Search

Courtney L. Smith

Examiner (ID: 14799, Phone: (571)272-9094 , Office: P/2835 )

Most Active Art Unit
2835
Art Unit(s)
2809, 2835
Total Applications
1615
Issued Applications
1337
Pending Applications
95
Abandoned Applications
217

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17318841 [patent_doc_number] => 20210407891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/473290 [patent_app_country] => US [patent_app_date] => 2021-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9133 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473290 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/473290
Semiconductor package including a pad pattern Sep 12, 2021 Issued
Array ( [id] => 18546505 [patent_doc_number] => 11719853 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-08 [patent_title] => Underground infrastructure sensing using unmanned aerial vehicle (UAV) [patent_app_type] => utility [patent_app_number] => 17/473949 [patent_app_country] => US [patent_app_date] => 2021-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4799 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473949 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/473949
Underground infrastructure sensing using unmanned aerial vehicle (UAV) Sep 12, 2021 Issued
Array ( [id] => 17303110 [patent_doc_number] => 20210398949 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-23 [patent_title] => MEMORY DEVICE INCLUDING MODULAR MEMORY UNITS AND MODULAR CIRCUIT UNITS FOR CONCURRENT MEMORY OPERATIONS [patent_app_type] => utility [patent_app_number] => 17/467011 [patent_app_country] => US [patent_app_date] => 2021-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12068 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17467011 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/467011
Memory device including modular memory units and modular circuit units for concurrent memory operations Sep 2, 2021 Issued
Array ( [id] => 19079522 [patent_doc_number] => 11948900 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-02 [patent_title] => Bonded body, circuit board, and semiconductor device [patent_app_type] => utility [patent_app_number] => 17/446765 [patent_app_country] => US [patent_app_date] => 2021-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 8931 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17446765 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/446765
Bonded body, circuit board, and semiconductor device Sep 1, 2021 Issued
Array ( [id] => 18221361 [patent_doc_number] => 20230060355 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME [patent_app_type] => utility [patent_app_number] => 17/462330 [patent_app_country] => US [patent_app_date] => 2021-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8169 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462330 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/462330
Semiconductor package structure and method for preparing the same Aug 30, 2021 Issued
Array ( [id] => 19213705 [patent_doc_number] => 12002777 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-04 [patent_title] => Semiconductor device with bonded substrates [patent_app_type] => utility [patent_app_number] => 17/461550 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 18 [patent_no_of_words] => 6916 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461550 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/461550
Semiconductor device with bonded substrates Aug 29, 2021 Issued
Array ( [id] => 20390810 [patent_doc_number] => 12490560 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => Display panel and manufacturing method thereof, and display device [patent_app_type] => utility [patent_app_number] => 17/796091 [patent_app_country] => US [patent_app_date] => 2021-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 4600 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17796091 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/796091
Display panel and manufacturing method thereof, and display device Aug 26, 2021 Issued
Array ( [id] => 17277968 [patent_doc_number] => 20210384166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-09 [patent_title] => CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/408849 [patent_app_country] => US [patent_app_date] => 2021-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9382 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17408849 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/408849
Chip package structure and manufacturing method thereof Aug 22, 2021 Issued
Array ( [id] => 18935505 [patent_doc_number] => 11887949 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-30 [patent_title] => Bond pad layout including floating conductive sections [patent_app_type] => utility [patent_app_number] => 17/405812 [patent_app_country] => US [patent_app_date] => 2021-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7356 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17405812 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/405812
Bond pad layout including floating conductive sections Aug 17, 2021 Issued
Array ( [id] => 18207843 [patent_doc_number] => 20230054100 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => CHIP AND SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/403925 [patent_app_country] => US [patent_app_date] => 2021-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3862 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17403925 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/403925
Chip having multiple functional units and semiconductor structure using the same Aug 16, 2021 Issued
