
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7350249
[patent_doc_number] => 20040048050
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-03-11
[patent_title] => 'Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration'
[patent_app_type] => new
[patent_app_number] => 10/343020
[patent_app_country] => US
[patent_app_date] => 2003-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 9092
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 24
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0048/20040048050.pdf
[firstpage_image] =>[orig_patent_app_number] => 10343020
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/343020 | Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration | Aug 21, 2003 | Abandoned |
Array
(
[id] => 1040368
[patent_doc_number] => 06869665
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-03-22
[patent_title] => 'Wiring board with core layer containing inorganic filler'
[patent_app_type] => utility
[patent_app_number] => 10/644004
[patent_app_country] => US
[patent_app_date] => 2003-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 7134
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/869/06869665.pdf
[firstpage_image] =>[orig_patent_app_number] => 10644004
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/644004 | Wiring board with core layer containing inorganic filler | Aug 19, 2003 | Issued |
Array
(
[id] => 454064
[patent_doc_number] => 07243951
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-17
[patent_title] => 'Durable security devices and security articles employing such devices'
[patent_app_type] => utility
[patent_app_number] => 10/643445
[patent_app_country] => US
[patent_app_date] => 2003-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 4043
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 25
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/243/07243951.pdf
[firstpage_image] =>[orig_patent_app_number] => 10643445
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/643445 | Durable security devices and security articles employing such devices | Aug 18, 2003 | Issued |
Array
(
[id] => 6969183
[patent_doc_number] => 20050034893
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-17
[patent_title] => 'Circuit board design'
[patent_app_type] => utility
[patent_app_number] => 10/641070
[patent_app_country] => US
[patent_app_date] => 2003-08-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2078
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0034/20050034893.pdf
[firstpage_image] =>[orig_patent_app_number] => 10641070
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/641070 | Circuit board design | Aug 14, 2003 | Issued |
Array
(
[id] => 7186573
[patent_doc_number] => 20040084137
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-06
[patent_title] => 'Method and structure for producing Z-axis interconnection assembly of printed wiring board elements'
[patent_app_type] => new
[patent_app_number] => 10/640484
[patent_app_country] => US
[patent_app_date] => 2003-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 2944
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0084/20040084137.pdf
[firstpage_image] =>[orig_patent_app_number] => 10640484
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/640484 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Aug 12, 2003 | Issued |
Array
(
[id] => 7129505
[patent_doc_number] => 20040040651
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-03-04
[patent_title] => 'Multi-layer circuit board and method of making the same'
[patent_app_type] => new
[patent_app_number] => 10/639648
[patent_app_country] => US
[patent_app_date] => 2003-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 8369
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0040/20040040651.pdf
[firstpage_image] =>[orig_patent_app_number] => 10639648
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/639648 | Multi-layer circuit board and method of making the same | Aug 12, 2003 | Abandoned |
Array
(
[id] => 714707
[patent_doc_number] => 07052763
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-30
[patent_title] => 'Multi-element connector'
[patent_app_type] => utility
[patent_app_number] => 10/634708
[patent_app_country] => US
[patent_app_date] => 2003-08-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 7365
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 228
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/052/07052763.pdf
[firstpage_image] =>[orig_patent_app_number] => 10634708
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/634708 | Multi-element connector | Aug 4, 2003 | Issued |
Array
(
[id] => 990600
[patent_doc_number] => 06919125
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-07-19
[patent_title] => 'Dual composition ceramic substrate for microelectronic applications'
[patent_app_type] => utility
[patent_app_number] => 10/632152
[patent_app_country] => US
[patent_app_date] => 2003-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 4296
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/919/06919125.pdf
[firstpage_image] =>[orig_patent_app_number] => 10632152
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/632152 | Dual composition ceramic substrate for microelectronic applications | Jul 31, 2003 | Issued |
Array
(
[id] => 7383391
[patent_doc_number] => 20040020690
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-05
[patent_title] => 'Via connector and method of making same'
[patent_app_type] => new
[patent_app_number] => 10/632576
[patent_app_country] => US
[patent_app_date] => 2003-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4480
[patent_no_of_claims] => 45
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0020/20040020690.pdf
[firstpage_image] =>[orig_patent_app_number] => 10632576
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/632576 | Via connector and method of making same | Jul 27, 2003 | Abandoned |
Array
(
[id] => 7182156
[patent_doc_number] => 20040202847
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-14
[patent_title] => 'Wiring structure having a slit dummy'
[patent_app_type] => new
[patent_app_number] => 10/627948
[patent_app_country] => US
[patent_app_date] => 2003-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 4498
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0202/20040202847.pdf
[firstpage_image] =>[orig_patent_app_number] => 10627948
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/627948 | Wiring structure having a slit dummy | Jul 27, 2003 | Issued |
Array
(
[id] => 7385285
[patent_doc_number] => 20040020972
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-05
