Christopher E Dunay
Examiner (ID: 1458, Phone: (571)270-1222 , Office: P/2875 )
Most Active Art Unit | 2875 |
Art Unit(s) | 2875 |
Total Applications | 722 |
Issued Applications | 487 |
Pending Applications | 67 |
Abandoned Applications | 168 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 9844811
[patent_doc_number] => 08946729
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[patent_kind] => B2
[patent_issue_date] => 2015-02-03
[patent_title] => 'Light emitting diode'
[patent_app_type] => utility
[patent_app_number] => 13/912476
[patent_app_country] => US
[patent_app_date] => 2013-06-07
[patent_effective_date] => 0000-00-00
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Array
(
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[patent_doc_number] => 20130267069
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[patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE'
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Array
(
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[patent_issue_date] => 2013-10-31
[patent_title] => 'METHOD OF FORMING A FREESTANDING SEMICONDUCTOR WAFER'
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[patent_app_number] => 13/853567
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[patent_app_date] => 2013-03-29
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/853567 | Method of forming a freestanding semiconductor wafer | Mar 28, 2013 | Issued |
Array
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[patent_kind] => A1
[patent_issue_date] => 2013-10-10
[patent_title] => 'METHODS FOR FABRICATING A METAL STRUCTURE FOR A SEMICONDUCTOR DEVICE'
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[patent_app_number] => 13/852346
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Array
(
[id] => 9148457
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[patent_title] => 'TUNGSTEN FEATURE FILL'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/851885 | Tungsten feature fill | Mar 26, 2013 | Issued |
Array
(
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[patent_issue_date] => 2013-10-10
[patent_title] => 'WAFER DICING USING HYBRID MULTI-STEP LASER SCRIBING PROCESS WITH PLASMA ETCH'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/851442 | Wafer dicing used hybrid multi-step laser scribing process with plasma etch | Mar 26, 2013 | Issued |
Array
(
[id] => 9054692
[patent_doc_number] => 20130252406
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[patent_issue_date] => 2013-09-26
[patent_title] => 'Techniques for drying and annealing thermoelectric powders'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/849692 | Techniques for drying and annealing thermoelectric powders | Mar 24, 2013 | Abandoned |
Array
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[id] => 9118323
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[patent_issue_date] => 2013-10-31
[patent_title] => 'MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES'
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[patent_app_number] => 13/849562
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Array
(
[id] => 9844142
[patent_doc_number] => 08946057
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[patent_issue_date] => 2015-02-03
[patent_title] => 'Laser and plasma etch wafer dicing using UV-curable adhesive film'
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Array
(
[id] => 9068782
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[patent_issue_date] => 2013-10-03
[patent_title] => 'METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 13/844894
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Array
(
[id] => 9662196
[patent_doc_number] => 08809172
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[patent_issue_date] => 2014-08-19
[patent_title] => 'Self-aligned patterning for deep implantation in a semiconductor structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/839888 | Self-aligned patterning for deep implantation in a semiconductor structure | Mar 14, 2013 | Issued |
Array
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[id] => 9339014
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[patent_title] => 'GROUP III NITRIDE WAFER AND ITS PRODUCTION METHOD'
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Array
(
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Array
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Array
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Array
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Array
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[id] => 9503435
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/826163 | Semiconductor device having metal lines with slits | Mar 13, 2013 | Issued |