
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5966131
[patent_doc_number] => 20020089810
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-11
[patent_title] => 'Integrated thin film capacitor/inductor/interconnect system and method'
[patent_app_type] => new
[patent_app_number] => 09/960796
[patent_app_country] => US
[patent_app_date] => 2001-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 7008
[patent_no_of_claims] => 100
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20020089810.pdf
[firstpage_image] =>[orig_patent_app_number] => 09960796
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/960796 | Integrated thin film capacitor/inductor/interconnect system and method | Sep 20, 2001 | Issued |
Array
(
[id] => 1358323
[patent_doc_number] => 06569514
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-05-27
[patent_title] => 'Ceramic circuit board and method of manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 09/957040
[patent_app_country] => US
[patent_app_date] => 2001-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 11928
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 192
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/569/06569514.pdf
[firstpage_image] =>[orig_patent_app_number] => 09957040
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957040 | Ceramic circuit board and method of manufacturing the same | Sep 20, 2001 | Issued |
Array
(
[id] => 6718469
[patent_doc_number] => 20030052156
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-20
[patent_title] => 'HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF MANUFACTURING SAME'
[patent_app_type] => new
[patent_app_number] => 09/954026
[patent_app_country] => US
[patent_app_date] => 2001-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4567
[patent_no_of_claims] => 16
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[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0052/20030052156.pdf
[firstpage_image] =>[orig_patent_app_number] => 09954026
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/954026 | Hollow solder structure having improved reliability and method of manufacturing same | Sep 17, 2001 | Issued |
Array
(
[id] => 743963
[patent_doc_number] => 07026059
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-11
[patent_title] => 'Copper foil for high-density ultrafine printed wiring boad'
[patent_app_type] => utility
[patent_app_number] => 10/380900
[patent_app_country] => US
[patent_app_date] => 2001-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 9850
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/026/07026059.pdf
[firstpage_image] =>[orig_patent_app_number] => 10380900
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/380900 | Copper foil for high-density ultrafine printed wiring boad | Sep 16, 2001 | Issued |
Array
(
[id] => 1516618
[patent_doc_number] => 06500529
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-31
[patent_title] => 'Low signal loss bonding ply for multilayer circuit boards'
[patent_app_type] => B1
[patent_app_number] => 09/952486
[patent_app_country] => US
[patent_app_date] => 2001-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 8063
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/500/06500529.pdf
[firstpage_image] =>[orig_patent_app_number] => 09952486
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/952486 | Low signal loss bonding ply for multilayer circuit boards | Sep 13, 2001 | Issued |
Array
(
[id] => 1378467
[patent_doc_number] => 06551697
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-22
[patent_title] => 'Printed circuit board, method of making same, and photomask for use in the method'
[patent_app_type] => B2
[patent_app_number] => 09/953322
[patent_app_country] => US
[patent_app_date] => 2001-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 3578
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/551/06551697.pdf
[firstpage_image] =>[orig_patent_app_number] => 09953322
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/953322 | Printed circuit board, method of making same, and photomask for use in the method | Sep 13, 2001 | Issued |
Array
(
[id] => 6063123
[patent_doc_number] => 20020031650
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-14
[patent_title] => 'Electronic chip package'
[patent_app_type] => new
[patent_app_number] => 09/950131
[patent_app_country] => US
[patent_app_date] => 2001-09-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 20709
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0031/20020031650.pdf
[firstpage_image] =>[orig_patent_app_number] => 09950131
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/950131 | Electronic chip package | Sep 9, 2001 | Issued |
Array
(
[id] => 1375198
[patent_doc_number] => 06555209
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-29
[patent_title] => 'Method of manufacturing multilayer wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/914819
[patent_app_country] => US
[patent_app_date] => 2001-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 39
[patent_no_of_words] => 11468
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 19
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555209.pdf
[firstpage_image] =>[orig_patent_app_number] => 09914819
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/914819 | Method of manufacturing multilayer wiring board | Aug 30, 2001 | Issued |
Array
(
[id] => 5951014
[patent_doc_number] => 20020006501
