
Christopher M. Gross
Examiner (ID: 14649, Phone: (571)272-4446 , Office: P/1639 )
| Most Active Art Unit | 1639 |
| Art Unit(s) | 1675, 1684, 1639, 1636 |
| Total Applications | 901 |
| Issued Applications | 468 |
| Pending Applications | 119 |
| Abandoned Applications | 336 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7314337
[patent_doc_number] => 20040222508
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-11-11
[patent_title] => 'Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device'
[patent_app_type] => new
[patent_app_number] => 10/801933
[patent_app_country] => US
[patent_app_date] => 2004-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 8905
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 67
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0222/20040222508.pdf
[firstpage_image] =>[orig_patent_app_number] => 10801933
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/801933 | Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device | Mar 15, 2004 | Abandoned |
Array
(
[id] => 7421282
[patent_doc_number] => 20040183187
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-23
[patent_title] => 'Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element'
[patent_app_type] => new
[patent_app_number] => 10/800603
[patent_app_country] => US
[patent_app_date] => 2004-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7966
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0183/20040183187.pdf
[firstpage_image] =>[orig_patent_app_number] => 10800603
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/800603 | Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element | Mar 14, 2004 | Issued |
Array
(
[id] => 7338603
[patent_doc_number] => 20040245621
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-09
[patent_title] => 'Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/801093
[patent_app_country] => US
[patent_app_date] => 2004-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4973
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 119
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0245/20040245621.pdf
[firstpage_image] =>[orig_patent_app_number] => 10801093
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/801093 | Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device | Mar 14, 2004 | Issued |
Array
(
[id] => 7407426
[patent_doc_number] => 20040227223
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-11-18
[patent_title] => 'Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing semiconductor device and electronic device'
[patent_app_type] => new
[patent_app_number] => 10/801084
[patent_app_country] => US
[patent_app_date] => 2004-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4910
[patent_no_of_claims] => 15
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[pdf_file] => publications/A1/0227/20040227223.pdf
[firstpage_image] =>[orig_patent_app_number] => 10801084
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/801084 | Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing semiconductor device and electronic device | Mar 14, 2004 | Abandoned |
Array
(
[id] => 7314365
[patent_doc_number] => 20040222522
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-11-11
[patent_title] => 'Semiconductor device and manufacturing method of the same'
[patent_app_type] => new
[patent_app_number] => 10/798433
[patent_app_country] => US
[patent_app_date] => 2004-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 7821
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0222/20040222522.pdf
[firstpage_image] =>[orig_patent_app_number] => 10798433
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/798433 | Semiconductor device and manufacturing method of the same | Mar 11, 2004 | Abandoned |
Array
(
[id] => 7191508
[patent_doc_number] => 20050040508
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-24
[patent_title] => 'Area array type package stack and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/798943
[patent_app_country] => US
[patent_app_date] => 2004-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 3214
[patent_no_of_claims] => 17
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[pdf_file] => publications/A1/0040/20050040508.pdf
[firstpage_image] =>[orig_patent_app_number] => 10798943
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/798943 | Area array type package stack and manufacturing method thereof | Mar 11, 2004 | Abandoned |
Array
(
[id] => 7144072
[patent_doc_number] => 20040169286
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-02
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/795994
[patent_app_country] => US
[patent_app_date] => 2004-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 9789
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 14
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0169/20040169286.pdf
[firstpage_image] =>[orig_patent_app_number] => 10795994
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/795994 | Semiconductor device and method for manufacturing the same | Mar 9, 2004 | Issued |
Array
(
[id] => 730180
[patent_doc_number] => 07042088
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-09
[patent_title] => 'Package structure with two solder arrays'
[patent_app_type] => utility
[patent_app_number] => 10/796253
[patent_app_country] => US
[patent_app_date] => 2004-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 2427
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/042/07042088.pdf
[firstpage_image] =>[orig_patent_app_number] => 10796253
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/796253 | Package structure with two solder arrays | Mar 9, 2004 | Issued |
Array
(
[id] => 6936592
[patent_doc_number] => 20050110153
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Copper interconnects'
[patent_app_type] => utility
[patent_app_number] => 10/797224
