Search

Christina A. Sylvia

Examiner (ID: 14390, Phone: (571)272-7474 , Office: P/2895 )

Most Active Art Unit
2895
Art Unit(s)
2895, 2817
Total Applications
885
Issued Applications
727
Pending Applications
84
Abandoned Applications
97

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20259073 [patent_doc_number] => 12431438 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Semiconductor device and method for partial EMI shielding [patent_app_type] => utility [patent_app_number] => 17/820957 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 23 [patent_no_of_words] => 0 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820957 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/820957
Semiconductor device and method for partial EMI shielding Aug 18, 2022 Issued
Array ( [id] => 18991225 [patent_doc_number] => 20240063194 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => Semiconductor Device and Method of Forming Module-in-Package Structure Using Redistribution Layer [patent_app_type] => utility [patent_app_number] => 17/820502 [patent_app_country] => US [patent_app_date] => 2022-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5194 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820502 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/820502
Semiconductor device and method of forming module-in-package structure using redistribution layer Aug 16, 2022 Issued
Array ( [id] => 20583202 [patent_doc_number] => 12575465 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-10 [patent_title] => Semiconductor package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/889358 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4596 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17889358 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/889358
Semiconductor package and manufacturing method thereof Aug 15, 2022 Issued
Array ( [id] => 18297417 [patent_doc_number] => 20230107103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-06 [patent_title] => SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP [patent_app_type] => utility [patent_app_number] => 17/887587 [patent_app_country] => US [patent_app_date] => 2022-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7202 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17887587 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/887587
SYSTEM ON CHIP HAVING THREE-DIMENSIONAL CHIPLET STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SYSTEM ON CHIP Aug 14, 2022 Pending
Array ( [id] => 18040138 [patent_doc_number] => 20220384355 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => Semiconductor Devices and Methods of Manufacture [patent_app_type] => utility [patent_app_number] => 17/818797 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11415 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818797 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/818797
Semiconductor devices and methods of manufacture Aug 9, 2022 Issued
Array ( [id] => 18943544 [patent_doc_number] => 20240038683 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 17/815638 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4340 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17815638 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/815638
Semiconductor device with stress relief feature and method therefor Jul 27, 2022 Issued
Array ( [id] => 18147575 [patent_doc_number] => 20230021432 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/872473 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9689 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17872473 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/872473
Chip package assembly, electronic device, and preparation method of chip package assembly Jul 24, 2022 Issued
Array ( [id] => 20216192 [patent_doc_number] => 12412846 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-09 [patent_title] => Semiconductor package and methods of fabricating a semiconductor package [patent_app_type] => utility [patent_app_number] => 17/873135 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 6458 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873135 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873135
Semiconductor package and methods of fabricating a semiconductor package Jul 24, 2022 Issued
Array ( [id] => 19414865 [patent_doc_number] => 12080702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Method of fabricating package structure [patent_app_type] => utility [patent_app_number] => 17/873073 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 22 [patent_no_of_words] => 8090 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873073 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873073
Method of fabricating package structure Jul 24, 2022 Issued
Array ( [id] => 19812417 [patent_doc_number] => 12243830 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-04 [patent_title] => Semiconductor devices and methods of manufacture [patent_app_type] => utility [patent_app_number] => 17/870104 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 12332 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17870104 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/870104
Semiconductor devices and methods of manufacture Jul 20, 2022 Issued
Array ( [id] => 20259072 [patent_doc_number] => 12431437 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation [patent_app_type] => utility [patent_app_number] => 17/814121 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 37 [patent_no_of_words] => 1911 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17814121 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/814121
Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation Jul 20, 2022 Issued
Array ( [id] => 17993368 [patent_doc_number] => 20220359405 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => PACKAGE-ON-PACKAGE DEVICE [patent_app_type] => utility [patent_app_number] => 17/813896 [patent_app_country] => US [patent_app_date] => 2022-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15269 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17813896 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/813896
Package-on-package device Jul 19, 2022 Issued
Array ( [id] => 17993369 [patent_doc_number] => 20220359406 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => Semiconductor Packages and Method of Manufacture [patent_app_type] => utility [patent_app_number] => 17/869286 [patent_app_country] => US [patent_app_date] => 2022-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8164 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869286 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869286
Semiconductor packages and method of manufacture Jul 19, 2022 Issued
Array ( [id] => 18906042 [patent_doc_number] => 20240021527 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERCONNECTIONS BETWEEN DIES AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/864470 [patent_app_country] => US [patent_app_date] => 2022-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11059 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864470 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/864470
Semiconductor package structure having interconnections between dies and manufacturing method thereof Jul 13, 2022 Issued
Array ( [id] => 20360209 [patent_doc_number] => 12476215 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Power delivery structures and methods of manufacturing thereof [patent_app_type] => utility [patent_app_number] => 17/864953 [patent_app_country] => US [patent_app_date] => 2022-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 29 [patent_no_of_words] => 6049 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864953 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/864953
Power delivery structures and methods of manufacturing thereof Jul 13, 2022 Issued
Array ( [id] => 18865994 [patent_doc_number] => 20230420431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/793722 [patent_app_country] => US [patent_app_date] => 2022-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6380 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17793722 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/793722
Light-emitting substrate, manufacturing method thereof, and display device Jul 11, 2022 Issued
Array ( [id] => 18166285 [patent_doc_number] => 20230032887 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-02 [patent_title] => LOW COST WAFER LEVEL PACKAGES AND SILICON [patent_app_type] => utility [patent_app_number] => 17/860491 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4168 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860491 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860491
Low cost wafer level packages and silicon Jul 7, 2022 Issued
Array ( [id] => 17949345 [patent_doc_number] => 20220336364 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/857066 [patent_app_country] => US [patent_app_date] => 2022-07-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9866 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17857066 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/857066
Package structure and method of fabricating the same Jul 3, 2022 Issued
Array ( [id] => 18883011 [patent_doc_number] => 20240006380 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES [patent_app_type] => utility [patent_app_number] => 17/856830 [patent_app_country] => US [patent_app_date] => 2022-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8525 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17856830 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/856830
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES Jun 30, 2022 Pending
Array ( [id] => 20346061 [patent_doc_number] => 12469796 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Method of forming an embedded magnetic shielding device [patent_app_type] => utility [patent_app_number] => 17/810028 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 0 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17810028 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/810028
Method of forming an embedded magnetic shielding device Jun 29, 2022 Issued
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