
Chris C. Chu
Examiner (ID: 8603)
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815 |
| Total Applications | 1003 |
| Issued Applications | 778 |
| Pending Applications | 1 |
| Abandoned Applications | 227 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8465198
[patent_doc_number] => 20120270367
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[patent_issue_date] => 2012-10-25
[patent_title] => 'Component Stacking for Integrated Circuit Electronic Package'
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Array
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[patent_title] => 'Hybrid package transmission line circuits'
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Array
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[patent_title] => 'Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/535377 | Through-substrate via having a strip-shaped through-hole signal conductor | Jun 27, 2012 | Issued |
Array
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[patent_title] => 'Chip package and method for assembling chip package'
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/530578 | SEMICONDUCTOR STACK PACKAGE APPARATUS | Jun 21, 2012 | Abandoned |
Array
(
[id] => 8450888
[patent_doc_number] => 20120261834
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/530131 | SEMICONDUCTOR DEVICE | Jun 21, 2012 | Abandoned |
Array
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[id] => 9621379
[patent_doc_number] => 08791554
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[patent_title] => 'Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates'
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Array
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[id] => 9413421
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[patent_title] => 'Devices and methods for stacking individually tested devices to form multi-chip electronic modules'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/529267 | Devices and methods for stacking individually tested devices to form multi-chip electronic modules | Jun 20, 2012 | Issued |
Array
(
[id] => 8932502
[patent_doc_number] => 08492200
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[patent_title] => 'Method for fabricating a semiconductor and semiconductor package'
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Array
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Array
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Array
(
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Array
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