patent_app_country] => US
[patent_app_date] => 2006-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2478
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0257/20060257664.pdf
[firstpage_image] =>[orig_patent_app_number] => 11307854
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307854 | Printed circuit board structure and manufacturing method thereof | Feb 23, 2006 | Issued |
Array
(
[id] => 4764892
[patent_doc_number] => 20080176103
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'Conductive Paste and Electronic Parts'
[patent_app_type] => utility
[patent_app_number] => 11/886187
[patent_app_country] => US
[patent_app_date] => 2006-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 5386
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0176/20080176103.pdf
[firstpage_image] =>[orig_patent_app_number] => 11886187
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/886187 | Conductive Paste and Electronic Parts | Feb 14, 2006 | Abandoned |
Array
(
[id] => 5913114
[patent_doc_number] => 20060128176
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-15
[patent_title] => 'Selective application of conductive material to substrates by pick and place of compliant contact arrays'
[patent_app_type] => utility
[patent_app_number] => 11/349285
[patent_app_country] => US
[patent_app_date] => 2006-02-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0128/20060128176.pdf
[firstpage_image] =>[orig_patent_app_number] => 11349285
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/349285 | Selective application of conductive material to substrates by pick and place of compliant contact arrays | Feb 5, 2006 | Issued |
Array
(
[id] => 5177229
[patent_doc_number] => 20070178289
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'High-speed routing composite material'
[patent_app_type] => utility
[patent_app_number] => 11/340907
[patent_app_country] => US
[patent_app_date] => 2006-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0178/20070178289.pdf
[firstpage_image] =>[orig_patent_app_number] => 11340907
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/340907 | High-speed routing composite material | Jan 26, 2006 | Abandoned |
Array
(
[id] => 5023035
[patent_doc_number] => 20070149001
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'Flexible circuit'
[patent_app_type] => utility
[patent_app_number] => 11/316473
[patent_app_country] => US
[patent_app_date] => 2005-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 6468
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[pdf_file] => publications/A1/0149/20070149001.pdf
[firstpage_image] =>[orig_patent_app_number] => 11316473
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/316473 | Flexible circuit | Dec 21, 2005 | Abandoned |
Array
(
[id] => 278226
[patent_doc_number] => 07557302
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-07-07
[patent_title] => 'Printed circuit board with electrostatic discharge damage prevention'
[patent_app_type] => utility
[patent_app_number] => 11/295949
[patent_app_country] => US
[patent_app_date] => 2005-12-06
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[pdf_file] => patents/07/557/07557302.pdf
[firstpage_image] =>[orig_patent_app_number] => 11295949
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/295949 | Printed circuit board with electrostatic discharge damage prevention | Dec 5, 2005 | Issued |
Array
(
[id] => 902398
[patent_doc_number] => 07335414
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-26
[patent_title] => 'Printed circuit board and camera module'
[patent_app_type] => utility
[patent_app_number] => 11/293220
[patent_app_country] => US
[patent_app_date] => 2005-12-05
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/335/07335414.pdf
[firstpage_image] =>[orig_patent_app_number] => 11293220
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/293220 | Printed circuit board and camera module | Dec 4, 2005 | Issued |
Array
(
[id] => 675377
[patent_doc_number] => 07087293
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-08
[patent_title] => 'Thick film dielectric compositions for use on aluminum nitride substrates'
[patent_app_type] => utility
[patent_app_number] => 11/291167
[patent_app_country] => US
[patent_app_date] => 2005-12-01
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[pdf_file] => patents/07/087/07087293.pdf
[firstpage_image] =>[orig_patent_app_number] => 11291167
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/291167 | Thick film dielectric compositions for use on aluminum nitride substrates | Nov 30, 2005 | Issued |
Array
(
[id] => 795152
[patent_doc_number] => 07429063
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-09-30
[patent_title] => 'Counterfeit-proof metallic foil'
[patent_app_type] => utility
[patent_app_number] => 11/286437
[patent_app_country] => US
[patent_app_date] => 2005-11-25
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[pdf_file] => patents/07/429/07429063.pdf
[firstpage_image] =>[orig_patent_app_number] => 11286437
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/286437 | Counterfeit-proof metallic foil | Nov 24, 2005 | Issued |
Array
(
[id] => 4598791
[patent_doc_number] => 07976940
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-12
[patent_title] => 'Component, method for coating a component, and powder'
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[firstpage_image] =>[orig_patent_app_number] => 11274669
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/274669 | Component, method for coating a component, and powder | Nov 14, 2005 | Issued |
Array
(
[id] => 5637208
[patent_doc_number] => 20060068181
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[patent_kind] => A1
[patent_issue_date] => 2006-03-30
[patent_title] => 'Deep via seed repair using electroless plating chemistry'
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[pdf_file] => publications/A1/0068/20060068181.pdf
[firstpage_image] =>[orig_patent_app_number] => 11280067
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/280067 | Deep via seed repair using electroless plating chemistry | Nov 14, 2005 | Issued |