| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 1564483
[patent_doc_number] => 06376053
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same'
[patent_app_type] => B1
[patent_app_number] => 09/721664
[patent_app_country] => US
[patent_app_date] => 2000-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 10899
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/376/06376053.pdf
[firstpage_image] =>[orig_patent_app_number] => 09721664
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/721664 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | Nov 26, 2000 | Issued |
Array
(
[id] => 1375559
[patent_doc_number] => 06530147
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-11
[patent_title] => 'Microfiber dielectrics which facilitate laser via drilling'
[patent_app_type] => B1
[patent_app_number] => 09/708131
[patent_app_country] => US
[patent_app_date] => 2000-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6155
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/530/06530147.pdf
[firstpage_image] =>[orig_patent_app_number] => 09708131
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/708131 | Microfiber dielectrics which facilitate laser via drilling | Nov 6, 2000 | Issued |
Array
(
[id] => 1207180
[patent_doc_number] => 06717262
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-04-06
[patent_title] => 'Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times'
[patent_app_type] => B1
[patent_app_number] => 09/705897
[patent_app_country] => US
[patent_app_date] => 2000-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 23
[patent_no_of_words] => 6858
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/717/06717262.pdf
[firstpage_image] =>[orig_patent_app_number] => 09705897
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/705897 | Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times | Nov 5, 2000 | Issued |
Array
(
[id] => 1449386
[patent_doc_number] => 06460753
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-08
[patent_title] => 'Bi-material assembly adhesively bonded at the ends and fabrication method'
[patent_app_type] => B1
[patent_app_number] => 09/703292
[patent_app_country] => US
[patent_app_date] => 2000-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 5907
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 16
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/460/06460753.pdf
[firstpage_image] =>[orig_patent_app_number] => 09703292
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/703292 | Bi-material assembly adhesively bonded at the ends and fabrication method | Oct 31, 2000 | Issued |
Array
(
[id] => 1502687
[patent_doc_number] => 06465085
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/699569
[patent_app_country] => US
[patent_app_date] => 2000-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 50
[patent_no_of_words] => 6996
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 7
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/465/06465085.pdf
[firstpage_image] =>[orig_patent_app_number] => 09699569
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/699569 | Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same | Oct 30, 2000 | Issued |
Array
(
[id] => 1489651
[patent_doc_number] => 06416904
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-09
[patent_title] => 'Calendered double side segment coated webs'
[patent_app_type] => B1
[patent_app_number] => 09/694167
[patent_app_country] => US
[patent_app_date] => 2000-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 5334
[patent_no_of_claims] => 12
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/416/06416904.pdf
[firstpage_image] =>[orig_patent_app_number] => 09694167
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/694167 | Calendered double side segment coated webs | Oct 22, 2000 | Issued |
Array
(
[id] => 1533976
[patent_doc_number] => 06489012
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-03
[patent_title] => 'Printed circuit board for RAMBUS'
[patent_app_type] => B1
[patent_app_number] => 09/693286
[patent_app_country] => US
[patent_app_date] => 2000-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4175
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/489/06489012.pdf
[firstpage_image] =>[orig_patent_app_number] => 09693286
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/693286 | Printed circuit board for RAMBUS | Oct 19, 2000 | Issued |
Array
(
[id] => 1573581
[patent_doc_number] => 06468448
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-22
[patent_title] => 'Conductive composition, conductive adhesive, and their mounting structure'
[patent_app_type] => B1
[patent_app_number] => 09/691183
[patent_app_country] => US
[patent_app_date] => 2000-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 6040
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/468/06468448.pdf
[firstpage_image] =>[orig_patent_app_number] => 09691183
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/691183 | Conductive composition, conductive adhesive, and their mounting structure | Oct 18, 2000 | Issued |
| 09/691246 | Low-reflective thin-film substrate | Oct 18, 2000 | Abandoned |
Array
(
[id] => 1405852