Array ( [id] => 18373327 [patent_doc_number] => 11653519 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-16 [patent_title] => Display device and electronic apparatus with contact electrode electrically connected to cathode electrode at concave area locations [patent_app_type] => utility [patent_app_number] => 17/399787 [patent_app_country] => US [patent_app_date] => 2021-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 11206 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17399787 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/399787
Display device and electronic apparatus with contact electrode electrically connected to cathode electrode at concave area locations Aug 10, 2021 Issued
Array ( [id] => 18144363 [patent_doc_number] => 20230018214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => Semiconductor bonding structure [patent_app_type] => utility [patent_app_number] => 17/398017 [patent_app_country] => US [patent_app_date] => 2021-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3767 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17398017 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/398017
Semiconductor bonding structure Aug 9, 2021 Issued
Array ( [id] => 18277070 [patent_doc_number] => 11616018 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-28 [patent_title] => Semiconductor devices including a thick metal layer [patent_app_type] => utility [patent_app_number] => 17/398043 [patent_app_country] => US [patent_app_date] => 2021-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 21 [patent_no_of_words] => 10224 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 301 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17398043 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/398043
Semiconductor devices including a thick metal layer Aug 9, 2021 Issued
Array ( [id] => 17247170 [patent_doc_number] => 20210366915 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-25 [patent_title] => 4CPP SRAM CELL AND ARRAY [patent_app_type] => utility [patent_app_number] => 17/397371 [patent_app_country] => US [patent_app_date] => 2021-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8994 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17397371 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/397371
4CPP SRAM cell and array Aug 8, 2021 Issued
Array ( [id] => 17247173 [patent_doc_number] => 20210366918 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-25 [patent_title] => ONE-TIME PROGRAMMABLE MEMORY DEVICE INCLUDING ANTI-FUSE ELEMENT AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/393621 [patent_app_country] => US [patent_app_date] => 2021-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8227 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17393621 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/393621
One-time programmable memory device including anti-fuse element and manufacturing method thereof Aug 3, 2021 Issued
Array ( [id] => 18068207 [patent_doc_number] => 20220399295 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-15 [patent_title] => SEMICONDUCTOR STRUCTURE FOR WAFER LEVEL BONDING AND BONDED SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/382325 [patent_app_country] => US [patent_app_date] => 2021-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4815 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17382325 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/382325
Semiconductor structure for wafer level bonding and bonded semiconductor structure Jul 20, 2021 Issued
Array ( [id] => 18235989 [patent_doc_number] => 11600553 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-07 [patent_title] => Semiconductor device including through substrate vias and method of manufacturing the semiconductor device [patent_app_type] => utility [patent_app_number] => 17/381287 [patent_app_country] => US [patent_app_date] => 2021-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 30 [patent_no_of_words] => 13472 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17381287 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/381287
Semiconductor device including through substrate vias and method of manufacturing the semiconductor device Jul 20, 2021 Issued
Array ( [id] => 18767008 [patent_doc_number] => 11817420 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Systems and methods for direct bonding in semiconductor die manufacturing [patent_app_type] => utility [patent_app_number] => 17/379568 [patent_app_country] => US [patent_app_date] => 2021-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 6699 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17379568 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/379568
Systems and methods for direct bonding in semiconductor die manufacturing Jul 18, 2021 Issued
Array ( [id] => 18935522 [patent_doc_number] => 11887966 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-30 [patent_title] => Semiconductor packages [patent_app_type] => utility [patent_app_number] => 17/376784 [patent_app_country] => US [patent_app_date] => 2021-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 30 [patent_no_of_words] => 11094 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17376784 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/376784
Semiconductor packages Jul 14, 2021 Issued
Array ( [id] => 18357992 [patent_doc_number] => 11646399 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-09 [patent_title] => Display device including display modules and light absorbing pattern for covering gap between display modules and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/375780 [patent_app_country] => US [patent_app_date] => 2021-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5685 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17375780 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/375780
Display device including display modules and light absorbing pattern for covering gap between display modules and method for manufacturing the same Jul 13, 2021 Issued
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