
Christopher M. Keehan
Examiner (ID: 2037)
| Most Active Art Unit | 1712 |
| Art Unit(s) | 1741, 1712 |
| Total Applications | 309 |
| Issued Applications | 251 |
| Pending Applications | 17 |
| Abandoned Applications | 41 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5010913
[patent_doc_number] => 20070281392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 11/465757
[patent_app_country] => US
[patent_app_date] => 2006-08-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0281/20070281392.pdf
[firstpage_image] =>[orig_patent_app_number] => 11465757
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/465757 | Multiple row exposed leads for MLP high density packages | Aug 17, 2006 | Issued |
Array
(
[id] => 4496207
[patent_doc_number] => 07956445
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-06-07
[patent_title] => 'Packaged integrated circuit having gold removed from a lead frame'
[patent_app_type] => utility
[patent_app_number] => 11/464767
[patent_app_country] => US
[patent_app_date] => 2006-08-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/956/07956445.pdf
[firstpage_image] =>[orig_patent_app_number] => 11464767
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464767 | Packaged integrated circuit having gold removed from a lead frame | Aug 14, 2006 | Issued |
Array
(
[id] => 820886
[patent_doc_number] => 07408220
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-05
[patent_title] => 'Non-volatile memory and fabricating method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/463250
[patent_app_country] => US
[patent_app_date] => 2006-08-08
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/07/408/07408220.pdf
[firstpage_image] =>[orig_patent_app_number] => 11463250
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/463250 | Non-volatile memory and fabricating method thereof | Aug 7, 2006 | Issued |
Array
(
[id] => 5625426
[patent_doc_number] => 20060263931
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Wafer Level Packaging of Materials with Different Coefficents of Thermal Expansion'
[patent_app_type] => utility
[patent_app_number] => 11/461587
[patent_app_country] => US
[patent_app_date] => 2006-08-01
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11461587
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/461587 | Wafer level packaging of materials with different coefficients of thermal expansion | Jul 31, 2006 | Issued |
Array
(
[id] => 5889227
[patent_doc_number] => 20060276035
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-07
[patent_title] => 'Contact structure and contact liner process'
[patent_app_type] => utility
[patent_app_number] => 11/495438
[patent_app_country] => US
[patent_app_date] => 2006-07-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0276/20060276035.pdf
[firstpage_image] =>[orig_patent_app_number] => 11495438
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/495438 | Process of forming a semiconductor assembly having a contact structure and contact liner | Jul 27, 2006 | Issued |
Array
(
[id] => 5885425
[patent_doc_number] => 20060274124
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[patent_kind] => A1
[patent_issue_date] => 2006-12-07
[patent_title] => 'Inkjet Printhead Incorporating a Memory Array'
[patent_app_type] => utility
[patent_app_number] => 11/460267
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[patent_app_date] => 2006-07-27
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[firstpage_image] =>[orig_patent_app_number] => 11460267
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/460267 | Inkjet Printhead Incorporating a Memory Array | Jul 26, 2006 | Abandoned |
Array
(
[id] => 4564396
[patent_doc_number] => 07838971
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[patent_issue_date] => 2010-11-23
[patent_title] => 'Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages'
[patent_app_type] => utility
[patent_app_number] => 11/456677
[patent_app_country] => US
[patent_app_date] => 2006-07-11
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[pdf_file] => patents/07/838/07838971.pdf
[firstpage_image] =>[orig_patent_app_number] => 11456677
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/456677 | Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages | Jul 10, 2006 | Issued |
Array
(
[id] => 303557
[patent_doc_number] => 07534694
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-19
[patent_title] => 'Methods of forming a plurality of capacitors'
[patent_app_type] => utility
[patent_app_number] => 11/477957
[patent_app_country] => US
[patent_app_date] => 2006-06-28
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11477957
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/477957 | Methods of forming a plurality of capacitors | Jun 27, 2006 | Issued |
Array
(
[id] => 5854608
[patent_doc_number] => 20060226541
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-12
[patent_title] => 'Electroosmotic pumps using porous frits for cooling integrated circuit stacks'
[patent_app_type] => utility
[patent_app_number] => 11/448232
[patent_app_country] => US
[patent_app_date] => 2006-06-07
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[pdf_file] => publications/A1/0226/20060226541.pdf
[firstpage_image] =>[orig_patent_app_number] => 11448232
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/448232 | Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips | Jun 6, 2006 | Issued |
Array
(
[id] => 5619563
[patent_doc_number] => 20060189097
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[patent_issue_date] => 2006-08-24
[patent_title] => 'Method for manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/410073
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[patent_app_date] => 2006-04-25
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[firstpage_image] =>[orig_patent_app_number] => 11410073
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/410073 | Method for manufacturing semiconductor device | Apr 24, 2006 | Issued |
Array
(
[id] => 840716
[patent_doc_number] => 07391047
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[patent_title] => 'System for forming a strained layer of semiconductor material'
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[patent_app_number] => 11/378126
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/378126 | System for forming a strained layer of semiconductor material | Mar 16, 2006 | Issued |
Array
(
[id] => 5703254
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[patent_title] => 'Semiconductor device with a protected active die region and method therefor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/373087 | Semiconductor device with a protected active die region and method therefor | Mar 9, 2006 | Issued |
Array
(
[id] => 264110
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[patent_title] => 'System and method based on field-effect transistors for addressing nanometer-scale devices'
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Array
(
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[patent_title] => 'Liquid crystal display device and method for manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/351488 | Method for manufacturing a Liquid crystal display device | Feb 8, 2006 | Issued |
Array
(
[id] => 810059
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[patent_title] => 'Method of fabricating trench MIS device with thick oxide layer in bottom of trench'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/335747 | Method of fabricating trench MIS device with thick oxide layer in bottom of trench | Jan 18, 2006 | Issued |
Array
(
[id] => 4701771
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[patent_title] => 'Semiconductor Device with Heterojunctions and an Inter-Finger Structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/813676 | Semiconductor device with heterojunctions and an inter-finger structure | Jan 17, 2006 | Issued |
Array
(
[id] => 5628804
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[patent_title] => 'Mask ROM and fabricating method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/319497 | Method of fabricating a mask ROM | Dec 28, 2005 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/813321 | Infrared emitting diode and method of its manufacture | Dec 25, 2005 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/314317 | Method of manufacturing a SONOS device | Dec 21, 2005 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/302957 | Method of manufacturing gallium nitride semiconductor | Dec 12, 2005 | Issued |