
Charles S. Bushey
Examiner (ID: 13847, Phone: (571)272-1153 , Office: P/1776 )
| Most Active Art Unit | 1776 |
| Art Unit(s) | 1724, 1776, 2899, 1305, 1797, 1754, 3621 |
| Total Applications | 3439 |
| Issued Applications | 2605 |
| Pending Applications | 241 |
| Abandoned Applications | 623 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 113689
[patent_doc_number] => 07714324
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-11
[patent_title] => 'Organic thin film transistor and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/527894
[patent_app_country] => US
[patent_app_date] => 2006-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 5005
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 259
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/714/07714324.pdf
[firstpage_image] =>[orig_patent_app_number] => 11527894
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/527894 | Organic thin film transistor and method of manufacturing the same | Sep 25, 2006 | Issued |
Array
(
[id] => 112294
[patent_doc_number] => 07713782
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-11
[patent_title] => 'Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps'
[patent_app_type] => utility
[patent_app_number] => 11/525493
[patent_app_country] => US
[patent_app_date] => 2006-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 6129
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[patent_maintenance] => 1
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[pdf_file] => patents/07/713/07713782.pdf
[firstpage_image] =>[orig_patent_app_number] => 11525493
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/525493 | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps | Sep 21, 2006 | Issued |
Array
(
[id] => 152392
[patent_doc_number] => 07683460
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-23
[patent_title] => 'Module with a shielding and/or heat dissipating element'
[patent_app_type] => utility
[patent_app_number] => 11/534374
[patent_app_country] => US
[patent_app_date] => 2006-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 5240
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/683/07683460.pdf
[firstpage_image] =>[orig_patent_app_number] => 11534374
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/534374 | Module with a shielding and/or heat dissipating element | Sep 21, 2006 | Issued |
Array
(
[id] => 5245191
[patent_doc_number] => 20070241425
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-18
[patent_title] => 'THREE-DIMENSIONAL CAPACITOR STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/468293
[patent_app_country] => US
[patent_app_date] => 2006-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 2686
[patent_no_of_claims] => 5
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[patent_words_short_claim] => 0
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0241/20070241425.pdf
[firstpage_image] =>[orig_patent_app_number] => 11468293
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/468293 | THREE-DIMENSIONAL CAPACITOR STRUCTURE | Aug 28, 2006 | Abandoned |
Array
(
[id] => 5217519
[patent_doc_number] => 20070158830
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Circuit module'
[patent_app_type] => utility
[patent_app_number] => 11/511733
[patent_app_country] => US
[patent_app_date] => 2006-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3218
[patent_no_of_claims] => 4
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[pdf_file] => publications/A1/0158/20070158830.pdf
[firstpage_image] =>[orig_patent_app_number] => 11511733
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/511733 | Circuit module | Aug 28, 2006 | Abandoned |
Array
(
[id] => 4667181
[patent_doc_number] => 20080042241
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-21
[patent_title] => 'Voltage-controlled semiconductor structure, resistor, and manufacturing processes thereof'
[patent_app_type] => utility
[patent_app_number] => 11/507293
[patent_app_country] => US
[patent_app_date] => 2006-08-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2763
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[pdf_file] => publications/A1/0042/20080042241.pdf
[firstpage_image] =>[orig_patent_app_number] => 11507293
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/507293 | Voltage-controlled semiconductor structure, resistor, and manufacturing processes thereof | Aug 20, 2006 | Issued |
Array
(
[id] => 4648798
[patent_doc_number] => 20080036053
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/463594
[patent_app_country] => US
[patent_app_date] => 2006-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1194
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20080036053.pdf
[firstpage_image] =>[orig_patent_app_number] => 11463594
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/463594 | REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE | Aug 9, 2006 | Abandoned |
Array
(
[id] => 5049028
[patent_doc_number] => 20070029572
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-08
[patent_title] => 'LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method'
[patent_app_type] => utility
[patent_app_number] => 11/497233
[patent_app_country] => US
[patent_app_date] => 2006-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 2897
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0029/20070029572.pdf
[firstpage_image] =>[orig_patent_app_number] => 11497233
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/497233 | LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method | Aug 1, 2006 | Abandoned |
Array
(
[id] => 5104380
[patent_doc_number] => 20070063255
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-22
[patent_title] => 'Non-volatile memory device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/492733
[patent_app_country] => US
[patent_app_date] => 2006-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4664
[patent_no_of_claims] => 13
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[pdf_file] => publications/A1/0063/20070063255.pdf
[firstpage_image] =>[orig_patent_app_number] => 11492733
