
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7032187
[patent_doc_number] => 20050030696
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-10
[patent_title] => 'Thin metal layers-having ceramic green sheet and method for producing ceramic capacitor'
[patent_app_type] => utility
[patent_app_number] => 10/721344
[patent_app_country] => US
[patent_app_date] => 2003-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9911
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0030/20050030696.pdf
[firstpage_image] =>[orig_patent_app_number] => 10721344
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/721344 | Thin metal layers-having ceramic green sheet and method for producing ceramic capacitor | Nov 25, 2003 | Abandoned |
Array
(
[id] => 397950
[patent_doc_number] => 07294919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-13
[patent_title] => 'Device having a complaint element pressed between substrates'
[patent_app_type] => utility
[patent_app_number] => 10/723095
[patent_app_country] => US
[patent_app_date] => 2003-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 4639
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/294/07294919.pdf
[firstpage_image] =>[orig_patent_app_number] => 10723095
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/723095 | Device having a complaint element pressed between substrates | Nov 25, 2003 | Issued |
Array
(
[id] => 22561
[patent_doc_number] => 07794578
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-14
[patent_title] => 'Method for preparing a circuit board material having a conductive base and a resistance layer'
[patent_app_type] => utility
[patent_app_number] => 10/719020
[patent_app_country] => US
[patent_app_date] => 2003-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4065
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 205
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/794/07794578.pdf
[firstpage_image] =>[orig_patent_app_number] => 10719020
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/719020 | Method for preparing a circuit board material having a conductive base and a resistance layer | Nov 23, 2003 | Issued |
Array
(
[id] => 523604
[patent_doc_number] => 07182996
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-02-27
[patent_title] => 'Deposting nanowires on a substrate'
[patent_app_type] => utility
[patent_app_number] => 10/718999
[patent_app_country] => US
[patent_app_date] => 2003-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 11
[patent_no_of_words] => 9891
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/182/07182996.pdf
[firstpage_image] =>[orig_patent_app_number] => 10718999
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/718999 | Deposting nanowires on a substrate | Nov 20, 2003 | Issued |
Array
(
[id] => 7406384
[patent_doc_number] => 20040105955
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-03
[patent_title] => 'Lamination process and structure of high layout density substrate'
[patent_app_type] => new
[patent_app_number] => 10/717116
[patent_app_country] => US
[patent_app_date] => 2003-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 3478
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0105/20040105955.pdf
[firstpage_image] =>[orig_patent_app_number] => 10717116
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/717116 | Lamination process and structure of high layout density substrate | Nov 18, 2003 | Issued |
Array
(
[id] => 7288938
[patent_doc_number] => 20040110024
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Electro-conductive metal plated polyimide substrate'
[patent_app_type] => new
[patent_app_number] => 10/715506
[patent_app_country] => US
[patent_app_date] => 2003-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4780
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20040110024.pdf
[firstpage_image] =>[orig_patent_app_number] => 10715506
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/715506 | Electro-conductive metal plated polyimide substrate | Nov 18, 2003 | Issued |
Array
(
[id] => 982654
[patent_doc_number] => 06927498
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-09
[patent_title] => 'Bond pad for flip chip package'
[patent_app_type] => utility
[patent_app_number] => 10/716682
[patent_app_country] => US
[patent_app_date] => 2003-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 2298
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 41
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/927/06927498.pdf
[firstpage_image] =>[orig_patent_app_number] => 10716682
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/716682 | Bond pad for flip chip package | Nov 18, 2003 | Issued |
Array
(
[id] => 7148755
[patent_doc_number] => 20040170795
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-02
[patent_title] => 'Lasable bond-ply materials for high density printed wiring boards'
[patent_app_type] => new
[patent_app_number] => 10/715718
[patent_app_country] => US
[patent_app_date] => 2003-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5464
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0170/20040170795.pdf
[firstpage_image] =>[orig_patent_app_number] => 10715718
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/715718 | Lasable bond-ply materials for high density printed wiring boards | Nov 16, 2003 | Abandoned |
Array
(
[id] => 7403830
[patent_doc_number] => 20040175569
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-09
[patent_title] => 'Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste'
[patent_app_type] => new
[patent_app_number] => 10/712092
[patent_app_country] => US
[patent_app_date] => 2003-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 7604
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 24
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0175/20040175569.pdf
[firstpage_image] =>[orig_patent_app_number] => 10712092
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/712092 | Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste | Nov 13, 2003 | Issued |
Array
(
[id] => 971952
[patent_doc_number] => 06936337
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-30
[patent_title] => 'Metal/ceramic circuit board'
[patent_app_type] => utility
[patent_app_number] => 10/713390
[patent_app_country] => US
[patent_app_date] => 2003-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 19
[patent_no_of_words] => 5304
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/936/06936337.pdf
