Christopher M. Gross

Array ( [id] => 826843 [patent_doc_number] => 07402508 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-22 [patent_title] => 'Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board' [patent_app_type] => utility [patent_app_number] => 10/849884 [patent_app_country] => US [patent_app_date] => 2004-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 24 [patent_no_of_words] => 7384 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/402/07402508.pdf [firstpage_image] =>[orig_patent_app_number] => 10849884 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7291870 [patent_doc_number] => 20040212103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Techniques for pin arrangements in circuit chips' [patent_app_type] => new [patent_app_number] => 10/848044 [patent_app_country] => US [patent_app_date] => 2004-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 5956 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20040212103.pdf [firstpage_image] =>[orig_patent_app_number] => 10848044 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 734267 [patent_doc_number] => 07038307 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-02 [patent_title] => 'Semiconductor chip with FIB protection' [patent_app_type] => utility [patent_app_number] => 10/846483 [patent_app_country] => US [patent_app_date] => 2004-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 1772 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/038/07038307.pdf [firstpage_image] =>[orig_patent_app_number] => 10846483 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7239091 [patent_doc_number] => 20040257230 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-23 [patent_title] => 'Integrated circuit packages with marked product tracking information' [patent_app_type] => new [patent_app_number] => 10/843814 [patent_app_country] => US [patent_app_date] => 2004-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2478 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0257/20040257230.pdf [firstpage_image] =>[orig_patent_app_number] => 10843814 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 655842 [patent_doc_number] => 07109583 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-19 [patent_title] => 'Mounting with auxiliary bumps' [patent_app_type] => utility [patent_app_number] => 10/841764 [patent_app_country] => US [patent_app_date] => 2004-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4610 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/109/07109583.pdf [firstpage_image] =>[orig_patent_app_number] => 10841764 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6963934 [patent_doc_number] => 20050230831 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-20 [patent_title] => 'Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer' [patent_app_type] => utility [patent_app_number] => 10/827693 [patent_app_country] => US [patent_app_date] => 2004-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4910 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20050230831.pdf [firstpage_image] =>[orig_patent_app_number] => 10827693 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7363372 [patent_doc_number] => 20040217466 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-04 [patent_title] => 'Function module and its manufacturing method' [patent_app_type] => new [patent_app_number] => 10/827194 [patent_app_country] => US [patent_app_date] => 2004-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3188 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0217/20040217466.pdf [firstpage_image] =>[orig_patent_app_number] => 10827194 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6981200 [patent_doc_number] => 20050151268 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-14 [patent_title] => 'Wafer-level assembly method for chip-size devices having flipped chips' [patent_app_type] => utility [patent_app_number] => 10/826713 [patent_app_country] => US [patent_app_date] => 2004-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4919 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20050151268.pdf [firstpage_image] =>[orig_patent_app_number] => 10826713 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7411817 [patent_doc_number] => 20040207056 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-21 [patent_title] => 'Conductor substrate, semiconductor device and production method thereof' [patent_app_type] => new [patent_app_number] => 10/824523 [patent_app_country] => US [patent_app_date] => 2004-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 8985 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20040207056.pdf [firstpage_image] =>[orig_patent_app_number] => 10824523 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 289363 [patent_doc_number] => 07547979 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-16 [patent_title] => 'Semiconductor device and method of locating a predetermined point on the semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/822384 [patent_app_country] => US [patent_app_date] => 2004-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 2596 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/547/07547979.pdf [firstpage_image] =>[orig_patent_app_number] => 10822384 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7291830 [patent_doc_number] => 20040212069 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Multi-chips stacked package' [patent_app_type] => new [patent_app_number] => 10/820854 [patent_app_country] => US [patent_app_date] => 2004-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2394 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20040212069.pdf [firstpage_image] =>[orig_patent_app_number] => 10820854 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 861406 [patent_doc_number] => 07372159 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-13 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/811973 [patent_app_country] => US [patent_app_date] => 2004-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 22 [patent_no_of_words] => 11253 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/372/07372159.pdf [firstpage_image] =>[orig_patent_app_number] => 10811973 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7407621 [patent_doc_number] => 20040227252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-18 [patent_title] => 'Flip chip package with reinforced bumps' [patent_app_type] => new [patent_app_number] => 10/809384 [patent_app_country] => US [patent_app_date] => 2004-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1751 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20040227252.pdf [firstpage_image] =>[orig_patent_app_number] => 10809384 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7334192 [patent_doc_number] => 20040188818 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-30 [patent_title] => 'Multi-chips module package' [patent_app_type] => new [patent_app_number] => 10/807153 [patent_app_country] => US [patent_app_date] => 2004-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2787 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0188/20040188818.pdf [firstpage_image] =>[orig_patent_app_number] => 10807153 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 630784 [patent_doc_number] => 07132745 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-07 [patent_title] => 'Method for attaching shields on substrates' [patent_app_type] => utility [patent_app_number] => 10/806644 [patent_app_country] => US [patent_app_date] => 2004-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 1929 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/132/07132745.pdf [firstpage_image] =>[orig_patent_app_number] => 10806644 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6981198 [patent_doc_number] => 20050151266 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-14 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/806413 [patent_app_country] => US [patent_app_date] => 2004-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7623 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20050151266.pdf [firstpage_image] =>[orig_patent_app_number] => 10806413 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 756398 [patent_doc_number] => 07019400 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-03-28 [patent_title] => 'Semiconductor device having multilayer interconnection structure and method for manufacturing the device' [patent_app_type] => utility [patent_app_number] => 10/805403 [patent_app_country] => US [patent_app_date] => 2004-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 5136 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/019/07019400.pdf [firstpage_image] =>[orig_patent_app_number] => 10805403 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 449721 [patent_doc_number] => 07250634 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-31 [patent_title] => 'Light-emitting device, method of manufacturing the same, and display unit' [patent_app_type] => utility [patent_app_number] => 10/805133 [patent_app_country] => US [patent_app_date] => 2004-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 27 [patent_no_of_words] => 10424 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/250/07250634.pdf [firstpage_image] =>[orig_patent_app_number] => 10805133 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7108554 [patent_doc_number] => 20050206007 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-22 [patent_title] => 'Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits' [patent_app_type] => utility [patent_app_number] => 10/804363 [patent_app_country] => US [patent_app_date] => 2004-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2983 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0206/20050206007.pdf [firstpage_image] =>[orig_patent_app_number] => 10804363 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7058941 [patent_doc_number] => 20050001300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Semiconductor package having multiple embedded chips' [patent_app_type] => utility [patent_app_number] => 10/803043 [patent_app_country] => US [patent_app_date] => 2004-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3159 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20050001300.pdf [firstpage_image] =>[orig_patent_app_number] => 10803043 [rel_patent_id] =>[rel_patent_doc_number] =>)