Search

Cathy Fong Fong Lam

Examiner (ID: 16371)

Most Active Art Unit
1775
Art Unit(s)
1775, 1774, 1784, 1513, CSDC, 1794, 1317, 1508
Total Applications
1786
Issued Applications
1378
Pending Applications
45
Abandoned Applications
364

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3926642 [patent_doc_number] => 05928567 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Overvoltage protection material' [patent_app_type] => 1 [patent_app_number] => 8/816015 [patent_app_country] => US [patent_app_date] => 1997-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3199 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/928/05928567.pdf [firstpage_image] =>[orig_patent_app_number] => 816015 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/816015
Overvoltage protection material Mar 10, 1997 Issued
Array ( [id] => 4009222 [patent_doc_number] => 05879788 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-09 [patent_title] => 'Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof' [patent_app_type] => 1 [patent_app_number] => 8/816032 [patent_app_country] => US [patent_app_date] => 1997-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3480 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/879/05879788.pdf [firstpage_image] =>[orig_patent_app_number] => 816032 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/816032
Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof Mar 10, 1997 Issued
Array ( [id] => 4059342 [patent_doc_number] => 05866240 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-02 [patent_title] => 'Thick ceramic on metal multilayer circuit board' [patent_app_type] => 1 [patent_app_number] => 8/812172 [patent_app_country] => US [patent_app_date] => 1997-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2898 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/866/05866240.pdf [firstpage_image] =>[orig_patent_app_number] => 812172 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/812172
Thick ceramic on metal multilayer circuit board Mar 5, 1997 Issued
Array ( [id] => 3975779 [patent_doc_number] => 05948533 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Vertically interconnected electronic assemblies and compositions useful therefor' [patent_app_type] => 1 [patent_app_number] => 8/813809 [patent_app_country] => US [patent_app_date] => 1997-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 6501 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/948/05948533.pdf [firstpage_image] =>[orig_patent_app_number] => 813809 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/813809
Vertically interconnected electronic assemblies and compositions useful therefor Mar 5, 1997 Issued
Array ( [id] => 3985358 [patent_doc_number] => 05910354 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-08 [patent_title] => 'Metallurgical interconnect composite' [patent_app_type] => 1 [patent_app_number] => 8/810846 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 12 [patent_no_of_words] => 5197 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/910/05910354.pdf [firstpage_image] =>[orig_patent_app_number] => 810846 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/810846
Metallurgical interconnect composite Mar 3, 1997 Issued
Array ( [id] => 3989695 [patent_doc_number] => 05985460 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-16 [patent_title] => 'Insulator composition, green tape, and method for forming plasma display apparatus barrier-rib' [patent_app_type] => 1 [patent_app_number] => 8/802364 [patent_app_country] => US [patent_app_date] => 1997-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 16 [patent_no_of_words] => 7421 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/985/05985460.pdf [firstpage_image] =>[orig_patent_app_number] => 802364 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/802364
Insulator composition, green tape, and method for forming plasma display apparatus barrier-rib Feb 19, 1997 Issued
Array ( [id] => 4014717 [patent_doc_number] => 05901901 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-11 [patent_title] => 'Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly' [patent_app_type] => 1 [patent_app_number] => 8/802134 [patent_app_country] => US [patent_app_date] => 1997-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1432 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/901/05901901.pdf [firstpage_image] =>[orig_patent_app_number] => 802134 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/802134
Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly Feb 18, 1997 Issued
Array ( [id] => 4389816 [patent_doc_number] => 06262458 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-17 [patent_title] => 'Low resistivity titanium silicide structures' [patent_app_type] => 1 [patent_app_number] => 8/802884 [patent_app_country] => US [patent_app_date] => 1997-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3371 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/262/06262458.pdf [firstpage_image] =>[orig_patent_app_number] => 802884 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/802884
Low resistivity titanium silicide structures Feb 18, 1997 Issued
08/800128 CIRCUIT SUBSTRATE, CIRCUIT-FORMED SUSPENSION SUBSTRATE, AND PRODUTION METHOD THEREOF Feb 12, 1997 Abandoned
Array ( [id] => 3771761 [patent_doc_number] => 05817405 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Circuitized substrate with same surface conductors of different resolutions' [patent_app_type] => 1 [patent_app_number] => 8/795180 [patent_app_country] => US [patent_app_date] => 1997-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 4559 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/817/05817405.pdf [firstpage_image] =>[orig_patent_app_number] => 795180 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/795180
Circuitized substrate with same surface conductors of different resolutions Feb 3, 1997 Issued
