
Chris C. Chu
Examiner (ID: 8603)
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815 |
| Total Applications | 1003 |
| Issued Applications | 778 |
| Pending Applications | 1 |
| Abandoned Applications | 227 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8257540
[patent_doc_number] => 08207018
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-26
[patent_title] => 'Semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 12/903482
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[patent_app_date] => 2010-10-13
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12903482
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Array
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[patent_doc_number] => 20110084410
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[patent_title] => 'Wiring Substrate for a Semiconductor Chip, and Semiconducotor Package Having the Wiring Substrate'
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[patent_app_number] => 12/901129
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/901129 | Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate | Oct 7, 2010 | Issued |
Array
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[patent_doc_number] => 20110084382
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[patent_issue_date] => 2011-04-14
[patent_title] => 'CHIP PACKAGE AND FABRICATION METHOD THEREOF'
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Array
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Array
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Array
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Array
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Array
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[patent_title] => 'Method for Packaging Semiconductor Dies Having Through-Silicon Vias'
[patent_app_type] => utility
[patent_app_number] => 12/883910
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[patent_app_date] => 2010-09-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/883910 | Method for packaging semiconductor dies having through-silicon vias | Sep 15, 2010 | Issued |
Array
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[id] => 8165843
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/882805 | Stacked multi-chip | Sep 14, 2010 | Issued |
Array
(
[id] => 9504285
[patent_doc_number] => 08742603
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[patent_kind] => B2
[patent_issue_date] => 2014-06-03
[patent_title] => 'Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)'
[patent_app_type] => utility
[patent_app_number] => 12/882525
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Array
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[patent_doc_number] => 20120061859
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULANT CONTAINMENT AND METHOD OF MANUFACTURE THEREOF'
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Array
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[id] => 6007549
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Array
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Array
(
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[patent_title] => 'Electronic Packaging With A Variable Thickness Mold Cap'
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Array
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Array
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[patent_title] => 'Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die'
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Array
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Array
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