
Craig A. Renner
Examiner (ID: 142, Phone: (571)272-7580 , Office: P/2688 )
| Most Active Art Unit | 2688 |
| Art Unit(s) | 2754, 2689, 2627, 2652, 2688, 2303, 2512 |
| Total Applications | 2133 |
| Issued Applications | 1663 |
| Pending Applications | 112 |
| Abandoned Applications | 378 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
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[patent_title] => 'Electronic device with redistribution layer and stiffeners and related methods'
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Array
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[patent_title] => Substrate and package structure
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Array
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Array
(
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[patent_doc_number] => 20160343692
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Array
(
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Array
(
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[patent_issue_date] => 2016-10-27
[patent_title] => 'SIDE VIEW LIGHT EMITTING DIODE PACKAGE'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/192731 | Optical tuning of light emitting semiconductor junctions | Jun 23, 2016 | Issued |
Array
(
[id] => 11615461
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/182434 | Integrated circuit package configurations to reduce stiffness | Jun 13, 2016 | Issued |
Array
(
[id] => 13629659
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Array
(
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Array
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Array
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Array
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Array
(
[id] => 11339541
[patent_doc_number] => 20160365297
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[patent_issue_date] => 2016-12-15
[patent_title] => 'TIM STRAIN MITIGATION IN ELECTRONIC MODULES'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/161496 | TIM strain mitigation in electronic modules | May 22, 2016 | Issued |
Array
(
[id] => 13785537
[patent_doc_number] => 20190006307
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2019-01-03
[patent_title] => PACKAGE METHOD AND PACKAGE STRUCTURE OF FAN-OUT CHIP
[patent_app_type] => utility
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Array
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Array
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Array
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Array
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