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[id] => 2707251
[patent_doc_number] => 05061547
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-29
[patent_title] => 'Structure of conductive layers in multilayer substrates for minimizing blisters and delaminations'
[patent_app_type] => 1
[patent_app_number] => 6/845724
[patent_app_country] => US
[patent_app_date] => 1986-03-28
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 2196
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[pdf_file] => patents/05/061/05061547.pdf
[firstpage_image] =>[orig_patent_app_number] => 845724
[rel_patent_id] =>[rel_patent_doc_number] =>) 06/845724 | Structure of conductive layers in multilayer substrates for minimizing blisters and delaminations | Mar 27, 1986 | Issued |