[patent_doc_number] => 06528179
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-04
[patent_title] => 'Reduction of chip carrier flexing during thermal cycling'
[patent_app_type] => B1
[patent_app_number] => 09/691935
[patent_app_country] => US
[patent_app_date] => 2000-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 8492
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/528/06528179.pdf
[firstpage_image] =>[orig_patent_app_number] => 09691935
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/691935 | Reduction of chip carrier flexing during thermal cycling | Oct 18, 2000 | Issued |
| 09/691113 | BASE SUBSTRATE FOR CRYSTAL GROWTH | Oct 18, 2000 | Abandoned |
| 90/005848 | MICROWAVE INTEGRATED CIRCUIT SUBSTRATE INCLUDING METAL FILLED VIA HOLES AND METHOD OF MANUFACTURE | Oct 17, 2000 | Issued |
Array
(
[id] => 1389567
[patent_doc_number] => 06541117
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-01
[patent_title] => 'Silicon epitaxial wafer and a method for producing it'
[patent_app_type] => B1
[patent_app_number] => 09/688090
[patent_app_country] => US
[patent_app_date] => 2000-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 5266
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 71
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/541/06541117.pdf
[firstpage_image] =>[orig_patent_app_number] => 09688090
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/688090 | Silicon epitaxial wafer and a method for producing it | Oct 15, 2000 | Issued |
Array
(
[id] => 1594356
[patent_doc_number] => 06492008
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-10
[patent_title] => 'Multilayer printed wiring board and electronic equipment'
[patent_app_type] => B1
[patent_app_number] => 09/686931
[patent_app_country] => US
[patent_app_date] => 2000-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 6680
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/492/06492008.pdf
[firstpage_image] =>[orig_patent_app_number] => 09686931
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/686931 | Multilayer printed wiring board and electronic equipment | Oct 11, 2000 | Issued |
Array
(
[id] => 1450180
[patent_doc_number] => 06455453
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-24
[patent_title] => 'Low-temperature sinterable ceramic composition and multilayer ceramic substrate'
[patent_app_type] => B1
[patent_app_number] => 09/684273
[patent_app_country] => US
[patent_app_date] => 2000-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/06/455/06455453.pdf
[firstpage_image] =>[orig_patent_app_number] => 09684273
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/684273 | Low-temperature sinterable ceramic composition and multilayer ceramic substrate | Oct 5, 2000 | Issued |
| 09/678556 | Electronic chip package | Oct 2, 2000 | Abandoned |
Array
(
[id] => 1594351
[patent_doc_number] => 06492007
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-10
[patent_title] => 'Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/666408
[patent_app_country] => US
[patent_app_date] => 2000-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/06/492/06492007.pdf
[firstpage_image] =>[orig_patent_app_number] => 09666408
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/666408 | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same | Sep 19, 2000 | Issued |
Array
(
[id] => 4323900
[patent_doc_number] => 06319592
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Decorative floor mat for use with chair'
[patent_app_type] => 1
[patent_app_number] => 9/665470
[patent_app_country] => US
[patent_app_date] => 2000-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1942
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[pdf_file] => patents/06/319/06319592.pdf
[firstpage_image] =>[orig_patent_app_number] => 665470
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/665470 | Decorative floor mat for use with chair | Sep 19, 2000 | Issued |
Array
(
[id] => 1458221
[patent_doc_number] => 06426143
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Moulded part and flexible film with a protected printed conductor, and method for producing the same'
[patent_app_type] => B1
[patent_app_number] => 09/646558
[patent_app_country] => US
[patent_app_date] => 2000-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/426/06426143.pdf
[firstpage_image] =>[orig_patent_app_number] => 09646558
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/646558 | Moulded part and flexible film with a protected printed conductor, and method for producing the same | Sep 18, 2000 | Issued |
Array
(
[id] => 4334823
[patent_doc_number] => 06333136
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-25
[patent_title] => 'Carrier film and process for producing the same'
[patent_app_type] => 1
[patent_app_number] => 9/661801
[patent_app_country] => US
[patent_app_date] => 2000-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2292
[patent_no_of_claims] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/333/06333136.pdf
[firstpage_image] =>[orig_patent_app_number] => 661801
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/661801 | Carrier film and process for producing the same | Sep 13, 2000 | Issued |