
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7301772
[patent_doc_number] => 20040113749
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-17
[patent_title] => 'Ceramic component comprising an environmentally stable contact system'
[patent_app_type] => new
[patent_app_number] => 10/475455
[patent_app_country] => US
[patent_app_date] => 2003-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2764
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 18
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0113/20040113749.pdf
[firstpage_image] =>[orig_patent_app_number] => 10475455
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/475455 | Ceramic component comprising an environmentally stable contact system | May 6, 2001 | Issued |
Array
(
[id] => 1527639
[patent_doc_number] => 06479136
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-12
[patent_title] => 'Substrate of circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/831048
[patent_app_country] => US
[patent_app_date] => 2001-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 9266
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/479/06479136.pdf
[firstpage_image] =>[orig_patent_app_number] => 09831048
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/831048 | Substrate of circuit board | May 3, 2001 | Issued |
Array
(
[id] => 1355850
[patent_doc_number] => 06572954
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-06-03
[patent_title] => 'Electromechanical component'
[patent_app_type] => B1
[patent_app_number] => 09/830304
[patent_app_country] => US
[patent_app_date] => 2001-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2770
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/572/06572954.pdf
[firstpage_image] =>[orig_patent_app_number] => 09830304
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/830304 | Electromechanical component | Apr 24, 2001 | Issued |
Array
(
[id] => 6174968
[patent_doc_number] => 20020155261
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-24
[patent_title] => 'Method for forming interconnect structure with low dielectric constant'
[patent_app_type] => new
[patent_app_number] => 09/840715
[patent_app_country] => US
[patent_app_date] => 2001-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1558
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0155/20020155261.pdf
[firstpage_image] =>[orig_patent_app_number] => 09840715
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/840715 | Method for forming interconnect structure with low dielectric constant | Apr 23, 2001 | Abandoned |
| 09/830263 | Copper-clad plate ans laser machining for copper-clad plate | Apr 22, 2001 | Abandoned |
Array
(
[id] => 6464222
[patent_doc_number] => 20020150741
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-17
[patent_title] => 'METHOD AND STRUCTURE FOR PRODUCING Z-AXIS INTERCONNECTION ASSEMBLY OF PRINTED WIRING BOARD ELEMENTS'
[patent_app_type] => new
[patent_app_number] => 09/834281
[patent_app_country] => US
[patent_app_date] => 2001-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2962
[patent_no_of_claims] => 54
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0150/20020150741.pdf
[firstpage_image] =>[orig_patent_app_number] => 09834281
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/834281 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Apr 11, 2001 | Issued |
Array
(
[id] => 6357346
[patent_doc_number] => 20020058131
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-16
[patent_title] => 'Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device'
[patent_app_type] => new
[patent_app_number] => 09/828080
[patent_app_country] => US
[patent_app_date] => 2001-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 12480
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 147
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0058/20020058131.pdf
[firstpage_image] =>[orig_patent_app_number] => 09828080
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/828080 | Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device | Apr 5, 2001 | Issued |
Array
(
[id] => 1325125
[patent_doc_number] => 06599576
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-29
[patent_title] => 'Decorative panels coated with two thermosetting material layers and its method of manufacture'
[patent_app_type] => B1
[patent_app_number] => 09/807056
[patent_app_country] => US
[patent_app_date] => 2001-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1042
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/599/06599576.pdf
[firstpage_image] =>[orig_patent_app_number] => 09807056
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/807056 | Decorative panels coated with two thermosetting material layers and its method of manufacture | Apr 5, 2001 | Issued |
Array
(
[id] => 1247218
[patent_doc_number] => 06673190
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-01-06
[patent_title] => 'Lasable bond-ply materials for high density printed wiring boards'
[patent_app_type] => B2
[patent_app_number] => 09/826718
[patent_app_country] => US
[patent_app_date] => 2001-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 5444
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 247
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/673/06673190.pdf
[firstpage_image] =>[orig_patent_app_number] => 09826718
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/826718 | Lasable bond-ply materials for high density printed wiring boards | Apr 3, 2001 | Issued |
Array
(
[id] => 956098
[patent_doc_number] => 06955848
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-10-18
[patent_title] => 'Curable composition and multilayered circuit substrate'
[patent_app_type] => utility
[patent_app_number] => 10/240400
[patent_app_country] => US
[patent_app_date] => 2001-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7314
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/955/06955848.pdf
[firstpage_image] =>[orig_patent_app_number] => 10240400
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/240400 | Curable composition and multilayered circuit substrate | Mar 29, 2001 | Issued |
Array
(
[id] => 6897506
