
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4242227
[patent_doc_number] => 06136419
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-24
[patent_title] => 'Ceramic substrate having a sealed layer'
[patent_app_type] => 1
[patent_app_number] => 9/320532
[patent_app_country] => US
[patent_app_date] => 1999-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 3624
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/136/06136419.pdf
[firstpage_image] =>[orig_patent_app_number] => 320532
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/320532 | Ceramic substrate having a sealed layer | May 25, 1999 | Issued |
Array
(
[id] => 4231544
[patent_doc_number] => 06165612
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-26
[patent_title] => 'Thermally conductive interface layers'
[patent_app_type] => 1
[patent_app_number] => 9/312414
[patent_app_country] => US
[patent_app_date] => 1999-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 3607
[patent_no_of_claims] => 11
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[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/165/06165612.pdf
[firstpage_image] =>[orig_patent_app_number] => 312414
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/312414 | Thermally conductive interface layers | May 13, 1999 | Issued |
Array
(
[id] => 4290024
[patent_doc_number] => 06197407
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-06
[patent_title] => 'Circuit board and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/304714
[patent_app_country] => US
[patent_app_date] => 1999-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 12035
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/197/06197407.pdf
[firstpage_image] =>[orig_patent_app_number] => 304714
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/304714 | Circuit board and method of manufacturing the same | May 3, 1999 | Issued |
Array
(
[id] => 4127999
[patent_doc_number] => 06146749
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-14
[patent_title] => 'Low dielectric composition, insulating material, sealing material, and circuit board'
[patent_app_type] => 1
[patent_app_number] => 9/303604
[patent_app_country] => US
[patent_app_date] => 1999-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7784
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 88
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/146/06146749.pdf
[firstpage_image] =>[orig_patent_app_number] => 303604
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/303604 | Low dielectric composition, insulating material, sealing material, and circuit board | May 2, 1999 | Issued |
Array
(
[id] => 4354146
[patent_doc_number] => 06174591
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-16
[patent_title] => 'Separators with direct heating medium and method for manufacturing thermally curable laminates thereof'
[patent_app_type] => 1
[patent_app_number] => 9/302028
[patent_app_country] => US
[patent_app_date] => 1999-04-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 4485
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/174/06174591.pdf
[firstpage_image] =>[orig_patent_app_number] => 302028
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/302028 | Separators with direct heating medium and method for manufacturing thermally curable laminates thereof | Apr 28, 1999 | Issued |
Array
(
[id] => 4309146
[patent_doc_number] => 06242103
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-05
[patent_title] => 'Method for producing laminated film/metal structures'
[patent_app_type] => 1
[patent_app_number] => 9/301279
[patent_app_country] => US
[patent_app_date] => 1999-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 22
[patent_no_of_words] => 2731
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/242/06242103.pdf
[firstpage_image] =>[orig_patent_app_number] => 301279
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/301279 | Method for producing laminated film/metal structures | Apr 27, 1999 | Issued |
Array
(
[id] => 4355380
[patent_doc_number] => 06254971
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-03
[patent_title] => 'Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device'
[patent_app_type] => 1
[patent_app_number] => 9/202078
[patent_app_country] => US
[patent_app_date] => 1999-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 13
[patent_no_of_words] => 9833
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/254/06254971.pdf
[firstpage_image] =>[orig_patent_app_number] => 202078
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/202078 | Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device | Apr 22, 1999 | Issued |
Array
(
[id] => 4246915
[patent_doc_number] => 06166620
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-26
[patent_title] => 'Resistance wiring board and method for manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/242425
[patent_app_country] => US
[patent_app_date] => 1999-04-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 40
[patent_no_of_words] => 7902
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 7
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/166/06166620.pdf
[firstpage_image] =>[orig_patent_app_number] => 242425
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/242425 | Resistance wiring board and method for manufacturing the same | Apr 7, 1999 | Issued |
Array
(
[id] => 4279552
[patent_doc_number] => 06267797
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-31
[patent_title] => 'Sintering method'
[patent_app_type] => 1
[patent_app_number] => 9/214621
[patent_app_country] => US
[patent_app_date] => 1999-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 2207
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/267/06267797.pdf
[firstpage_image] =>[orig_patent_app_number] => 214621