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/492733 | Non-volatile memory device and method of manufacturing the same | Jul 24, 2006 | Abandoned |
Array
(
[id] => 152260
[patent_doc_number] => 07683397
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-23
[patent_title] => 'Semi-planar avalanche photodiode'
[patent_app_type] => utility
[patent_app_number] => 11/490994
[patent_app_country] => US
[patent_app_date] => 2006-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2599
[patent_no_of_claims] => 6
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[pdf_file] => patents/07/683/07683397.pdf
[firstpage_image] =>[orig_patent_app_number] => 11490994
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/490994 | Semi-planar avalanche photodiode | Jul 19, 2006 | Issued |
Array
(
[id] => 163104
[patent_doc_number] => 07671364
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-02
[patent_title] => 'Thin film transistor substrate for display unit'
[patent_app_type] => utility
[patent_app_number] => 11/489144
[patent_app_country] => US
[patent_app_date] => 2006-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/07/671/07671364.pdf
[firstpage_image] =>[orig_patent_app_number] => 11489144
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/489144 | Thin film transistor substrate for display unit | Jul 17, 2006 | Issued |
Array
(
[id] => 5202313
[patent_doc_number] => 20070023792
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-01
[patent_title] => 'Transistor and transistor manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 11/478854
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11478854
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/478854 | Transistor and transistor manufacturing method | Jul 2, 2006 | Issued |
Array
(
[id] => 1077318
[patent_doc_number] => 07615835
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-10
[patent_title] => 'Package for semiconductor acceleration sensor'
[patent_app_type] => utility
[patent_app_number] => 11/427784
[patent_app_country] => US
[patent_app_date] => 2006-06-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/615/07615835.pdf
[firstpage_image] =>[orig_patent_app_number] => 11427784
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/427784 | Package for semiconductor acceleration sensor | Jun 28, 2006 | Issued |
Array
(
[id] => 5168813
[patent_doc_number] => 20070069244
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Transistor Including Paramagnetic Impurities and Having Anti-Parallel Ferromagnetic Contacts'
[patent_app_type] => utility
[patent_app_number] => 11/427224
[patent_app_country] => US
[patent_app_date] => 2006-06-28
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[patent_drawing_sheets_cnt] => 3
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[firstpage_image] =>[orig_patent_app_number] => 11427224
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/427224 | Transistor including paramagnetic impurities and having anti-parallel ferromagnetic contacts | Jun 27, 2006 | Issued |
Array
(
[id] => 5602520
[patent_doc_number] => 20060292865
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-28
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/474933
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11474933
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/474933 | Semiconductor device | Jun 26, 2006 | Issued |
Array
(
[id] => 4992244
[patent_doc_number] => 20070007588
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[patent_issue_date] => 2007-01-11
[patent_title] => 'Insulated gate semiconductor device, protection circuit and their manufacturing method'
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[patent_app_number] => 11/471733
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[pdf_file] => publications/A1/0007/20070007588.pdf
[firstpage_image] =>[orig_patent_app_number] => 11471733
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/471733 | Insulated gate semiconductor device, protection circuit and their manufacturing method | Jun 20, 2006 | Abandoned |
Array
(
[id] => 5228232
[patent_doc_number] => 20070290339
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FOAMED-SOLDER BOND PADS IN CHIP PACKAGES, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME'
[patent_app_type] => utility
[patent_app_number] => 11/425353
[patent_app_country] => US
[patent_app_date] => 2006-06-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0290/20070290339.pdf
[firstpage_image] =>[orig_patent_app_number] => 11425353
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/425353 | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same | Jun 19, 2006 | Issued |
Array
(
[id] => 5202354
[patent_doc_number] => 20070023833
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[patent_issue_date] => 2007-02-01
[patent_title] => 'Method for reading a memory cell having an electrically floating body transistor, and memory cell and array implementing same'
[patent_app_type] => utility
[patent_app_number] => 11/453594
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/453594 | Method for reading a memory cell having an electrically floating body transistor, and memory cell and array implementing same | Jun 14, 2006 | Abandoned |
Array
(
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[patent_title] => 'Memory device and a method of forming a memory device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/448134 | Memory device and a method of forming a memory device | Jun 6, 2006 | Abandoned |
Array
(
[id] => 5157442
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[patent_issue_date] => 2007-07-26
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED CONTACT AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/420203
[patent_app_country] => US
[patent_app_date] => 2006-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[firstpage_image] =>[orig_patent_app_number] => 11420203
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/420203 | Semiconductor device having self-aligned contact and method of fabricating the same | May 23, 2006 | Issued |