
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4855829
[patent_doc_number] => 20080264679
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-30
[patent_title] => 'Printed Circuit Board With Combined Digital and High Frequency Applications'
[patent_app_type] => utility
[patent_app_number] => 11/720448
[patent_app_country] => US
[patent_app_date] => 2004-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2962
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0264/20080264679.pdf
[firstpage_image] =>[orig_patent_app_number] => 11720448
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/720448 | Printed Circuit Board With Combined Digital and High Frequency Applications | Nov 29, 2004 | Abandoned |
Array
(
[id] => 5769916
[patent_doc_number] => 20050266213
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-01
[patent_title] => 'Layered board and manufacturing method of the same, electronic apparatus having the layered board'
[patent_app_type] => utility
[patent_app_number] => 10/998062
[patent_app_country] => US
[patent_app_date] => 2004-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5483
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0266/20050266213.pdf
[firstpage_image] =>[orig_patent_app_number] => 10998062
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/998062 | Layered board and manufacturing method of the same, electronic apparatus having the layered board | Nov 28, 2004 | Abandoned |
Array
(
[id] => 330264
[patent_doc_number] => 07510759
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-31
[patent_title] => 'Electronic part and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/541321
[patent_app_country] => US
[patent_app_date] => 2004-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 4803
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/510/07510759.pdf
[firstpage_image] =>[orig_patent_app_number] => 10541321
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/541321 | Electronic part and manufacturing method thereof | Nov 28, 2004 | Issued |
Array
(
[id] => 5827436
[patent_doc_number] => 20060062976
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-23
[patent_title] => 'Printed circuit board material for embedded passive devices'
[patent_app_type] => utility
[patent_app_number] => 10/995826
[patent_app_country] => US
[patent_app_date] => 2004-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4911
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0062/20060062976.pdf
[firstpage_image] =>[orig_patent_app_number] => 10995826
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/995826 | Printed circuit board material for embedded passive devices | Nov 23, 2004 | Abandoned |
Array
(
[id] => 5747687
[patent_doc_number] => 20060110618
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-25
[patent_title] => 'Electrodes for photovoltaic cells and methods for manufacture thereof'
[patent_app_type] => utility
[patent_app_number] => 10/998071
[patent_app_country] => US
[patent_app_date] => 2004-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 6873
[patent_no_of_claims] => 66
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20060110618.pdf
[firstpage_image] =>[orig_patent_app_number] => 10998071
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/998071 | Electrodes for photovoltaic cells and methods for manufacture thereof | Nov 23, 2004 | Abandoned |
Array
(
[id] => 4968252
[patent_doc_number] => 20070108254
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Circuit board'
[patent_app_type] => utility
[patent_app_number] => 10/580157
[patent_app_country] => US
[patent_app_date] => 2004-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2992
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20070108254.pdf
[firstpage_image] =>[orig_patent_app_number] => 10580157
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/580157 | Circuit board | Nov 18, 2004 | Issued |
Array
(
[id] => 7116421
[patent_doc_number] => 20050069722
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-31
[patent_title] => 'Low signal loss bonding ply for multilayer circuit boards'
[patent_app_type] => utility
[patent_app_number] => 10/989614
[patent_app_country] => US
[patent_app_date] => 2004-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 8133
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0069/20050069722.pdf
[firstpage_image] =>[orig_patent_app_number] => 10989614
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/989614 | Low signal loss bonding ply for multilayer circuit boards | Nov 15, 2004 | Abandoned |
Array
(
[id] => 1076766
[patent_doc_number] => 07615277
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-10
[patent_title] => 'Formation method of metal layer on resin layer, printed wiring board, and production method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/986913
[patent_app_country] => US
[patent_app_date] => 2004-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 20825
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/615/07615277.pdf
[firstpage_image] =>[orig_patent_app_number] => 10986913
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/986913 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | Nov 14, 2004 | Issued |
Array
(
[id] => 6936292
[patent_doc_number] => 20050109853
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Print-circuit board forming method and print-circuit board'
[patent_app_type] => utility
[patent_app_number] => 10/986928
[patent_app_country] => US
[patent_app_date] => 2004-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 10490
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0109/20050109853.pdf
[firstpage_image] =>[orig_patent_app_number] => 10986928
