
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6864291
[patent_doc_number] => 20030189817
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-09
[patent_title] => 'Electronic device with external terminals and method of production of the same'
[patent_app_type] => new
[patent_app_number] => 10/404664
[patent_app_country] => US
[patent_app_date] => 2003-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 6798
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[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0189/20030189817.pdf
[firstpage_image] =>[orig_patent_app_number] => 10404664
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/404664 | Electronic device with external terminals and method of production of the same | Apr 1, 2003 | Issued |
Array
(
[id] => 6661916
[patent_doc_number] => 20030201242
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-30
[patent_title] => 'Method for manufacturing wiring circuit boards with bumps and method for forming bumps'
[patent_app_type] => new
[patent_app_number] => 10/403024
[patent_app_country] => US
[patent_app_date] => 2003-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3064
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[patent_words_short_claim] => 65
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0201/20030201242.pdf
[firstpage_image] =>[orig_patent_app_number] => 10403024
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/403024 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Mar 31, 2003 | Issued |
Array
(
[id] => 1005166
[patent_doc_number] => 06905757
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-06-14
[patent_title] => 'DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE'
[patent_app_type] => utility
[patent_app_number] => 10/478419
[patent_app_country] => US
[patent_app_date] => 2003-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 8050
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/905/06905757.pdf
[firstpage_image] =>[orig_patent_app_number] => 10478419
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/478419 | DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE | Mar 31, 2003 | Issued |
Array
(
[id] => 1104189
[patent_doc_number] => 06811898
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-02
[patent_title] => 'Wear-resistant coating and method for applying it'
[patent_app_type] => B2
[patent_app_number] => 10/257957
[patent_app_country] => US
[patent_app_date] => 2003-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 4276
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/811/06811898.pdf
[firstpage_image] =>[orig_patent_app_number] => 10257957
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/257957 | Wear-resistant coating and method for applying it | Mar 31, 2003 | Issued |
Array
(
[id] => 1196039
[patent_doc_number] => 06726984
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-04-27
[patent_title] => 'Ceramic structure using a support sheet'
[patent_app_type] => B2
[patent_app_number] => 10/403239
[patent_app_country] => US
[patent_app_date] => 2003-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 9
[patent_no_of_words] => 3885
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/726/06726984.pdf
[firstpage_image] =>[orig_patent_app_number] => 10403239
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/403239 | Ceramic structure using a support sheet | Mar 27, 2003 | Issued |
Array
(
[id] => 1071638
[patent_doc_number] => 06841220
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-01-11
[patent_title] => 'Dielectric recording medium, and method of and apparatus for producing the same'
[patent_app_type] => utility
[patent_app_number] => 10/396708
[patent_app_country] => US
[patent_app_date] => 2003-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 9960
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[pdf_file] => patents/06/841/06841220.pdf
[firstpage_image] =>[orig_patent_app_number] => 10396708
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/396708 | Dielectric recording medium, and method of and apparatus for producing the same | Mar 25, 2003 | Issued |
Array
(
[id] => 6829454
[patent_doc_number] => 20030180512
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-09-25
[patent_title] => 'Circuit board and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/397661
[patent_app_country] => US
[patent_app_date] => 2003-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 16573
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20030180512.pdf
[firstpage_image] =>[orig_patent_app_number] => 10397661
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/397661 | Circuit board and method of manufacturing the same | Mar 25, 2003 | Issued |
Array
(
[id] => 1219845
[patent_doc_number] => 06703071
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-09
[patent_title] => 'Absorbent articles'
[patent_app_type] => B2
[patent_app_number] => 10/396038
[patent_app_country] => US
[patent_app_date] => 2003-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2432
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[pdf_file] => patents/06/703/06703071.pdf
[firstpage_image] =>[orig_patent_app_number] => 10396038
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/396038 | Absorbent articles | Mar 24, 2003 | Issued |
Array
(
[id] => 6729882
[patent_doc_number] => 20030186072
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-02
