
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1536645
[patent_doc_number] => 06337375
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-08
[patent_title] => 'High optical contrast resin composition and electronic package utilizing same'
[patent_app_type] => B1
[patent_app_number] => 09/660851
[patent_app_country] => US
[patent_app_date] => 2000-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5703
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 212
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/337/06337375.pdf
[firstpage_image] =>[orig_patent_app_number] => 09660851
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/660851 | High optical contrast resin composition and electronic package utilizing same | Sep 12, 2000 | Issued |
Array
(
[id] => 1603245
[patent_doc_number] => 06433425
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-13
[patent_title] => 'Electronic package interconnect structure comprising lead-free solders'
[patent_app_type] => B1
[patent_app_number] => 09/660558
[patent_app_country] => US
[patent_app_date] => 2000-09-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 4791
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/433/06433425.pdf
[firstpage_image] =>[orig_patent_app_number] => 09660558
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/660558 | Electronic package interconnect structure comprising lead-free solders | Sep 11, 2000 | Issued |
Array
(
[id] => 1439606
[patent_doc_number] => 06495244
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-17
[patent_title] => 'Manufacturing fire retardant circuit boards without the use of fire retardant resin additives'
[patent_app_type] => B1
[patent_app_number] => 09/656489
[patent_app_country] => US
[patent_app_date] => 2000-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2579
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/495/06495244.pdf
[firstpage_image] =>[orig_patent_app_number] => 09656489
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/656489 | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives | Sep 6, 2000 | Issued |
Array
(
[id] => 1411663
[patent_doc_number] => 06521328
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-18
[patent_title] => 'Copper etching compositions and products derived therefrom'
[patent_app_type] => B1
[patent_app_number] => 09/654963
[patent_app_country] => US
[patent_app_date] => 2000-09-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5874
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/521/06521328.pdf
[firstpage_image] =>[orig_patent_app_number] => 09654963
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/654963 | Copper etching compositions and products derived therefrom | Sep 4, 2000 | Issued |
| 09/650802 | Method of manufacturing epitaxial silicon wafer | Aug 29, 2000 | Abandoned |
Array
(
[id] => 1286130
[patent_doc_number] => 06632343
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-10-14
[patent_title] => 'Method and apparatus for electrolytic plating of surface metals'
[patent_app_type] => B1
[patent_app_number] => 09/651040
[patent_app_country] => US
[patent_app_date] => 2000-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3364
[patent_no_of_claims] => 5
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/632/06632343.pdf
[firstpage_image] =>[orig_patent_app_number] => 09651040
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/651040 | Method and apparatus for electrolytic plating of surface metals | Aug 29, 2000 | Issued |
Array
(
[id] => 1476046
[patent_doc_number] => 06388204
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-14
[patent_title] => 'Composite laminate circuit structure and methods of interconnecting the same'
[patent_app_type] => B1
[patent_app_number] => 09/651010
[patent_app_country] => US
[patent_app_date] => 2000-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2980
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 245
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/388/06388204.pdf
[firstpage_image] =>[orig_patent_app_number] => 09651010
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/651010 | Composite laminate circuit structure and methods of interconnecting the same | Aug 28, 2000 | Issued |
Array
(
[id] => 4325811
[patent_doc_number] => 06312791
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-06
[patent_title] => 'Multilayer ceramic substrate with anchored pad'
[patent_app_type] => 1
[patent_app_number] => 9/648862
[patent_app_country] => US
[patent_app_date] => 2000-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 40
[patent_no_of_words] => 6783
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/312/06312791.pdf
[firstpage_image] =>[orig_patent_app_number] => 648862
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/648862 | Multilayer ceramic substrate with anchored pad | Aug 24, 2000 | Issued |
Array
(
[id] => 1535514
[patent_doc_number] => 06337123
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-08
[patent_title] => 'Multilayered ceramic substrate and method of producing the same'
[patent_app_type] => B1
[patent_app_number] => 09/644481
[patent_app_country] => US
[patent_app_date] => 2000-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 7546
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/337/06337123.pdf
[firstpage_image] =>[orig_patent_app_number] => 09644481
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/644481 | Multilayered ceramic substrate and method of producing the same | Aug 22, 2000 | Issued |
Array
(
[id] => 1493881
[patent_doc_number] => 06403201
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Substrate material for wiring and substrate material for printed circuit using the same'
[patent_app_type] => B1
[patent_app_number] => 09/626729
[patent_app_country] => US
[patent_app_date] => 2000-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 6266
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 100