[patent_app_country] => US
[patent_app_date] => 2004-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2736
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20050110153.pdf
[firstpage_image] =>[orig_patent_app_number] => 10797224
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/797224 | Copper interconnects | Mar 9, 2004 | Issued |
Array
(
[id] => 7174314
[patent_doc_number] => 20040201090
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-14
[patent_title] => 'Electronic device with cavity and a method for producing the same'
[patent_app_type] => new
[patent_app_number] => 10/795344
[patent_app_country] => US
[patent_app_date] => 2004-03-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2874
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0201/20040201090.pdf
[firstpage_image] =>[orig_patent_app_number] => 10795344
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/795344 | Electronic device with cavity and a method for producing the same | Mar 8, 2004 | Issued |
Array
(
[id] => 7393913
[patent_doc_number] => 20040173914
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-09-09
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/794343
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[patent_app_date] => 2004-03-05
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[patent_no_of_words] => 5826
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[pdf_file] => publications/A1/0173/20040173914.pdf
[firstpage_image] =>[orig_patent_app_number] => 10794343
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/794343 | Semiconductor device | Mar 4, 2004 | Abandoned |
Array
(
[id] => 7393905
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[patent_kind] => A1
[patent_issue_date] => 2004-09-09
[patent_title] => 'Capacitive semiconductor sensor'
[patent_app_type] => new
[patent_app_number] => 10/792734
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[firstpage_image] =>[orig_patent_app_number] => 10792734
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/792734 | Capacitive semiconductor sensor | Mar 4, 2004 | Issued |
Array
(
[id] => 7338607
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[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-09
[patent_title] => 'Semiconductor device, circuit substrate and electronic instrument'
[patent_app_type] => new
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[firstpage_image] =>[orig_patent_app_number] => 10794783
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/794783 | Semiconductor device, circuit substrate and electronic instrument | Mar 4, 2004 | Abandoned |
Array
(
[id] => 696350
[patent_doc_number] => 07071564
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-07-04
[patent_title] => 'Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migration'
[patent_app_type] => utility
[patent_app_number] => 10/791904
[patent_app_country] => US
[patent_app_date] => 2004-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => patents/07/071/07071564.pdf
[firstpage_image] =>[orig_patent_app_number] => 10791904
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/791904 | Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migration | Mar 3, 2004 | Issued |
Array
(
[id] => 827242
[patent_doc_number] => 07402910
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-22
[patent_title] => 'Solder, microelectromechanical component and device, and a process for producing a component or device'
[patent_app_type] => utility
[patent_app_number] => 10/789423
[patent_app_country] => US
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[pdf_file] => patents/07/402/07402910.pdf
[firstpage_image] =>[orig_patent_app_number] => 10789423
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/789423 | Solder, microelectromechanical component and device, and a process for producing a component or device | Feb 26, 2004 | Issued |
Array
(
[id] => 7250262
[patent_doc_number] => 20040238934
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-02
[patent_title] => 'High-frequency chip packages'
[patent_app_type] => new
[patent_app_number] => 10/783314
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[patent_app_date] => 2004-02-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0238/20040238934.pdf
[firstpage_image] =>[orig_patent_app_number] => 10783314
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/783314 | High-frequency chip packages | Feb 19, 2004 | Issued |
Array
(
[id] => 7048489
[patent_doc_number] => 20050184376
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'System in package'
[patent_app_type] => utility
[patent_app_number] => 10/783163
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[firstpage_image] =>[orig_patent_app_number] => 10783163
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/783163 | System in package | Feb 18, 2004 | Abandoned |
Array
(
[id] => 681143
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[firstpage_image] =>[orig_patent_app_number] => 10773114
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/773114 | Microelectromechanical device and method for producing it | Feb 3, 2004 | Issued |
Array
(
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[firstpage_image] =>[orig_patent_app_number] => 10765833
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/765833 | Semiconductor device and method of manufacturing the same | Jan 28, 2004 | Issued |
Array
(
[id] => 7235349
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[patent_kind] => A1
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[patent_title] => 'Package for semiconductor devices'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0256/20040256721.pdf
[firstpage_image] =>[orig_patent_app_number] => 10765454
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/765454 | Package for semiconductor devices | Jan 26, 2004 | Abandoned |