
Cathy Fong Fong Lam
Examiner (ID: 16371)
| Most Active Art Unit | 1775 |
| Art Unit(s) | 1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508 |
| Total Applications | 1786 |
| Issued Applications | 1378 |
| Pending Applications | 45 |
| Abandoned Applications | 364 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3926642
[patent_doc_number] => 05928567
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Overvoltage protection material'
[patent_app_type] => 1
[patent_app_number] => 8/816015
[patent_app_country] => US
[patent_app_date] => 1997-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3199
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/928/05928567.pdf
[firstpage_image] =>[orig_patent_app_number] => 816015
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/816015 | Overvoltage protection material | Mar 10, 1997 | Issued |
Array
(
[id] => 4009222
[patent_doc_number] => 05879788
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-09
[patent_title] => 'Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof'
[patent_app_type] => 1
[patent_app_number] => 8/816032
[patent_app_country] => US
[patent_app_date] => 1997-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3480
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/879/05879788.pdf
[firstpage_image] =>[orig_patent_app_number] => 816032
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/816032 | Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof | Mar 10, 1997 | Issued |
Array
(
[id] => 4059342
[patent_doc_number] => 05866240
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-02
[patent_title] => 'Thick ceramic on metal multilayer circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/812172
[patent_app_country] => US
[patent_app_date] => 1997-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2898
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/866/05866240.pdf
[firstpage_image] =>[orig_patent_app_number] => 812172
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/812172 | Thick ceramic on metal multilayer circuit board | Mar 5, 1997 | Issued |
Array
(
[id] => 3975779
[patent_doc_number] => 05948533
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-07
[patent_title] => 'Vertically interconnected electronic assemblies and compositions useful therefor'
[patent_app_type] => 1
[patent_app_number] => 8/813809
[patent_app_country] => US
[patent_app_date] => 1997-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 6501
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/948/05948533.pdf
[firstpage_image] =>[orig_patent_app_number] => 813809
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/813809 | Vertically interconnected electronic assemblies and compositions useful therefor | Mar 5, 1997 | Issued |
Array
(
[id] => 3985358
[patent_doc_number] => 05910354
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-08
[patent_title] => 'Metallurgical interconnect composite'
[patent_app_type] => 1
[patent_app_number] => 8/810846
[patent_app_country] => US
[patent_app_date] => 1997-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 12
[patent_no_of_words] => 5197
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 37
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/910/05910354.pdf
[firstpage_image] =>[orig_patent_app_number] => 810846
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810846 | Metallurgical interconnect composite | Mar 3, 1997 | Issued |
Array
(
[id] => 3989695
[patent_doc_number] => 05985460
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-16
[patent_title] => 'Insulator composition, green tape, and method for forming plasma display apparatus barrier-rib'
[patent_app_type] => 1
[patent_app_number] => 8/802364
[patent_app_country] => US
[patent_app_date] => 1997-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 16
[patent_no_of_words] => 7421
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/985/05985460.pdf
[firstpage_image] =>[orig_patent_app_number] => 802364
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/802364 | Insulator composition, green tape, and method for forming plasma display apparatus barrier-rib | Feb 19, 1997 | Issued |
Array
(
[id] => 4014717
[patent_doc_number] => 05901901
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-11
[patent_title] => 'Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly'
[patent_app_type] => 1
[patent_app_number] => 8/802134
[patent_app_country] => US
[patent_app_date] => 1997-02-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1432
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/901/05901901.pdf
[firstpage_image] =>[orig_patent_app_number] => 802134
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/802134 | Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly | Feb 18, 1997 | Issued |
Array
(
[id] => 4389816
[patent_doc_number] => 06262458
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-17
[patent_title] => 'Low resistivity titanium silicide structures'
[patent_app_type] => 1
[patent_app_number] => 8/802884
[patent_app_country] => US
[patent_app_date] => 1997-02-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3371
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/262/06262458.pdf
[firstpage_image] =>[orig_patent_app_number] => 802884
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/802884 | Low resistivity titanium silicide structures | Feb 18, 1997 | Issued |
| 08/800128 | CIRCUIT SUBSTRATE, CIRCUIT-FORMED SUSPENSION SUBSTRATE, AND PRODUTION METHOD THEREOF | Feb 12, 1997 | Abandoned |
Array
(
[id] => 3771761
[patent_doc_number] => 05817405
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-06
[patent_title] => 'Circuitized substrate with same surface conductors of different resolutions'
[patent_app_type] => 1
[patent_app_number] => 8/795180
[patent_app_country] => US
[patent_app_date] => 1997-02-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 4559
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/817/05817405.pdf
[firstpage_image] =>[orig_patent_app_number] => 795180
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/795180 | Circuitized substrate with same surface conductors of different resolutions | Feb 3, 1997 | Issued |
