
Chris C. Chu
Examiner (ID: 8603)
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815 |
| Total Applications | 1003 |
| Issued Applications | 778 |
| Pending Applications | 1 |
| Abandoned Applications | 227 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
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[id] => 9140903
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[patent_title] => 'Method and system for forming conductive bumping with copper interconnection'
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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