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/214621 | Sintering method | Mar 31, 1999 | Issued |
Array
(
[id] => 4127896
[patent_doc_number] => 06146743
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-14
[patent_title] => 'Barrier metallization in ceramic substrate for implantable medical devices'
[patent_app_type] => 1
[patent_app_number] => 9/282131
[patent_app_country] => US
[patent_app_date] => 1999-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 16
[patent_no_of_words] => 14648
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 265
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/146/06146743.pdf
[firstpage_image] =>[orig_patent_app_number] => 282131
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/282131 | Barrier metallization in ceramic substrate for implantable medical devices | Mar 30, 1999 | Issued |
Array
(
[id] => 4405659
[patent_doc_number] => 06228465
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-08
[patent_title] => 'Process for producing multilayer wiring boards'
[patent_app_type] => 1
[patent_app_number] => 9/273265
[patent_app_country] => US
[patent_app_date] => 1999-03-22
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/228/06228465.pdf
[firstpage_image] =>[orig_patent_app_number] => 273265
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/273265 | Process for producing multilayer wiring boards | Mar 21, 1999 | Issued |
Array
(
[id] => 4315967
[patent_doc_number] => 06248459
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-19
[patent_title] => 'Semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon'
[patent_app_type] => 1
[patent_app_number] => 9/274268
[patent_app_country] => US
[patent_app_date] => 1999-03-22
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/248/06248459.pdf
[firstpage_image] =>[orig_patent_app_number] => 274268
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/274268 | Semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon | Mar 21, 1999 | Issued |
Array
(
[id] => 4422808
[patent_doc_number] => 06194788
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-27
[patent_title] => 'Flip chip with integrated flux and underfill'
[patent_app_type] => 1
[patent_app_number] => 9/266232
[patent_app_country] => US
[patent_app_date] => 1999-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/194/06194788.pdf
[firstpage_image] =>[orig_patent_app_number] => 266232
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/266232 | Flip chip with integrated flux and underfill | Mar 9, 1999 | Issued |
| 09/257643 | COMPOSITE MATERIAL USED IN MAKING PRINTED WIRING BOARDS | Feb 24, 1999 | Abandoned |
Array
(
[id] => 4265938
[patent_doc_number] => RE037085
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-06
[patent_title] => 'Some uses of microencapsulation for electric paper'
[patent_app_type] => 2
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[patent_app_country] => US
[patent_app_date] => 1999-02-17
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/037/RE037085.pdf
[firstpage_image] =>[orig_patent_app_number] => 252852
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/252852 | Some uses of microencapsulation for electric paper | Feb 16, 1999 | Issued |
Array
(
[id] => 1564487
[patent_doc_number] => 06376054
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Surface metallization structure for multiple chip test and burn-in'
[patent_app_type] => B1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/249985 | Surface metallization structure for multiple chip test and burn-in | Feb 9, 1999 | Issued |
Array
(
[id] => 4362836
[patent_doc_number] => 06274224
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-14
[patent_title] => 'Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article'
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[patent_app_number] => 9/241817
[patent_app_country] => US
[patent_app_date] => 1999-02-01
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[pdf_file] => patents/06/274/06274224.pdf
[firstpage_image] =>[orig_patent_app_number] => 241817
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/241817 | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article | Jan 31, 1999 | Issued |
Array
(
[id] => 4282606
[patent_doc_number] => 06210805
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-03
[patent_title] => 'Glass plate provided with a conductive layer, method for its production, conductive paste and window for an automobile'
[patent_app_type] => 1
[patent_app_number] => 9/236573
[patent_app_country] => US
[patent_app_date] => 1999-01-26
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[pdf_file] => patents/06/210/06210805.pdf
[firstpage_image] =>[orig_patent_app_number] => 236573
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/236573 | Glass plate provided with a conductive layer, method for its production, conductive paste and window for an automobile | Jan 25, 1999 | Issued |
Array
(
[id] => 4366734
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[patent_issue_date] => 2001-07-03
[patent_title] => 'Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/225542 | Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers | Jan 4, 1999 | Issued |
Array
(
[id] => 1544279
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[patent_issue_date] => 2002-09-03
[patent_title] => 'Method for improving integrated circuits bonding firmness'
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[patent_app_country] => US
[patent_app_date] => 1998-12-29
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[pdf_file] => patents/06/444/06444295.pdf
[firstpage_image] =>[orig_patent_app_number] => 09221569
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/221569 | Method for improving integrated circuits bonding firmness | Dec 28, 1998 | Issued |