Search

Christina A. Sylvia

Examiner (ID: 11914, Phone: (571)272-7474 , Office: P/2895 )

Most Active Art Unit
2895
Art Unit(s)
2895, 2817
Total Applications
852
Issued Applications
700
Pending Applications
93
Abandoned Applications
95

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20080897 [patent_doc_number] => 12354974 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => Semiconductor package including photo imageable dielectric [patent_app_type] => utility [patent_app_number] => 17/956153 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 1091 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956153 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/956153
Semiconductor package including photo imageable dielectric Sep 28, 2022 Issued
Array ( [id] => 20080897 [patent_doc_number] => 12354974 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => Semiconductor package including photo imageable dielectric [patent_app_type] => utility [patent_app_number] => 17/956153 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 1091 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956153 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/956153
Semiconductor package including photo imageable dielectric Sep 28, 2022 Issued
Array ( [id] => 19071234 [patent_doc_number] => 20240105660 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 17/936132 [patent_app_country] => US [patent_app_date] => 2022-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5579 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936132 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/936132
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR Sep 27, 2022 Pending
Array ( [id] => 18898703 [patent_doc_number] => 20240014188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/951722 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8143 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17951722 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/951722
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD Sep 22, 2022 Pending
Array ( [id] => 19071262 [patent_doc_number] => 20240105688 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION [patent_app_type] => utility [patent_app_number] => 17/952163 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18187 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952163 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/952163
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION Sep 22, 2022 Pending
Array ( [id] => 18898703 [patent_doc_number] => 20240014188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/951722 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8143 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17951722 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/951722
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD Sep 22, 2022 Pending
Array ( [id] => 19071262 [patent_doc_number] => 20240105688 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION [patent_app_type] => utility [patent_app_number] => 17/952163 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18187 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952163 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/952163
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION Sep 22, 2022 Pending
Array ( [id] => 18555314 [patent_doc_number] => 20230253331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/897523 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4091 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17897523 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/897523
Electronic package and manufacturing method thereof Aug 28, 2022 Issued
Array ( [id] => 18555314 [patent_doc_number] => 20230253331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/897523 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4091 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17897523 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/897523
Electronic package and manufacturing method thereof Aug 28, 2022 Issued
Array ( [id] => 19007922 [patent_doc_number] => 20240071993 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORTIONS [patent_app_type] => utility [patent_app_number] => 17/894057 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24950 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17894057 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/894057
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORTIONS Aug 22, 2022 Pending
Array ( [id] => 18335546 [patent_doc_number] => 20230127494 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => SIGNAL-HEAT SEPARATED TMV PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/821725 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8876 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17821725 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/821725
SIGNAL-HEAT SEPARATED TMV PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF Aug 22, 2022 Pending
Array ( [id] => 20259073 [patent_doc_number] => 12431438 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Semiconductor device and method for partial EMI shielding [patent_app_type] => utility [patent_app_number] => 17/820957 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 23 [patent_no_of_words] => 0 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820957 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/820957
Semiconductor device and method for partial EMI shielding Aug 18, 2022 Issued
Array ( [id] => 18991225 [patent_doc_number] => 20240063194 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => Semiconductor Device and Method of Forming Module-in-Package Structure Using Redistribution Layer [patent_app_type] => utility [patent_app_number] => 17/820502 [patent_app_country] => US [patent_app_date] => 2022-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5194 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820502 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/820502
Semiconductor Device and Method of Forming Module-in-Package Structure Using Redistribution Layer Aug 16, 2022 Pending
Array ( [id] => 18991129 [patent_doc_number] => 20240063098 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/889358 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9962 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17889358 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/889358
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Aug 15, 2022 Pending
Array ( [id] => 18297417 [patent_doc_number] => 20230107103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-06 [patent_title] => SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP [patent_app_type] => utility [patent_app_number] => 17/887587 [patent_app_country] => US [patent_app_date] => 2022-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7202 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17887587 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/887587
SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP Aug 14, 2022 Pending
Array ( [id] => 18297417 [patent_doc_number] => 20230107103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-06 [patent_title] => SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP [patent_app_type] => utility [patent_app_number] => 17/887587 [patent_app_country] => US [patent_app_date] => 2022-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7202 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17887587 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/887587
SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP Aug 14, 2022 Pending
Array ( [id] => 18040138 [patent_doc_number] => 20220384355 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => Semiconductor Devices and Methods of Manufacture [patent_app_type] => utility [patent_app_number] => 17/818797 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11415 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818797 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/818797
Semiconductor devices and methods of manufacture Aug 9, 2022 Issued
Array ( [id] => 18943544 [patent_doc_number] => 20240038683 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 17/815638 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4340 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17815638 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/815638
Semiconductor device with stress relief feature and method therefor Jul 27, 2022 Issued
Array ( [id] => 20216192 [patent_doc_number] => 12412846 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-09 [patent_title] => Semiconductor package and methods of fabricating a semiconductor package [patent_app_type] => utility [patent_app_number] => 17/873135 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 6458 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873135 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873135
Semiconductor package and methods of fabricating a semiconductor package Jul 24, 2022 Issued
Array ( [id] => 19414865 [patent_doc_number] => 12080702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Method of fabricating package structure [patent_app_type] => utility [patent_app_number] => 17/873073 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 22 [patent_no_of_words] => 8090 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873073 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873073
Method of fabricating package structure Jul 24, 2022 Issued
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