Search

Cathy Fong Fong Lam

Examiner (ID: 16371)

Most Active Art Unit
1775
Art Unit(s)
1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508
Total Applications
1786
Issued Applications
1378
Pending Applications
45
Abandoned Applications
364

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7301772 [patent_doc_number] => 20040113749 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Ceramic component comprising an environmentally stable contact system' [patent_app_type] => new [patent_app_number] => 10/475455 [patent_app_country] => US [patent_app_date] => 2003-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2764 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20040113749.pdf [firstpage_image] =>[orig_patent_app_number] => 10475455 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/475455
Ceramic component comprising an environmentally stable contact system May 6, 2001 Issued
Array ( [id] => 1527639 [patent_doc_number] => 06479136 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-12 [patent_title] => 'Substrate of circuit board' [patent_app_type] => B1 [patent_app_number] => 09/831048 [patent_app_country] => US [patent_app_date] => 2001-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 9266 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/479/06479136.pdf [firstpage_image] =>[orig_patent_app_number] => 09831048 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/831048
Substrate of circuit board May 3, 2001 Issued
Array ( [id] => 1355850 [patent_doc_number] => 06572954 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-06-03 [patent_title] => 'Electromechanical component' [patent_app_type] => B1 [patent_app_number] => 09/830304 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2770 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/572/06572954.pdf [firstpage_image] =>[orig_patent_app_number] => 09830304 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/830304
Electromechanical component Apr 24, 2001 Issued
Array ( [id] => 6174968 [patent_doc_number] => 20020155261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-24 [patent_title] => 'Method for forming interconnect structure with low dielectric constant' [patent_app_type] => new [patent_app_number] => 09/840715 [patent_app_country] => US [patent_app_date] => 2001-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1558 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20020155261.pdf [firstpage_image] =>[orig_patent_app_number] => 09840715 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/840715
Method for forming interconnect structure with low dielectric constant Apr 23, 2001 Abandoned
09/830263 Copper-clad plate ans laser machining for copper-clad plate Apr 22, 2001 Abandoned
Array ( [id] => 6464222 [patent_doc_number] => 20020150741 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-17 [patent_title] => 'METHOD AND STRUCTURE FOR PRODUCING Z-AXIS INTERCONNECTION ASSEMBLY OF PRINTED WIRING BOARD ELEMENTS' [patent_app_type] => new [patent_app_number] => 09/834281 [patent_app_country] => US [patent_app_date] => 2001-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2962 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20020150741.pdf [firstpage_image] =>[orig_patent_app_number] => 09834281 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/834281
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Apr 11, 2001 Issued
Array ( [id] => 6357346 [patent_doc_number] => 20020058131 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-16 [patent_title] => 'Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device' [patent_app_type] => new [patent_app_number] => 09/828080 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 12480 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0058/20020058131.pdf [firstpage_image] =>[orig_patent_app_number] => 09828080 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/828080
Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device Apr 5, 2001 Issued
Array ( [id] => 1325125 [patent_doc_number] => 06599576 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-29 [patent_title] => 'Decorative panels coated with two thermosetting material layers and its method of manufacture' [patent_app_type] => B1 [patent_app_number] => 09/807056 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1042 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/599/06599576.pdf [firstpage_image] =>[orig_patent_app_number] => 09807056 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/807056
Decorative panels coated with two thermosetting material layers and its method of manufacture Apr 5, 2001 Issued
Array ( [id] => 1247218 [patent_doc_number] => 06673190 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-01-06 [patent_title] => 'Lasable bond-ply materials for high density printed wiring boards' [patent_app_type] => B2 [patent_app_number] => 09/826718 [patent_app_country] => US [patent_app_date] => 2001-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 5444 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/673/06673190.pdf [firstpage_image] =>[orig_patent_app_number] => 09826718 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826718
Lasable bond-ply materials for high density printed wiring boards Apr 3, 2001 Issued
Array ( [id] => 956098 [patent_doc_number] => 06955848 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-10-18 [patent_title] => 'Curable composition and multilayered circuit substrate' [patent_app_type] => utility [patent_app_number] => 10/240400 [patent_app_country] => US [patent_app_date] => 2001-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7314 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/955/06955848.pdf [firstpage_image] =>[orig_patent_app_number] => 10240400 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/240400
Curable composition and multilayered circuit substrate Mar 29, 2001 Issued