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-17
[patent_title] => 'Stereolithographically marked semiconductor devices and methods'
[patent_app_type] => new
[patent_app_number] => 09/942242
[patent_app_country] => US
[patent_app_date] => 2001-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 8747
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[pdf_file] => publications/A1/0006/20020006501.pdf
[firstpage_image] =>[orig_patent_app_number] => 09942242
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/942242 | Stereolithographically marked semiconductor devices and methods | Aug 28, 2001 | Issued |
Array
(
[id] => 6498183
[patent_doc_number] => 20020025417
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-28
[patent_title] => 'Novel approach to structurally reinforcing the mechanical performance of silicon level interconnect layers'
[patent_app_type] => new
[patent_app_number] => 09/938261
[patent_app_country] => US
[patent_app_date] => 2001-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2032
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[pdf_file] => publications/A1/0025/20020025417.pdf
[firstpage_image] =>[orig_patent_app_number] => 09938261
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/938261 | Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers | Aug 22, 2001 | Issued |
Array
(
[id] => 6497960
[patent_doc_number] => 20020025406
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-28
[patent_title] => 'Metal mask structure and method for maufacturing thereof'
[patent_app_type] => new
[patent_app_number] => 09/934845
[patent_app_country] => US
[patent_app_date] => 2001-08-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0025/20020025406.pdf
[firstpage_image] =>[orig_patent_app_number] => 09934845
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/934845 | Metal mask structure and method for manufacturing thereof | Aug 22, 2001 | Issued |
Array
(
[id] => 1424657
[patent_doc_number] => 06515372
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-04
[patent_title] => 'Wiring board and its production method, semiconductor device and its production method, and electronic apparatus'
[patent_app_type] => B1
[patent_app_number] => 09/913975
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[pdf_file] => patents/06/515/06515372.pdf
[firstpage_image] =>[orig_patent_app_number] => 09913975
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/913975 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Aug 19, 2001 | Issued |
Array
(
[id] => 1578372
[patent_doc_number] => 06448195
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[patent_issue_date] => 2002-09-10
[patent_title] => 'Composition for ceramic substrate and ceramic circuit component'
[patent_app_type] => B2
[patent_app_number] => 09/930010
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[firstpage_image] =>[orig_patent_app_number] => 09930010
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/930010 | Composition for ceramic substrate and ceramic circuit component | Aug 14, 2001 | Issued |
Array
(
[id] => 6241659
[patent_doc_number] => 20020045033
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[patent_issue_date] => 2002-04-18
[patent_title] => 'Polyimide film, method of manufacture , and metal interconnect board with Polyimide film substrate'
[patent_app_type] => new
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[firstpage_image] =>[orig_patent_app_number] => 09925211
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/925211 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Aug 8, 2001 | Issued |
Array
(
[id] => 7380100
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[patent_issue_date] => 2004-02-12
[patent_title] => 'Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/398961 | Printed circuit board and method for producing a printed circuit board | Aug 1, 2001 | Issued |
Array
(
[id] => 1337357
[patent_doc_number] => 06589625
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[patent_issue_date] => 2003-07-08
[patent_title] => 'Hermetic seal and method to create the same'
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[patent_app_number] => 09/921196
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[pdf_file] => patents/06/589/06589625.pdf
[firstpage_image] =>[orig_patent_app_number] => 09921196
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/921196 | Hermetic seal and method to create the same | Jul 31, 2001 | Issued |
Array
(
[id] => 6128803
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[patent_title] => 'Laminated structure'
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[firstpage_image] =>[orig_patent_app_number] => 09920370
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/920370 | Laminated structure | Jul 31, 2001 | Abandoned |
Array
(
[id] => 7076592
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/917701 | Process for reducing extraneous metal plating | Jul 30, 2001 | Issued |
Array
(
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[patent_title] => 'Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/889569 | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same | Jul 29, 2001 | Issued |
Array
(
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[pdf_file] => publications/A1/0076/20020076536.pdf
[firstpage_image] =>[orig_patent_app_number] => 09917313
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/917313 | Electronic component and method of manufacturing the same | Jul 26, 2001 | Issued |