[patent_title] => 'Electron device and semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/395231
[patent_app_country] => US
[patent_app_date] => 2003-03-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0186/20030186072.pdf
[firstpage_image] =>[orig_patent_app_number] => 10395231
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/395231 | Electronic device | Mar 24, 2003 | Issued |
Array
(
[id] => 1154226
[patent_doc_number] => 06764748
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-07-20
[patent_title] => 'Z-interconnections with liquid crystal polymer dielectric films'
[patent_app_type] => B1
[patent_app_number] => 10/392637
[patent_app_country] => US
[patent_app_date] => 2003-03-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/764/06764748.pdf
[firstpage_image] =>[orig_patent_app_number] => 10392637
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/392637 | Z-interconnections with liquid crystal polymer dielectric films | Mar 17, 2003 | Issued |
Array
(
[id] => 971951
[patent_doc_number] => 06936336
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-30
[patent_title] => 'Transfer sheet and production method of the same and wiring board and production method of the same'
[patent_app_type] => utility
[patent_app_number] => 10/389135
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[patent_app_date] => 2003-03-14
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[pdf_file] => patents/06/936/06936336.pdf
[firstpage_image] =>[orig_patent_app_number] => 10389135
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/389135 | Transfer sheet and production method of the same and wiring board and production method of the same | Mar 13, 2003 | Issued |
Array
(
[id] => 442200
[patent_doc_number] => 07255919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-14
[patent_title] => 'Mold release layer transferring film and laminate film'
[patent_app_type] => utility
[patent_app_number] => 10/507242
[patent_app_country] => US
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[pdf_file] => patents/07/255/07255919.pdf
[firstpage_image] =>[orig_patent_app_number] => 10507242
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/507242 | Mold release layer transferring film and laminate film | Mar 10, 2003 | Issued |
Array
(
[id] => 1006131
[patent_doc_number] => 06906427
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-06-14
[patent_title] => 'CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE, AND ELECTRONIC CIRCUIT COMPONENTS AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 10/379582
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[pdf_file] => patents/06/906/06906427.pdf
[firstpage_image] =>[orig_patent_app_number] => 10379582
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/379582 | CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE CONNECTION STRUCTURE, AND ELECTRONIC CIRCUIT COMPONENTS AND METHOD OF MANUFACTURING THE SAME | Mar 5, 2003 | Issued |
Array
(
[id] => 1207061
[patent_doc_number] => 06717218
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[patent_kind] => B2
[patent_issue_date] => 2004-04-06
[patent_title] => 'Wiring structure formed in contact hole, manufacturing method therefor, and a display apparatus having the same'
[patent_app_type] => B2
[patent_app_number] => 10/378907
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Array
(
[id] => 7167912
[patent_doc_number] => 20050121229
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[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof'
[patent_app_type] => utility
[patent_app_number] => 10/506529
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/506529 | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof | Mar 4, 2003 | Issued |
Array
(
[id] => 1136919
[patent_doc_number] => 06780494
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[patent_issue_date] => 2004-08-24
[patent_title] => 'Ceramic electronic device and method of production of same'
[patent_app_type] => B2
[patent_app_number] => 10/377696
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Array
(
[id] => 1103586
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[patent_title] => 'Forming electromagnetic communication circuit components using densified metal powder'
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[patent_app_number] => 10/377960
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/377960 | Forming electromagnetic communication circuit components using densified metal powder | Feb 28, 2003 | Issued |
Array
(
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Array
(
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[patent_issue_date] => 2010-12-07
[patent_title] => 'Processing a printed wiring board by single bath electrodeposition'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/373350 | Processing a printed wiring board by single bath electrodeposition | Feb 23, 2003 | Issued |
Array
(
[id] => 6705972
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[patent_kind] => A1
[patent_issue_date] => 2003-08-14
[patent_title] => 'Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens'
[patent_app_type] => new
[patent_app_number] => 10/371270
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[firstpage_image] =>[orig_patent_app_number] => 10371270
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/371270 | Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens | Feb 20, 2003 | Issued |