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/403/06403201.pdf
[firstpage_image] =>[orig_patent_app_number] => 09626729
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/626729 | Substrate material for wiring and substrate material for printed circuit using the same | Jul 26, 2000 | Issued |
Array
(
[id] => 1544282
[patent_doc_number] => 06444297
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Method of producing a thick film metallization on an aluminum nitride substrate'
[patent_app_type] => B1
[patent_app_number] => 09/619458
[patent_app_country] => US
[patent_app_date] => 2000-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2024
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/444/06444297.pdf
[firstpage_image] =>[orig_patent_app_number] => 09619458
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/619458 | Method of producing a thick film metallization on an aluminum nitride substrate | Jul 18, 2000 | Issued |
Array
(
[id] => 1471724
[patent_doc_number] => 06407460
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-18
[patent_title] => 'Multilayer circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/616139
[patent_app_country] => US
[patent_app_date] => 2000-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/407/06407460.pdf
[firstpage_image] =>[orig_patent_app_number] => 09616139
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/616139 | Multilayer circuit board | Jul 12, 2000 | Issued |
Array
(
[id] => 1570196
[patent_doc_number] => 06377439
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Electronic multilayer ceramic component'
[patent_app_type] => B1
[patent_app_number] => 09/615651
[patent_app_country] => US
[patent_app_date] => 2000-07-13
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[pdf_file] => patents/06/377/06377439.pdf
[firstpage_image] =>[orig_patent_app_number] => 09615651
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/615651 | Electronic multilayer ceramic component | Jul 12, 2000 | Issued |
Array
(
[id] => 1397611
[patent_doc_number] => 06534161
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-18
[patent_title] => 'Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same'
[patent_app_type] => B1
[patent_app_number] => 09/614438
[patent_app_country] => US
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[pdf_file] => patents/06/534/06534161.pdf
[firstpage_image] =>[orig_patent_app_number] => 09614438
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/614438 | Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same | Jul 11, 2000 | Issued |
Array
(
[id] => 4401720
[patent_doc_number] => 06270879
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-07
[patent_title] => 'Release member for use in producing a multi-layer printed wiring board'
[patent_app_type] => 1
[patent_app_number] => 9/614600
[patent_app_country] => US
[patent_app_date] => 2000-07-12
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[pdf_file] => patents/06/270/06270879.pdf
[firstpage_image] =>[orig_patent_app_number] => 614600
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/614600 | Release member for use in producing a multi-layer printed wiring board | Jul 11, 2000 | Issued |
Array
(
[id] => 1497155
[patent_doc_number] => 06404052
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Multi-layer flexible printed wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/610674
[patent_app_country] => US
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[pdf_file] => patents/06/404/06404052.pdf
[firstpage_image] =>[orig_patent_app_number] => 09610674
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/610674 | Multi-layer flexible printed wiring board | Jul 6, 2000 | Issued |
Array
(
[id] => 1520237
[patent_doc_number] => 06413620
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-02
[patent_title] => 'Ceramic wiring substrate and method of producing the same'
[patent_app_type] => B1
[patent_app_number] => 09/607151
[patent_app_country] => US
[patent_app_date] => 2000-06-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/413/06413620.pdf
[firstpage_image] =>[orig_patent_app_number] => 09607151
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/607151 | Ceramic wiring substrate and method of producing the same | Jun 28, 2000 | Issued |
Array
(
[id] => 1514013
[patent_doc_number] => 06420017
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-16
[patent_title] => 'Rigid-printed wiring board and production method of the rigid-printed wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/599303
[patent_app_country] => US
[patent_app_date] => 2000-06-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/420/06420017.pdf
[firstpage_image] =>[orig_patent_app_number] => 09599303
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/599303 | Rigid-printed wiring board and production method of the rigid-printed wiring board | Jun 21, 2000 | Issued |
Array
(
[id] => 4322467
[patent_doc_number] => 06312566
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-06
[patent_title] => 'Plastic film and production method for plastic film'
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[pdf_file] => patents/06/312/06312566.pdf
[firstpage_image] =>[orig_patent_app_number] => 596571
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/596571 | Plastic film and production method for plastic film | Jun 15, 2000 | Issued |
Array
(
[id] => 1440392
[patent_doc_number] => 06334939
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-01
[patent_title] => 'Nanostructure-based high energy capacity material'
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[patent_app_number] => 09/594844
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[pdf_file] => patents/06/334/06334939.pdf
[firstpage_image] =>[orig_patent_app_number] => 09594844
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/594844 | Nanostructure-based high energy capacity material | Jun 14, 2000 | Issued |