Christopher E Dunay
Examiner (ID: 1458, Phone: (571)270-1222 , Office: P/2875 )
Most Active Art Unit | 2875 |
Art Unit(s) | 2875 |
Total Applications | 722 |
Issued Applications | 487 |
Pending Applications | 67 |
Abandoned Applications | 168 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 432266
[patent_doc_number] => 07265039
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-04
[patent_title] => 'Method for fabricating semiconductor device with improved refresh time'
[patent_app_type] => utility
[patent_app_number] => 10/750318
[patent_app_country] => US
[patent_app_date] => 2003-12-30
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[pdf_file] => patents/07/265/07265039.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/750318 | Method for fabricating semiconductor device with improved refresh time | Dec 29, 2003 | Issued |
Array
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[patent_doc_number] => 20040266103
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[patent_issue_date] => 2004-12-30
[patent_title] => 'Method for fabricating capacitor using metastable-polysilicon process'
[patent_app_type] => new
[patent_app_number] => 10/744048
[patent_app_country] => US
[patent_app_date] => 2003-12-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/744048 | Method for fabricating capacitor using metastable-polysilicon process | Dec 23, 2003 | Issued |
Array
(
[id] => 7234992
[patent_doc_number] => 20040157364
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-12
[patent_title] => 'Manufacturing method of a microelectromechanical switch'
[patent_app_type] => new
[patent_app_number] => 10/746868
[patent_app_country] => US
[patent_app_date] => 2003-12-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/746868 | Manufacturing method of a microelectromechanical switch | Dec 23, 2003 | Issued |
Array
(
[id] => 5667144
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[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-03
[patent_title] => 'Method for the production of a semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 10/541819
[patent_app_country] => US
[patent_app_date] => 2003-12-23
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/541819 | Method for the production of a semiconductor component | Dec 22, 2003 | Issued |
Array
(
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[patent_title] => 'Method for fabricating a capacitor using a metal insulator metal structure'
[patent_app_type] => new
[patent_app_number] => 10/743573
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/743573 | Method for fabricating a capacitor using a metal insulator metal structure | Dec 21, 2003 | Issued |
Array
(
[id] => 7083311
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[patent_title] => 'High temperature attachment of organic molecules to substrates'
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Array
(
[id] => 6994005
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[patent_title] => 'Multilayer device and method of making'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/739298 | Multilayer device and method of making | Dec 18, 2003 | Issued |
Array
(
[id] => 7309258
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[patent_country] => US
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[patent_issue_date] => 2004-07-22
[patent_title] => 'Method for forming metal-insulator-metal capacitor of semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/738398
[patent_app_country] => US
[patent_app_date] => 2003-12-17
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[pdf_file] => publications/A1/0142/20040142535.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/738398 | Method for forming metal-insulator-metal capacitor of semiconductor device | Dec 16, 2003 | Abandoned |
Array
(
[id] => 7283667
[patent_doc_number] => 20040145058
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[patent_issue_date] => 2004-07-29
[patent_title] => 'Buried connections in an integrated circuit substrate'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/735518 | Buried connections in an integrated circuit substrate | Dec 11, 2003 | Abandoned |
Array
(
[id] => 7471612
[patent_doc_number] => 20040121571
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[patent_kind] => A1
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[patent_title] => 'Semiconductor device and a method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/732518
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/732518 | Method of manufacturing a semiconductor device having a multi-layered wiring structure | Dec 10, 2003 | Issued |
Array
(
[id] => 544243
[patent_doc_number] => 07163896
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[patent_issue_date] => 2007-01-16
[patent_title] => 'Biased H2 etch process in deposition-etch-deposition gap fill'
[patent_app_type] => utility
[patent_app_number] => 10/733858
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Array
(
[id] => 931095
[patent_doc_number] => 06979599
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[patent_issue_date] => 2005-12-27
[patent_title] => 'Chip with molded cap array'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/728798 | Chip with molded cap array | Dec 7, 2003 | Issued |
Array
(
[id] => 996548
[patent_doc_number] => 06913987
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[patent_title] => 'Method for fabricating self-aligned contact connections on buried bit lines'
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Array
(
[id] => 7429809
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Array
(
[id] => 708751
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Array
(
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Array
(
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/713329 | Method for making devices using ink jet printing | Nov 12, 2003 | Issued |