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/986928 | Print-circuit board forming method and print-circuit board | Nov 14, 2004 | Abandoned |
Array
(
[id] => 6939293
[patent_doc_number] => 20050112856
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Seed layer treatment'
[patent_app_type] => utility
[patent_app_number] => 10/981207
[patent_app_country] => US
[patent_app_date] => 2004-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4535
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 25
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0112/20050112856.pdf
[firstpage_image] =>[orig_patent_app_number] => 10981207
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/981207 | Seed layer treatment | Nov 2, 2004 | Abandoned |
Array
(
[id] => 7167907
[patent_doc_number] => 20050121226
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'LAMINATES HAVING A LOW DIELECTRIC CONSTANT, LOW DISAPATION FACTOR BOND CORE AND METHOD OF MAKING SAME'
[patent_app_type] => utility
[patent_app_number] => 10/904061
[patent_app_country] => US
[patent_app_date] => 2004-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3976
[patent_no_of_claims] => 47
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20050121226.pdf
[firstpage_image] =>[orig_patent_app_number] => 10904061
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/904061 | LAMINATES HAVING A LOW DIELECTRIC CONSTANT, LOW DISAPATION FACTOR BOND CORE AND METHOD OF MAKING SAME | Oct 20, 2004 | Abandoned |
Array
(
[id] => 551071
[patent_doc_number] => 07160628
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-01-09
[patent_title] => 'Opaque chrome coating having increased resistance to pinhole formation'
[patent_app_type] => utility
[patent_app_number] => 10/971618
[patent_app_country] => US
[patent_app_date] => 2004-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/160/07160628.pdf
[firstpage_image] =>[orig_patent_app_number] => 10971618
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/971618 | Opaque chrome coating having increased resistance to pinhole formation | Oct 20, 2004 | Issued |
Array
(
[id] => 424417
[patent_doc_number] => 07270398
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-18
[patent_title] => 'Circuit board and liquid discharging apparatus'
[patent_app_type] => utility
[patent_app_number] => 10/968901
[patent_app_country] => US
[patent_app_date] => 2004-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/07/270/07270398.pdf
[firstpage_image] =>[orig_patent_app_number] => 10968901
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/968901 | Circuit board and liquid discharging apparatus | Oct 20, 2004 | Issued |
Array
(
[id] => 7160529
[patent_doc_number] => 20050084704
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Metal/ceramic bonding substrate and method for producing same'
[patent_app_type] => utility
[patent_app_number] => 10/969360
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[patent_app_date] => 2004-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 10969360
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/969360 | Metal/ceramic bonding substrate and method for producing same | Oct 18, 2004 | Issued |
Array
(
[id] => 386330
[patent_doc_number] => 07303698
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-04
[patent_title] => 'Thick film conductor case compositions for LTCC tape'
[patent_app_type] => utility
[patent_app_number] => 10/968278
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[patent_app_date] => 2004-10-19
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[pdf_file] => patents/07/303/07303698.pdf
[firstpage_image] =>[orig_patent_app_number] => 10968278
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/968278 | Thick film conductor case compositions for LTCC tape | Oct 18, 2004 | Issued |
Array
(
[id] => 7103643
[patent_doc_number] => 20050106369
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-19
[patent_title] => 'Thick film conductor case compositions for LTCC tape'
[patent_app_type] => utility
[patent_app_number] => 10/967986
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[patent_app_date] => 2004-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[pdf_file] => publications/A1/0106/20050106369.pdf
[firstpage_image] =>[orig_patent_app_number] => 10967986
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/967986 | Thick film conductor case compositions for LTCC tape | Oct 18, 2004 | Issued |
Array
(
[id] => 7231945
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[patent_issue_date] => 2005-04-14
[patent_title] => 'Metal/ceramic bonding substrate and method for producing same'
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Array
(
[id] => 906585
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Array
(
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[patent_doc_number] => 20050025986
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[patent_issue_date] => 2005-02-03
[patent_title] => 'MULTILAYER STRUCTURE FOR ABSORBING ELECTROMAGNATIC WAVE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 10/711664
[patent_app_country] => US
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Array
(
[id] => 7225395
[patent_doc_number] => 20050078433
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-14
[patent_title] => 'Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate'
[patent_app_type] => utility
[patent_app_number] => 10/951731
[patent_app_country] => US
[patent_app_date] => 2004-09-29
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10951731
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/951731 | Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate | Sep 28, 2004 | Issued |