Array
(
[id] => 4195166
[patent_doc_number] => 06085903
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-11
[patent_title] => 'Security packaging'
[patent_app_type] => 1
[patent_app_number] => 8/794275
[patent_app_country] => US
[patent_app_date] => 1997-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 3200
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/085/06085903.pdf
[firstpage_image] =>[orig_patent_app_number] => 794275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/794275 | Security packaging | Jan 30, 1997 | Issued |
Array
(
[id] => 3921719
[patent_doc_number] => 05945222
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board'
[patent_app_type] => 1
[patent_app_number] => 8/791813
[patent_app_country] => US
[patent_app_date] => 1997-01-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4598
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 30
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/945/05945222.pdf
[firstpage_image] =>[orig_patent_app_number] => 791813
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/791813 | Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board | Jan 29, 1997 | Issued |
| 08/786388 | SOLDERING PROCESS WITH MINIMAL THERMAL IMPACT ON SUBSTRATE | Jan 15, 1997 | Abandoned |
Array
(
[id] => 3995729
[patent_doc_number] => 05858517
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-12
[patent_title] => 'Electrodeposited copper foil for printed wiring board and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/783575
[patent_app_country] => US
[patent_app_date] => 1997-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 6522
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/858/05858517.pdf
[firstpage_image] =>[orig_patent_app_number] => 783575
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/783575 | Electrodeposited copper foil for printed wiring board and method of manufacturing the same | Jan 14, 1997 | Issued |
Array
(
[id] => 4082914
[patent_doc_number] => 06017628
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-01-25
[patent_title] => 'Metal-coated substrate articles responsive to electromagnetic radiation, and method of making and using the same'
[patent_app_type] => 1
[patent_app_number] => 8/776216
[patent_app_country] => US
[patent_app_date] => 1997-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 34
[patent_no_of_words] => 18250
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/017/06017628.pdf
[firstpage_image] =>[orig_patent_app_number] => 776216
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/776216 | Metal-coated substrate articles responsive to electromagnetic radiation, and method of making and using the same | Jan 7, 1997 | Issued |
Array
(
[id] => 3883642
[patent_doc_number] => 05714252
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-03
[patent_title] => 'Deformable substrate assembly for adhesively bonded electronic device'
[patent_app_type] => 1
[patent_app_number] => 8/778112
[patent_app_country] => US
[patent_app_date] => 1997-01-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 38
[patent_figures_cnt] => 40
[patent_no_of_words] => 8998
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/714/05714252.pdf
[firstpage_image] =>[orig_patent_app_number] => 778112
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/778112 | Deformable substrate assembly for adhesively bonded electronic device | Jan 1, 1997 | Issued |
Array
(
[id] => 3933883
[patent_doc_number] => 05981114
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Photoresist check patterns in highly integrated circuits having multi-level interconnect layers'
[patent_app_type] => 1
[patent_app_number] => 8/773615
[patent_app_country] => US
[patent_app_date] => 1996-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 3416
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/981/05981114.pdf
[firstpage_image] =>[orig_patent_app_number] => 773615
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/773615 | Photoresist check patterns in highly integrated circuits having multi-level interconnect layers | Dec 29, 1996 | Issued |
Array
(
[id] => 3922672
[patent_doc_number] => 05876842
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-02
[patent_title] => 'Modular circuit package having vertically aligned power and signal cores'
[patent_app_type] => 1
[patent_app_number] => 8/774849
[patent_app_country] => US
[patent_app_date] => 1996-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 7520
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 22
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/876/05876842.pdf
[firstpage_image] =>[orig_patent_app_number] => 774849
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/774849 | Modular circuit package having vertically aligned power and signal cores | Dec 26, 1996 | Issued |
Array
(
[id] => 4234289
[patent_doc_number] => 06090493
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-18
[patent_title] => 'Bismuth coating protection for copper'
[patent_app_type] => 1
[patent_app_number] => 8/704510
[patent_app_country] => US
[patent_app_date] => 1996-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3067
[patent_no_of_claims] => 43
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 23
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/090/06090493.pdf
[firstpage_image] =>[orig_patent_app_number] => 704510
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/704510 | Bismuth coating protection for copper | Dec 25, 1996 | Issued |
Array
(
[id] => 3977981
[patent_doc_number] => 05958556
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-28
[patent_title] => 'Vibration damped and stiffened circuit articles'
[patent_app_type] => 1
[patent_app_number] => 8/769987
[patent_app_country] => US
[patent_app_date] => 1996-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 36
[patent_no_of_words] => 18788
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 520
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/958/05958556.pdf
[firstpage_image] =>[orig_patent_app_number] => 769987
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/769987 | Vibration damped and stiffened circuit articles | Dec 18, 1996 | Issued |