Array ( [id] => 6897506 [patent_doc_number] => 20010045671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-29 [patent_title] => 'Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition' [patent_app_type] => new [patent_app_number] => 09/819710 [patent_app_country] => US [patent_app_date] => 2001-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 9435 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20010045671.pdf [firstpage_image] =>[orig_patent_app_number] => 09819710 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/819710
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition Mar 28, 2001 Issued
Array ( [id] => 1005135 [patent_doc_number] => 06905726 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-14 [patent_title] => 'Component having at least two mutually adjacent insulating layers and corresponding production method' [patent_app_type] => utility [patent_app_number] => 09/817967 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3225 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/905/06905726.pdf [firstpage_image] =>[orig_patent_app_number] => 09817967 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/817967
Component having at least two mutually adjacent insulating layers and corresponding production method Mar 26, 2001 Issued
Array ( [id] => 1287314 [patent_doc_number] => 06632512 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-10-14 [patent_title] => 'Ceramic substrate' [patent_app_type] => B1 [patent_app_number] => 09/787954 [patent_app_country] => US [patent_app_date] => 2001-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 6617 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/632/06632512.pdf [firstpage_image] =>[orig_patent_app_number] => 09787954 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/787954
Ceramic substrate Mar 22, 2001 Issued
Array ( [id] => 1457702 [patent_doc_number] => 06426021 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-07-30 [patent_title] => 'Anisotropically electroconductive adhesive material and connecting method' [patent_app_type] => B2 [patent_app_number] => 09/809279 [patent_app_country] => US [patent_app_date] => 2001-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 3329 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426021.pdf [firstpage_image] =>[orig_patent_app_number] => 09809279 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/809279
Anisotropically electroconductive adhesive material and connecting method Mar 15, 2001 Issued
Array ( [id] => 5951078 [patent_doc_number] => 20020006526 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-17 [patent_title] => 'Aluminum silicon carbide and copper clad material and manufacturing process' [patent_app_type] => new [patent_app_number] => 09/802487 [patent_app_country] => US [patent_app_date] => 2001-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4253 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20020006526.pdf [firstpage_image] =>[orig_patent_app_number] => 09802487 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/802487
Aluminum silicon carbide and copper clad material and manufacturing process Mar 8, 2001 Abandoned
Array ( [id] => 1593259 [patent_doc_number] => 06383613 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Decorative film and method for the production of the same' [patent_app_type] => B1 [patent_app_number] => 09/786634 [patent_app_country] => US [patent_app_date] => 2001-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3631 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/383/06383613.pdf [firstpage_image] =>[orig_patent_app_number] => 09786634 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/786634
Decorative film and method for the production of the same Mar 6, 2001 Issued
Array ( [id] => 5825207 [patent_doc_number] => 20020066583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-06 [patent_title] => 'Electron device and semiconductor device' [patent_app_type] => new [patent_app_number] => 09/799486 [patent_app_country] => US [patent_app_date] => 2001-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7732 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0066/20020066583.pdf [firstpage_image] =>[orig_patent_app_number] => 09799486 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/799486
Electron device and semiconductor device Mar 6, 2001 Issued
Array ( [id] => 7300380 [patent_doc_number] => 20040112634 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Method for plating polymer molding material, circuit forming component and method for producing circuit forming component' [patent_app_type] => new [patent_app_number] => 10/467338 [patent_app_country] => US [patent_app_date] => 2003-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6634 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 19 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0112/20040112634.pdf [firstpage_image] =>[orig_patent_app_number] => 10467338 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/467338
Circuit formation part and manufacturing method for this circuit formation part Mar 1, 2001 Issued
Array ( [id] => 6876603 [patent_doc_number] => 20010006756 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-07-05 [patent_title] => 'Circuit-forming charging powder and multilayer wiring board using the same' [patent_app_type] => new-utility [patent_app_number] => 09/794700 [patent_app_country] => US [patent_app_date] => 2001-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3844 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20010006756.pdf [firstpage_image] =>[orig_patent_app_number] => 09794700 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/794700
Circuit-forming charging powder and multilayer wiring board using the same Feb 26, 2001 Abandoned
Array ( [id] => 1409755 [patent_doc_number] => 06517745 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-11 [patent_title] => 'Nickel powder and conductive paste' [patent_app_type] => B2 [patent_app_number] => 09/793133 [patent_app_country] => US [patent_app_date] => 2001-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6193 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/517/06517745.pdf [firstpage_image] =>[orig_patent_app_number] => 09793133 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/793133
Nickel powder and conductive paste Feb 26, 2001 Issued
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