Array ( [id] => 4195166 [patent_doc_number] => 06085903 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-11 [patent_title] => 'Security packaging' [patent_app_type] => 1 [patent_app_number] => 8/794275 [patent_app_country] => US [patent_app_date] => 1997-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3200 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/085/06085903.pdf [firstpage_image] =>[orig_patent_app_number] => 794275 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/794275
Security packaging Jan 30, 1997 Issued
Array ( [id] => 3921719 [patent_doc_number] => 05945222 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board' [patent_app_type] => 1 [patent_app_number] => 8/791813 [patent_app_country] => US [patent_app_date] => 1997-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4598 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/945/05945222.pdf [firstpage_image] =>[orig_patent_app_number] => 791813 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/791813
Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board Jan 29, 1997 Issued
08/786388 SOLDERING PROCESS WITH MINIMAL THERMAL IMPACT ON SUBSTRATE Jan 15, 1997 Abandoned
Array ( [id] => 3995729 [patent_doc_number] => 05858517 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-12 [patent_title] => 'Electrodeposited copper foil for printed wiring board and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/783575 [patent_app_country] => US [patent_app_date] => 1997-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 6522 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/858/05858517.pdf [firstpage_image] =>[orig_patent_app_number] => 783575 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/783575
Electrodeposited copper foil for printed wiring board and method of manufacturing the same Jan 14, 1997 Issued
Array ( [id] => 4082914 [patent_doc_number] => 06017628 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-25 [patent_title] => 'Metal-coated substrate articles responsive to electromagnetic radiation, and method of making and using the same' [patent_app_type] => 1 [patent_app_number] => 8/776216 [patent_app_country] => US [patent_app_date] => 1997-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 34 [patent_no_of_words] => 18250 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/017/06017628.pdf [firstpage_image] =>[orig_patent_app_number] => 776216 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/776216
Metal-coated substrate articles responsive to electromagnetic radiation, and method of making and using the same Jan 7, 1997 Issued
Array ( [id] => 3883642 [patent_doc_number] => 05714252 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-03 [patent_title] => 'Deformable substrate assembly for adhesively bonded electronic device' [patent_app_type] => 1 [patent_app_number] => 8/778112 [patent_app_country] => US [patent_app_date] => 1997-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 40 [patent_no_of_words] => 8998 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/714/05714252.pdf [firstpage_image] =>[orig_patent_app_number] => 778112 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/778112
Deformable substrate assembly for adhesively bonded electronic device Jan 1, 1997 Issued
Array ( [id] => 3933883 [patent_doc_number] => 05981114 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-09 [patent_title] => 'Photoresist check patterns in highly integrated circuits having multi-level interconnect layers' [patent_app_type] => 1 [patent_app_number] => 8/773615 [patent_app_country] => US [patent_app_date] => 1996-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3416 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/981/05981114.pdf [firstpage_image] =>[orig_patent_app_number] => 773615 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/773615
Photoresist check patterns in highly integrated circuits having multi-level interconnect layers Dec 29, 1996 Issued
Array ( [id] => 3922672 [patent_doc_number] => 05876842 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Modular circuit package having vertically aligned power and signal cores' [patent_app_type] => 1 [patent_app_number] => 8/774849 [patent_app_country] => US [patent_app_date] => 1996-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 7520 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/876/05876842.pdf [firstpage_image] =>[orig_patent_app_number] => 774849 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/774849
Modular circuit package having vertically aligned power and signal cores Dec 26, 1996 Issued
Array ( [id] => 4234289 [patent_doc_number] => 06090493 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-18 [patent_title] => 'Bismuth coating protection for copper' [patent_app_type] => 1 [patent_app_number] => 8/704510 [patent_app_country] => US [patent_app_date] => 1996-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3067 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/090/06090493.pdf [firstpage_image] =>[orig_patent_app_number] => 704510 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/704510
Bismuth coating protection for copper Dec 25, 1996 Issued
Array ( [id] => 3977981 [patent_doc_number] => 05958556 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-28 [patent_title] => 'Vibration damped and stiffened circuit articles' [patent_app_type] => 1 [patent_app_number] => 8/769987 [patent_app_country] => US [patent_app_date] => 1996-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 36 [patent_no_of_words] => 18788 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 520 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/958/05958556.pdf [firstpage_image] =>[orig_patent_app_number] => 769987 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/769987
Vibration damped and stiffened circuit articles Dec 18, 1996 Issued
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