Dana Lynne Meyrow
Examiner (ID: 11885, Phone: (571)272-6034 , Office: P/2916 )
Most Active Art Unit | 2916 |
Art Unit(s) | 2912, 2916 |
Total Applications | 2854 |
Issued Applications | 2822 |
Pending Applications | 0 |
Abandoned Applications | 30 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 9923418
[patent_doc_number] => 08981387
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-03-17
[patent_title] => 'Light emitting diode assembly having a deformable lens'
[patent_app_type] => utility
[patent_app_number] => 13/717708
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13717708
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717708 | Light emitting diode assembly having a deformable lens | Dec 17, 2012 | Issued |
Array
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[id] => 9542552
[patent_doc_number] => 20140167199
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[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'SYSTEM AND METHOD FOR DIE TO DIE STRESS IMPROVEMENT'
[patent_app_type] => utility
[patent_app_number] => 13/717883
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717883 | System and method for die to die stress improvement | Dec 17, 2012 | Issued |
Array
(
[id] => 8960780
[patent_doc_number] => 20130200382
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-08-08
[patent_title] => 'THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 13/717795
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13717795
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717795 | THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE | Dec 17, 2012 | Abandoned |
Array
(
[id] => 9051276
[patent_doc_number] => 20130248990
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-09-26
[patent_title] => 'SEMICONDUCTOR DEVICES AND METHOD FOR FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/718138
[patent_app_country] => US
[patent_app_date] => 2012-12-18
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13718138
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718138 | Semiconductor devices having contacts with intervening spacers and method for fabricating the same | Dec 17, 2012 | Issued |
Array
(
[id] => 9542422
[patent_doc_number] => 20140167068
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'SYSTEMS AND METHODS FOR OHMIC CONTACTS IN SILICON CARBIDE DEVICES'
[patent_app_type] => utility
[patent_app_number] => 13/718031
[patent_app_country] => US
[patent_app_date] => 2012-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718031 | Systems and methods for ohmic contacts in silicon carbide devices | Dec 17, 2012 | Issued |
Array
(
[id] => 9542400
[patent_doc_number] => 20140167047
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'METAL OXIDE TFT WITH IMPROVED TEMPERATURE STABILITY'
[patent_app_type] => utility
[patent_app_number] => 13/718183
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718183 | Metal oxide TFT with improved temperature stability | Dec 17, 2012 | Issued |
Array
(
[id] => 8888498
[patent_doc_number] => 20130161682
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[patent_kind] => A1
[patent_issue_date] => 2013-06-27
[patent_title] => 'SEMICONDUCTOR LIGHT-EMITTING ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 13/718000
[patent_app_country] => US
[patent_app_date] => 2012-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13718000
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718000 | Semiconductor light-emitting element | Dec 17, 2012 | Issued |
Array
(
[id] => 8901297
[patent_doc_number] => 20130168800
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-07-04
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/717803
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717803 | Semiconductor device with vertical structures that penetrate conductive patterns and interlayer insulating patterns | Dec 17, 2012 | Issued |
Array
(
[id] => 11194246
[patent_doc_number] => 09425064
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-23
[patent_title] => 'Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages'
[patent_app_type] => utility
[patent_app_number] => 13/718130
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718130 | Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages | Dec 17, 2012 | Issued |
Array
(
[id] => 9542615
[patent_doc_number] => 20140167262
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS'
[patent_app_type] => utility
[patent_app_number] => 13/718081
[patent_app_country] => US
[patent_app_date] => 2012-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13718081
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718081 | Semiconductor package signal routing using conductive vias | Dec 17, 2012 | Issued |
Array
(
[id] => 10898603
[patent_doc_number] => 08921820
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-12-30
[patent_title] => 'Phase change memory cell with large electrode contact area'
[patent_app_type] => utility
[patent_app_number] => 13/717701
[patent_app_country] => US
[patent_app_date] => 2012-12-18
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13717701
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717701 | Phase change memory cell with large electrode contact area | Dec 17, 2012 | Issued |
Array
(
[id] => 9542565
[patent_doc_number] => 20140167213
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'Moat Construction to Reduce Noise Coupling to a Quiet Supply'
[patent_app_type] => utility
[patent_app_number] => 13/718019
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/718019 | Moat construction to reduce noise coupling to a quiet supply | Dec 17, 2012 | Issued |
Array
(
[id] => 9266602
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[patent_title] => 'DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/717914 | Display device and manufacturing method thereof | Dec 17, 2012 | Issued |
Array
(
[id] => 10230243
[patent_doc_number] => 20150115237
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[patent_issue_date] => 2015-04-30
[patent_title] => 'LIGHT-EMITTING COMPONENT ARRANGEMENT'
[patent_app_type] => utility
[patent_app_number] => 14/365108
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/365108 | Light-emitting component arrangement | Dec 12, 2012 | Issued |
Array
(
[id] => 9446378
[patent_doc_number] => 20140117546
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[patent_issue_date] => 2014-05-01
[patent_title] => 'HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/664796 | Hybrid bonding mechanisms for semiconductor wafers | Oct 30, 2012 | Issued |
Array
(
[id] => 9441437
[patent_doc_number] => 08710550
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[patent_title] => 'Semiconductor device with hetero-junction bodies'
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Array
(
[id] => 10060057
[patent_doc_number] => 09099421
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[patent_title] => 'Surface profile for semiconductor region'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/665159 | Surface profile for semiconductor region | Oct 30, 2012 | Issued |
Array
(
[id] => 9951696
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/665311 | Trench type Schottky junction semiconductor device and manufacturing method thereof | Oct 30, 2012 | Issued |