Search

Chris C. Chu

Examiner (ID: 8603)

Most Active Art Unit
2815
Art Unit(s)
2815
Total Applications
1003
Issued Applications
778
Pending Applications
1
Abandoned Applications
227

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9140903 [patent_doc_number] => 08581366 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-12 [patent_title] => 'Method and system for forming conductive bumping with copper interconnection' [patent_app_type] => utility [patent_app_number] => 13/645448 [patent_app_country] => US [patent_app_date] => 2012-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 5370 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13645448 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/645448
Method and system for forming conductive bumping with copper interconnection Oct 3, 2012 Issued
Array ( [id] => 8994863 [patent_doc_number] => 08518747 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-08-27 [patent_title] => 'Stackable semiconductor assemblies and methods of manufacturing such assemblies' [patent_app_type] => utility [patent_app_number] => 13/619409 [patent_app_country] => US [patent_app_date] => 2012-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 5308 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13619409 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/619409
Stackable semiconductor assemblies and methods of manufacturing such assemblies Sep 13, 2012 Issued
Array ( [id] => 9524790 [patent_doc_number] => 08749066 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-10 [patent_title] => 'Semiconductor constructions' [patent_app_type] => utility [patent_app_number] => 13/615170 [patent_app_country] => US [patent_app_date] => 2012-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 37 [patent_no_of_words] => 5923 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13615170 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/615170
Semiconductor constructions Sep 12, 2012 Issued
Array ( [id] => 8563747 [patent_doc_number] => 20120326318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-27 [patent_title] => 'BURIED METAL-SEMICONDUCTOR ALLOY LAYERS AND STRUCTURES AND METHODS FOR FABRICATION THEREOF' [patent_app_type] => utility [patent_app_number] => 13/607869 [patent_app_country] => US [patent_app_date] => 2012-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 7357 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13607869 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/607869
Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof Sep 9, 2012 Issued
Array ( [id] => 9582933 [patent_doc_number] => 08772935 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-08 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/598156 [patent_app_country] => US [patent_app_date] => 2012-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 4299 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13598156 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/598156
Semiconductor device and method of manufacturing the same Aug 28, 2012 Issued
Array ( [id] => 9335141 [patent_doc_number] => 20140061923 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'STRUCTURE TO INCREASE RESISTANCE TO ELECTROMIGRATION' [patent_app_type] => utility [patent_app_number] => 13/598196 [patent_app_country] => US [patent_app_date] => 2012-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5935 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13598196 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/598196
Structure to increase resistance to electromigration Aug 28, 2012 Issued
Array ( [id] => 10832028 [patent_doc_number] => 08860202 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-14 [patent_title] => 'Chip stack structure and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 13/597669 [patent_app_country] => US [patent_app_date] => 2012-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 24 [patent_no_of_words] => 3319 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13597669 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/597669
Chip stack structure and manufacturing method thereof Aug 28, 2012 Issued
Array ( [id] => 8851012 [patent_doc_number] => 20130140687 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-06-06 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/596465 [patent_app_country] => US [patent_app_date] => 2012-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4776 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13596465 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/596465
Semiconductor device Aug 27, 2012 Issued
Array ( [id] => 8680928 [patent_doc_number] => 20130049212 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-28 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/596859 [patent_app_country] => US [patent_app_date] => 2012-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 8037 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13596859 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/596859
Semiconductor device Aug 27, 2012 Issued
Array ( [id] => 8705488 [patent_doc_number] => 20130062777 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-03-14 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE' [patent_app_type] => utility [patent_app_number] => 13/592540 [patent_app_country] => US [patent_app_date] => 2012-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 11713 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13592540 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/592540
Semiconductor integrated circuit device Aug 22, 2012 Issued
Array ( [id] => 10838603 [patent_doc_number] => 08866283 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-21 [patent_title] => 'Chip package structure and method of making the same' [patent_app_type] => utility [patent_app_number] => 13/588254 [patent_app_country] => US [patent_app_date] => 2012-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3855 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13588254 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/588254
Chip package structure and method of making the same Aug 16, 2012 Issued
Array ( [id] => 8838978 [patent_doc_number] => 20130134606 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-05-30 [patent_title] => 'SEMICONDUCTOR PACKAGES' [patent_app_type] => utility [patent_app_number] => 13/587330 [patent_app_country] => US [patent_app_date] => 2012-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 8460 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13587330 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/587330
Semiconductor packages Aug 15, 2012 Issued
Array ( [id] => 9060516 [patent_doc_number] => 08546955 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-10-01 [patent_title] => 'Multi-die stack package' [patent_app_type] => utility [patent_app_number] => 13/587716 [patent_app_country] => US [patent_app_date] => 2012-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 15 [patent_no_of_words] => 6863 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13587716 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/587716
Multi-die stack package Aug 15, 2012 Issued
Array ( [id] => 8995637 [patent_doc_number] => 08519524 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-08-27 [patent_title] => 'Chip stacking structure and fabricating method of the chip stacking structure' [patent_app_type] => utility [patent_app_number] => 13/586890 [patent_app_country] => US [patent_app_date] => 2012-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 20 [patent_no_of_words] => 3772 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13586890 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/586890
Chip stacking structure and fabricating method of the chip stacking structure Aug 15, 2012 Issued
Array ( [id] => 8509724 [patent_doc_number] => 20120309132 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-06 [patent_title] => 'CURVILINEAR HEAT SPREADER/LID WITH IMPROVED HEAT DISSIPATION' [patent_app_type] => utility [patent_app_number] => 13/586421 [patent_app_country] => US [patent_app_date] => 2012-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2299 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13586421 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/586421
Curvilinear heat spreader/lid with improved heat dissipation Aug 14, 2012 Issued
Array ( [id] => 9323449 [patent_doc_number] => 08658468 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-25 [patent_title] => 'Method for fabricating a semiconductor and semiconductor package' [patent_app_type] => utility [patent_app_number] => 13/570986 [patent_app_country] => US [patent_app_date] => 2012-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 7179 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13570986 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/570986
Method for fabricating a semiconductor and semiconductor package Aug 8, 2012 Issued
Array ( [id] => 9575955 [patent_doc_number] => 08766372 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-01 [patent_title] => 'Copper-filled trench contact for transistor performance improvement' [patent_app_type] => utility [patent_app_number] => 13/569150 [patent_app_country] => US [patent_app_date] => 2012-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 23 [patent_no_of_words] => 7103 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13569150 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/569150
Copper-filled trench contact for transistor performance improvement Aug 6, 2012 Issued
Array ( [id] => 9167285 [patent_doc_number] => 08592968 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-26 [patent_title] => 'Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method' [patent_app_type] => utility [patent_app_number] => 13/563560 [patent_app_country] => US [patent_app_date] => 2012-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 2862 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13563560 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/563560
Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method Jul 30, 2012 Issued
Array ( [id] => 8462631 [patent_doc_number] => 20120267799 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-25 [patent_title] => 'PACKAGE STRUCTURES' [patent_app_type] => utility [patent_app_number] => 13/539775 [patent_app_country] => US [patent_app_date] => 2012-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3144 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13539775 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/539775
Package structures Jul 1, 2012 Issued
Array ( [id] => 9663012 [patent_doc_number] => 08809996 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-19 [patent_title] => 'Package with passive devices and method of forming the same' [patent_app_type] => utility [patent_app_number] => 13/539149 [patent_app_country] => US [patent_app_date] => 2012-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 3848 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13539149 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/539149
Package with passive devices and method of forming the same Jun 28, 2012 Issued
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