[firstpage_image] =>[orig_patent_app_number] => 10713390
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/713390 | Metal/ceramic circuit board | Nov 13, 2003 | Issued |
Array
(
[id] => 6905324
[patent_doc_number] => 20050100719
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-12
[patent_title] => 'Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto'
[patent_app_type] => utility
[patent_app_number] => 10/706000
[patent_app_country] => US
[patent_app_date] => 2003-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 8256
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0100/20050100719.pdf
[firstpage_image] =>[orig_patent_app_number] => 10706000
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/706000 | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto | Nov 11, 2003 | Issued |
Array
(
[id] => 1012482
[patent_doc_number] => 06896953
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-05-24
[patent_title] => 'Wiring board and process of producing the same'
[patent_app_type] => utility
[patent_app_number] => 10/703424
[patent_app_country] => US
[patent_app_date] => 2003-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 5308
[patent_no_of_claims] => 6
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[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/896/06896953.pdf
[firstpage_image] =>[orig_patent_app_number] => 10703424
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/703424 | Wiring board and process of producing the same | Nov 9, 2003 | Issued |
Array
(
[id] => 6903218
[patent_doc_number] => 20050098613
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-12
[patent_title] => 'Method for diffusion bond welding for use in a multilayer electronic assembly'
[patent_app_type] => utility
[patent_app_number] => 10/704029
[patent_app_country] => US
[patent_app_date] => 2003-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 2541
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0098/20050098613.pdf
[firstpage_image] =>[orig_patent_app_number] => 10704029
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/704029 | Method for diffusion bond welding for use in a multilayer electronic assembly | Nov 6, 2003 | Abandoned |
Array
(
[id] => 7464495
[patent_doc_number] => 20040101667
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-27
[patent_title] => 'Adhesion between dielectric materials'
[patent_app_type] => new
[patent_app_number] => 10/703246
[patent_app_country] => US
[patent_app_date] => 2003-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 10754
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0101/20040101667.pdf
[firstpage_image] =>[orig_patent_app_number] => 10703246
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/703246 | Adhesion between dielectric materials | Nov 5, 2003 | Abandoned |
Array
(
[id] => 7463401
[patent_doc_number] => 20040166305
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-26
[patent_title] => 'Circuit substrate material, circuits comprising the same, and method of manufacture thereof'
[patent_app_type] => new
[patent_app_number] => 10/700343
[patent_app_country] => US
[patent_app_date] => 2003-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0166/20040166305.pdf
[firstpage_image] =>[orig_patent_app_number] => 10700343
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/700343 | Circuit substrate material, circuits comprising the same, and method of manufacture thereof | Nov 2, 2003 | Issued |
Array
(
[id] => 7469090
[patent_doc_number] => 20040121178
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-24
[patent_title] => 'Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier'
[patent_app_type] => new
[patent_app_number] => 10/698014
[patent_app_country] => US
[patent_app_date] => 2003-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 11152
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20040121178.pdf
[firstpage_image] =>[orig_patent_app_number] => 10698014
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/698014 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier | Oct 30, 2003 | Issued |
Array
(
[id] => 909471
[patent_doc_number] => 07329458
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-12
[patent_title] => 'Wiring member and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/694776
[patent_app_country] => US
[patent_app_date] => 2003-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/329/07329458.pdf
[firstpage_image] =>[orig_patent_app_number] => 10694776
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/694776 | Wiring member and method of manufacturing the same | Oct 28, 2003 | Issued |
Array
(
[id] => 314583
[patent_doc_number] => 07524552
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-28
[patent_title] => 'Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer'
[patent_app_type] => utility
[patent_app_number] => 10/532717
[patent_app_country] => US
[patent_app_date] => 2003-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/524/07524552.pdf
[firstpage_image] =>[orig_patent_app_number] => 10532717
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/532717 | Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer | Oct 28, 2003 | Issued |
Array
(
[id] => 7322912
[patent_doc_number] => 20040137214
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-15
[patent_title] => 'Material with surface nanometer functional structure and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/690503
[patent_app_country] => US
[patent_app_date] => 2003-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0137/20040137214.pdf
[firstpage_image] =>[orig_patent_app_number] => 10690503
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/690503 | Material with surface nanometer functional structure and method of manufacturing the same | Oct 22, 2003 | Abandoned |
Array
(
[id] => 1017736
[patent_doc_number] => 06890629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-05-10
[patent_title] => 'Integrated thin film capacitor/inductor/interconnect system and method'
[patent_app_type] => utility
[patent_app_number] => 10/686128
[patent_app_country] => US
[patent_app_date] => 2003-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 6697
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/890/06890629.pdf
[firstpage_image] =>[orig_patent_app_number] => 10686128
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/686128 | Integrated thin film capacitor/inductor/interconnect system and method | Oct 14, 2003 | Issued |