Search

Courtney L. Smith

Examiner (ID: 14799, Phone: (571)272-9094 , Office: P/2835 )

Most Active Art Unit
2835
Art Unit(s)
2809, 2835
Total Applications
1615
Issued Applications
1337
Pending Applications
95
Abandoned Applications
217

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19305797 [patent_doc_number] => 20240234377 [patent_country] => US [patent_kind] => A9 [patent_issue_date] => 2024-07-11 [patent_title] => SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 18/536332 [patent_app_country] => US [patent_app_date] => 2023-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11115 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18536332 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/536332
Semiconductor packages Dec 11, 2023 Issued
Array ( [id] => 19305797 [patent_doc_number] => 20240234377 [patent_country] => US [patent_kind] => A9 [patent_issue_date] => 2024-07-11 [patent_title] => SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 18/536332 [patent_app_country] => US [patent_app_date] => 2023-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11115 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18536332 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/536332
Semiconductor packages Dec 11, 2023 Issued
Array ( [id] => 19071223 [patent_doc_number] => 20240105649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/536254 [patent_app_country] => US [patent_app_date] => 2023-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10208 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18536254 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/536254
Electronic device including conductive element on side surface of substrate Dec 11, 2023 Issued
Array ( [id] => 19237584 [patent_doc_number] => 20240194779 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-13 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF [patent_app_type] => utility [patent_app_number] => 18/522816 [patent_app_country] => US [patent_app_date] => 2023-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9479 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18522816 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/522816
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF Nov 28, 2023 Pending
Array ( [id] => 19790199 [patent_doc_number] => 20250063878 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-20 [patent_title] => DISPLAY PANEL AND DISPLAY APPARATUS [patent_app_type] => utility [patent_app_number] => 18/518996 [patent_app_country] => US [patent_app_date] => 2023-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7395 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18518996 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/518996
DISPLAY PANEL AND DISPLAY APPARATUS Nov 25, 2023 Pending
Array ( [id] => 20216216 [patent_doc_number] => 12412871 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-09 [patent_title] => Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/518591 [patent_app_country] => US [patent_app_date] => 2023-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 4420 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18518591 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/518591
Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same Nov 22, 2023 Issued
Array ( [id] => 19926351 [patent_doc_number] => 12300646 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-13 [patent_title] => Chiplets [patent_app_type] => utility [patent_app_number] => 18/517774 [patent_app_country] => US [patent_app_date] => 2023-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 21 [patent_no_of_words] => 2128 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18517774 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/517774
Chiplets Nov 21, 2023 Issued
Array ( [id] => 19040427 [patent_doc_number] => 20240090242 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => 3D MEMORY DEVICES AND STRUCTURES WITH METAL LAYERS [patent_app_type] => utility [patent_app_number] => 18/388840 [patent_app_country] => US [patent_app_date] => 2023-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 40173 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18388840 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/388840
3D memory devices and structures with metal layers Nov 11, 2023 Issued
Array ( [id] => 19007808 [patent_doc_number] => 20240071879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/500653 [patent_app_country] => US [patent_app_date] => 2023-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19081 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18500653 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/500653
SEMICONDUCTOR DEVICE Nov 1, 2023 Pending
Array ( [id] => 19720369 [patent_doc_number] => 12205912 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-21 [patent_title] => Semiconductor package structure and method for preparing the same [patent_app_type] => utility [patent_app_number] => 18/381911 [patent_app_country] => US [patent_app_date] => 2023-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 8199 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18381911 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/381911
Semiconductor package structure and method for preparing the same Oct 18, 2023 Issued
Array ( [id] => 19858291 [patent_doc_number] => 12261142 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Semiconductor structure including thermal enhanced bonding structure [patent_app_type] => utility [patent_app_number] => 18/489016 [patent_app_country] => US [patent_app_date] => 2023-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 42 [patent_no_of_words] => 17044 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18489016 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/489016
Semiconductor structure including thermal enhanced bonding structure Oct 17, 2023 Issued
Array ( [id] => 19007803 [patent_doc_number] => 20240071874 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/489557 [patent_app_country] => US [patent_app_date] => 2023-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8623 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18489557 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/489557
Semiconductor chip including through electrode, and semiconductor package including the same Oct 17, 2023 Issued
Array ( [id] => 19823240 [patent_doc_number] => 20250081447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-06 [patent_title] => MANAGING VERTICAL STRUCTURES IN THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES [patent_app_type] => utility [patent_app_number] => 18/488689 [patent_app_country] => US [patent_app_date] => 2023-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15720 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18488689 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/488689
MANAGING VERTICAL STRUCTURES IN THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES Oct 16, 2023 Pending
Array ( [id] => 19131082 [patent_doc_number] => 20240136435 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-25 [patent_title] => FIELD-EFFECT TRANSISTOR, AND METHODS FOR PRODUCTION [patent_app_type] => utility [patent_app_number] => 18/488741 [patent_app_country] => US [patent_app_date] => 2023-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5324 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18488741 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/488741
FIELD-EFFECT TRANSISTOR, AND METHODS FOR PRODUCTION Oct 16, 2023 Pending
Array ( [id] => 19796329 [patent_doc_number] => 12237299 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-25 [patent_title] => Systems and methods for direct bonding in semiconductor die manufacturing [patent_app_type] => utility [patent_app_number] => 18/380863 [patent_app_country] => US [patent_app_date] => 2023-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 6733 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18380863 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/380863
Systems and methods for direct bonding in semiconductor die manufacturing Oct 16, 2023 Issued
Array ( [id] => 19760059 [patent_doc_number] => 20250048624 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-06 [patent_title] => COMPACT EFUSE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/488805 [patent_app_country] => US [patent_app_date] => 2023-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7831 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18488805 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/488805
COMPACT EFUSE STRUCTURE Oct 16, 2023 Pending
Array ( [id] => 19131082 [patent_doc_number] => 20240136435 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-25 [patent_title] => FIELD-EFFECT TRANSISTOR, AND METHODS FOR PRODUCTION [patent_app_type] => utility [patent_app_number] => 18/488741 [patent_app_country] => US [patent_app_date] => 2023-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5324 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18488741 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/488741
FIELD-EFFECT TRANSISTOR, AND METHODS FOR PRODUCTION Oct 15, 2023 Pending
Array ( [id] => 19926375 [patent_doc_number] => 12300671 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-13 [patent_title] => Semiconductor packages and methods of manufacturing the semiconductor packages [patent_app_type] => utility [patent_app_number] => 18/487247 [patent_app_country] => US [patent_app_date] => 2023-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 3349 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18487247 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/487247
Semiconductor packages and methods of manufacturing the semiconductor packages Oct 15, 2023 Issued
Array ( [id] => 20216158 [patent_doc_number] => 12412812 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-09 [patent_title] => Semiconductor package with plurality of leads and sealing resin [patent_app_type] => utility [patent_app_number] => 18/485318 [patent_app_country] => US [patent_app_date] => 2023-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 29 [patent_no_of_words] => 6531 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 242 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18485318 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/485318
Semiconductor package with plurality of leads and sealing resin Oct 11, 2023 Issued
Array ( [id] => 19414826 [patent_doc_number] => 12080663 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Semiconductor devices including a thick metal layer and a bump [patent_app_type] => utility [patent_app_number] => 18/377530 [patent_app_country] => US [patent_app_date] => 2023-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 22 [patent_no_of_words] => 8754 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 313 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18377530 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/377530
Semiconductor devices including a thick metal layer and a bump Oct 5, 2023 Issued
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