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Charles H. Nolan Jr.

Examiner (ID: 16097)

Most Active Art Unit
2854
Art Unit(s)
2854
Total Applications
509
Issued Applications
466
Pending Applications
15
Abandoned Applications
27

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19436075 [patent_doc_number] => 20240304573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-12 [patent_title] => INTERCONNECT STRUCTURE FOR ADVANCED PACKAGING AND METHOD FOR THE SAME [patent_app_type] => utility [patent_app_number] => 18/300045 [patent_app_country] => US [patent_app_date] => 2023-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4341 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18300045 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/300045
Interconnect structure for advanced packaging and method for the same Apr 12, 2023 Issued
Array ( [id] => 20669075 [patent_doc_number] => 12610868 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-21 [patent_title] => Fan-out stacked semiconductor package structure and packaging method thereof [patent_app_type] => utility [patent_app_number] => 18/132571 [patent_app_country] => US [patent_app_date] => 2023-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 0 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 533 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18132571 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/132571
Fan-out stacked semiconductor package structure and packaging method thereof Apr 9, 2023 Issued
Array ( [id] => 18540921 [patent_doc_number] => 20230246032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/296793 [patent_app_country] => US [patent_app_date] => 2023-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11801 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18296793 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/296793
Semiconductor device and method of manufacturing the same Apr 5, 2023 Issued
Array ( [id] => 19064652 [patent_doc_number] => 11943929 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-26 [patent_title] => Semiconductor device and method for manufacturing semiconductor device [patent_app_type] => utility [patent_app_number] => 18/129120 [patent_app_country] => US [patent_app_date] => 2023-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 73 [patent_figures_cnt] => 183 [patent_no_of_words] => 50889 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18129120 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/129120
Semiconductor device and method for manufacturing semiconductor device Mar 30, 2023 Issued
Array ( [id] => 18958997 [patent_doc_number] => 20240047324 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/183699 [patent_app_country] => US [patent_app_date] => 2023-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18183699 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/183699
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Mar 13, 2023 Pending
Array ( [id] => 18812717 [patent_doc_number] => 20230387054 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/120866 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10169 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18120866 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/120866
SEMICONDUCTOR PACKAGE Mar 12, 2023 Pending
Array ( [id] => 19183851 [patent_doc_number] => 11990452 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/120587 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 12346 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18120587 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/120587
Semiconductor package Mar 12, 2023 Issued
Array ( [id] => 18951040 [patent_doc_number] => 11894346 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-06 [patent_title] => Semiconductor package having a high reliability [patent_app_type] => utility [patent_app_number] => 18/182246 [patent_app_country] => US [patent_app_date] => 2023-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 9277 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18182246 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/182246
Semiconductor package having a high reliability Mar 9, 2023 Issued
Array ( [id] => 18943569 [patent_doc_number] => 20240038708 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/120026 [patent_app_country] => US [patent_app_date] => 2023-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13051 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18120026 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/120026
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Mar 9, 2023 Pending
Array ( [id] => 19079525 [patent_doc_number] => 11948903 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-02 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/119397 [patent_app_country] => US [patent_app_date] => 2023-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9237 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18119397 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/119397
Semiconductor package Mar 8, 2023 Issued
Array ( [id] => 19436086 [patent_doc_number] => 20240304584 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-12 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/119270 [patent_app_country] => US [patent_app_date] => 2023-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9692 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18119270 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/119270
Package structure Mar 7, 2023 Issued
Array ( [id] => 19093977 [patent_doc_number] => 11955442 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Semiconductor package and method [patent_app_type] => utility [patent_app_number] => 18/174784 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 11840 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174784 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/174784
Semiconductor package and method Feb 26, 2023 Issued
Array ( [id] => 20705628 [patent_doc_number] => 12628354 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-12 [patent_title] => Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package [patent_app_type] => utility [patent_app_number] => 18/171428 [patent_app_country] => US [patent_app_date] => 2023-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 5523 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171428 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171428
Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package Feb 19, 2023 Issued
Array ( [id] => 18473220 [patent_doc_number] => 20230207508 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR PACKAGES HAVING VIAS [patent_app_type] => utility [patent_app_number] => 18/170857 [patent_app_country] => US [patent_app_date] => 2023-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5181 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18170857 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/170857
Semiconductor packages having vias Feb 16, 2023 Issued
Array ( [id] => 20175969 [patent_doc_number] => 12394725 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-19 [patent_title] => Electronic component, module, and method of manufacturing electronic component [patent_app_type] => utility [patent_app_number] => 18/169976 [patent_app_country] => US [patent_app_date] => 2023-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169976 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169976
Electronic component, module, and method of manufacturing electronic component Feb 15, 2023 Issued
Array ( [id] => 19100979 [patent_doc_number] => 20240120207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-11 [patent_title] => SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF [patent_app_type] => utility [patent_app_number] => 18/169573 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6655 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169573 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169573
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF Feb 14, 2023 Pending
Array ( [id] => 18789385 [patent_doc_number] => 20230378044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF [patent_app_type] => utility [patent_app_number] => 18/109337 [patent_app_country] => US [patent_app_date] => 2023-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2096 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109337 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/109337
Flip-chip bonding structure and substrate thereof Feb 13, 2023 Issued
Array ( [id] => 18890998 [patent_doc_number] => 11869775 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-09 [patent_title] => Semiconductor packages [patent_app_type] => utility [patent_app_number] => 18/169161 [patent_app_country] => US [patent_app_date] => 2023-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 9509 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 208 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169161 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169161
Semiconductor packages Feb 13, 2023 Issued
Array ( [id] => 20720308 [patent_doc_number] => 12635581 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-19 [patent_title] => Package structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/167095 [patent_app_country] => US [patent_app_date] => 2023-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 3326 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18167095 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/167095
Package structure and method for forming the same Feb 9, 2023 Issued
Array ( [id] => 18440097 [patent_doc_number] => 20230187392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => Redistribution Layers And Methods Of Fabricating The Same In Semiconductor Devices [patent_app_type] => utility [patent_app_number] => 18/166960 [patent_app_country] => US [patent_app_date] => 2023-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7951 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18166960 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/166960
Redistribution layers and methods of fabricating the same in semiconductor devices Feb 8, 2023 Issued
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