[patent_title] => 'Printed circuit board and soldering structure for electronic parts thereto'
[patent_app_type] => new
[patent_app_number] => 10/627710
[patent_app_country] => US
[patent_app_date] => 2003-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2292
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0020/20040020972.pdf
[firstpage_image] =>[orig_patent_app_number] => 10627710
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/627710 | Printed circuit board and soldering structure for electronic parts thereto | Jul 27, 2003 | Issued |
Array
(
[id] => 990986
[patent_doc_number] => 06919513
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-07-19
[patent_title] => 'Film carrier tape for semiconductor package and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/621376
[patent_app_country] => US
[patent_app_date] => 2003-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 2970
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/919/06919513.pdf
[firstpage_image] =>[orig_patent_app_number] => 10621376
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/621376 | Film carrier tape for semiconductor package and manufacturing method thereof | Jul 17, 2003 | Issued |
Array
(
[id] => 7397219
[patent_doc_number] => 20040023011
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-05
[patent_title] => 'Copper paste, wiring board using the same, and production method of wiring board'
[patent_app_type] => new
[patent_app_number] => 10/620346
[patent_app_country] => US
[patent_app_date] => 2003-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 10204
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20040023011.pdf
[firstpage_image] =>[orig_patent_app_number] => 10620346
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/620346 | Copper paste, wiring board using the same, and production method of wiring board | Jul 16, 2003 | Abandoned |
Array
(
[id] => 938537
[patent_doc_number] => 06972366
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-06
[patent_title] => 'Multilayer structure for absorbing electromagnetic wave and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/604393
[patent_app_country] => US
[patent_app_date] => 2003-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 2685
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 67
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/972/06972366.pdf
[firstpage_image] =>[orig_patent_app_number] => 10604393
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/604393 | Multilayer structure for absorbing electromagnetic wave and manufacturing method thereof | Jul 16, 2003 | Issued |
Array
(
[id] => 7285708
[patent_doc_number] => 20040108133
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin'
[patent_app_type] => new
[patent_app_number] => 10/619632
[patent_app_country] => US
[patent_app_date] => 2003-07-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5590
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20040108133.pdf
[firstpage_image] =>[orig_patent_app_number] => 10619632
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/619632 | Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin | Jul 15, 2003 | Abandoned |
Array
(
[id] => 7122148
[patent_doc_number] => 20050013977
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-20
[patent_title] => 'Methods for producing waveguides'
[patent_app_type] => utility
[patent_app_number] => 10/619920
[patent_app_country] => US
[patent_app_date] => 2003-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1145
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0013/20050013977.pdf
[firstpage_image] =>[orig_patent_app_number] => 10619920
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/619920 | Methods for producing waveguides | Jul 14, 2003 | Issued |
Array
(
[id] => 585319
[patent_doc_number] => 07438969
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-21
[patent_title] => 'Filling material, multilayer wiring board, and process of producing multilayer wiring board'
[patent_app_type] => utility
[patent_app_number] => 10/615067
[patent_app_country] => US
[patent_app_date] => 2003-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 6865
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/438/07438969.pdf
[firstpage_image] =>[orig_patent_app_number] => 10615067
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/615067 | Filling material, multilayer wiring board, and process of producing multilayer wiring board | Jul 8, 2003 | Issued |
Array
(
[id] => 6923115
[patent_doc_number] => 20050236370
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-27
[patent_title] => 'Arc contact element for electrical apparatus production method thereof, corresponding contact assembly and electrical apparatus'
[patent_app_type] => utility
[patent_app_number] => 10/520645
[patent_app_country] => US
[patent_app_date] => 2003-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2343
[patent_no_of_claims] => 14
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0236/20050236370.pdf
[firstpage_image] =>[orig_patent_app_number] => 10520645
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/520645 | Arc contact element for electrical apparatus production method thereof, corresponding contact assembly and electrical apparatus | Jul 2, 2003 | Abandoned |
Array
(
[id] => 7458960
[patent_doc_number] => 20040197537
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-07
[patent_title] => 'Barium cadmium tantalum-based compound having high dielectric properties and method of making the same'
[patent_app_type] => new
[patent_app_number] => 10/611780
[patent_app_country] => US
[patent_app_date] => 2003-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 6192
[patent_no_of_claims] => 30
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0197/20040197537.pdf
[firstpage_image] =>[orig_patent_app_number] => 10611780
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/611780 | Barium cadmium tantalum-based compound having high dielectric properties and method of making the same | Jun 29, 2003 | Abandoned |
Array
(
[id] => 7363318
[patent_doc_number] => 20040005443
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-08
[patent_title] => 'Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board'
[patent_app_type] => new
[patent_app_number] => 10/607306
[patent_app_country] => US
[patent_app_date] => 2003-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 10522
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0005/20040005443.pdf
[firstpage_image] =>[orig_patent_app_number] => 10607306
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/607306 | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board | Jun 26, 2003 | Issued |