[patent_doc_number] => 20010045671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-29
[patent_title] => 'Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition'
[patent_app_type] => new
[patent_app_number] => 09/819710
[patent_app_country] => US
[patent_app_date] => 2001-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 9435
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20010045671.pdf
[firstpage_image] =>[orig_patent_app_number] => 09819710
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/819710 | Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition | Mar 28, 2001 | Issued |
Array
(
[id] => 1005135
[patent_doc_number] => 06905726
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-06-14
[patent_title] => 'Component having at least two mutually adjacent insulating layers and corresponding production method'
[patent_app_type] => utility
[patent_app_number] => 09/817967
[patent_app_country] => US
[patent_app_date] => 2001-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3225
[patent_no_of_claims] => 12
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/905/06905726.pdf
[firstpage_image] =>[orig_patent_app_number] => 09817967
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/817967 | Component having at least two mutually adjacent insulating layers and corresponding production method | Mar 26, 2001 | Issued |
Array
(
[id] => 1287314
[patent_doc_number] => 06632512
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-10-14
[patent_title] => 'Ceramic substrate'
[patent_app_type] => B1
[patent_app_number] => 09/787954
[patent_app_country] => US
[patent_app_date] => 2001-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/632/06632512.pdf
[firstpage_image] =>[orig_patent_app_number] => 09787954
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/787954 | Ceramic substrate | Mar 22, 2001 | Issued |
Array
(
[id] => 1457702
[patent_doc_number] => 06426021
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-07-30
[patent_title] => 'Anisotropically electroconductive adhesive material and connecting method'
[patent_app_type] => B2
[patent_app_number] => 09/809279
[patent_app_country] => US
[patent_app_date] => 2001-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 3329
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/426/06426021.pdf
[firstpage_image] =>[orig_patent_app_number] => 09809279
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/809279 | Anisotropically electroconductive adhesive material and connecting method | Mar 15, 2001 | Issued |
Array
(
[id] => 5951078
[patent_doc_number] => 20020006526
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-17
[patent_title] => 'Aluminum silicon carbide and copper clad material and manufacturing process'
[patent_app_type] => new
[patent_app_number] => 09/802487
[patent_app_country] => US
[patent_app_date] => 2001-03-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 4253
[patent_no_of_claims] => 16
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20020006526.pdf
[firstpage_image] =>[orig_patent_app_number] => 09802487
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/802487 | Aluminum silicon carbide and copper clad material and manufacturing process | Mar 8, 2001 | Abandoned |
Array
(
[id] => 1593259
[patent_doc_number] => 06383613
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Decorative film and method for the production of the same'
[patent_app_type] => B1
[patent_app_number] => 09/786634
[patent_app_country] => US
[patent_app_date] => 2001-03-07
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[pdf_file] => patents/06/383/06383613.pdf
[firstpage_image] =>[orig_patent_app_number] => 09786634
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/786634 | Decorative film and method for the production of the same | Mar 6, 2001 | Issued |
Array
(
[id] => 5825207
[patent_doc_number] => 20020066583
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-06
[patent_title] => 'Electron device and semiconductor device'
[patent_app_type] => new
[patent_app_number] => 09/799486
[patent_app_country] => US
[patent_app_date] => 2001-03-07
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0066/20020066583.pdf
[firstpage_image] =>[orig_patent_app_number] => 09799486
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/799486 | Electron device and semiconductor device | Mar 6, 2001 | Issued |
Array
(
[id] => 7300380
[patent_doc_number] => 20040112634
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-17
[patent_title] => 'Method for plating polymer molding material, circuit forming component and method for producing circuit forming component'
[patent_app_type] => new
[patent_app_number] => 10/467338
[patent_app_country] => US
[patent_app_date] => 2003-12-12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0112/20040112634.pdf
[firstpage_image] =>[orig_patent_app_number] => 10467338
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/467338 | Circuit formation part and manufacturing method for this circuit formation part | Mar 1, 2001 | Issued |
Array
(
[id] => 6876603
[patent_doc_number] => 20010006756
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-07-05
[patent_title] => 'Circuit-forming charging powder and multilayer wiring board using the same'
[patent_app_type] => new-utility
[patent_app_number] => 09/794700
[patent_app_country] => US
[patent_app_date] => 2001-02-27
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[pdf_file] => publications/A1/0006/20010006756.pdf
[firstpage_image] =>[orig_patent_app_number] => 09794700
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/794700 | Circuit-forming charging powder and multilayer wiring board using the same | Feb 26, 2001 | Abandoned |
Array
(
[id] => 1409755
[patent_doc_number] => 06517745
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-11
[patent_title] => 'Nickel powder and conductive paste'
[patent_app_type] => B2
[patent_app_number] => 09/793133
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[pdf_file] => patents/06/517/06517745.pdf
[firstpage_image] =>[orig_patent_app_number] => 09793133
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/793133 | Nickel powder and conductive paste | Feb 26, 2001 | Issued |