
Daniel A. Hess
Examiner (ID: 9166, Phone: (571)272-2392 , Office: P/2876 )
| Most Active Art Unit | 2876 |
| Art Unit(s) | 2876 |
| Total Applications | 2022 |
| Issued Applications | 1569 |
| Pending Applications | 141 |
| Abandoned Applications | 348 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5193978
[patent_doc_number] => 20070082462
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-12
[patent_title] => 'Wafer having indicator for first die and method of attaching die of the wafer'
[patent_app_type] => utility
[patent_app_number] => 11/542781
[patent_app_country] => US
[patent_app_date] => 2006-10-04
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0082/20070082462.pdf
[firstpage_image] =>[orig_patent_app_number] => 11542781
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/542781 | Wafer having indicator for first die and method of attaching die of the wafer | Oct 3, 2006 | Abandoned |
Array
(
[id] => 5076852
[patent_doc_number] => 20070120076
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-31
[patent_title] => 'Integrated ionizers for process metrology equipment'
[patent_app_type] => utility
[patent_app_number] => 11/542401
[patent_app_country] => US
[patent_app_date] => 2006-10-03
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[firstpage_image] =>[orig_patent_app_number] => 11542401
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/542401 | Integrated ionizers for process metrology equipment | Oct 2, 2006 | Abandoned |
Array
(
[id] => 4944061
[patent_doc_number] => 20080081386
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-03
[patent_title] => 'Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance'
[patent_app_type] => utility
[patent_app_number] => 11/541112
[patent_app_country] => US
[patent_app_date] => 2006-09-29
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[pdf_file] => publications/A1/0081/20080081386.pdf
[firstpage_image] =>[orig_patent_app_number] => 11541112
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/541112 | Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance | Sep 28, 2006 | Issued |
Array
(
[id] => 5242312
[patent_doc_number] => 20070020807
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-25
[patent_title] => 'Protective structures and methods of fabricating protective structures over wafers'
[patent_app_type] => utility
[patent_app_number] => 11/540412
[patent_app_country] => US
[patent_app_date] => 2006-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/540412 | Protective structures and methods of fabricating protective structures over wafers | Sep 27, 2006 | Abandoned |
Array
(
[id] => 232705
[patent_doc_number] => 07598130
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[patent_issue_date] => 2009-10-06
[patent_title] => 'Method for reducing layout-dependent variations in semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 11/529091
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[firstpage_image] =>[orig_patent_app_number] => 11529091
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/529091 | Method for reducing layout-dependent variations in semiconductor devices | Sep 27, 2006 | Issued |
Array
(
[id] => 4476794
[patent_doc_number] => 07906348
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[patent_issue_date] => 2011-03-15
[patent_title] => 'Method of feed forward control of scanned rapid thermal processing'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/532651 | Method of feed forward control of scanned rapid thermal processing | Sep 17, 2006 | Issued |
Array
(
[id] => 273843
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[patent_issue_date] => 2009-07-14
[patent_title] => 'In-situ wafer temperature measurement and control'
[patent_app_type] => utility
[patent_app_number] => 11/519542
[patent_app_country] => US
[patent_app_date] => 2006-09-11
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[pdf_file] => patents/07/560/07560007.pdf
[firstpage_image] =>[orig_patent_app_number] => 11519542
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/519542 | In-situ wafer temperature measurement and control | Sep 10, 2006 | Issued |
Array
(
[id] => 5205060
[patent_doc_number] => 20070026542
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[patent_issue_date] => 2007-02-01
[patent_title] => 'FORMATION OF CONDUCTIVE TEMPLATES EMPLOYING INDIUM TIN OXIDE'
[patent_app_type] => utility
[patent_app_number] => 11/470829
[patent_app_country] => US
[patent_app_date] => 2006-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => publications/A1/0026/20070026542.pdf
[firstpage_image] =>[orig_patent_app_number] => 11470829
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/470829 | Formation of conductive templates employing indium tin oxide | Sep 6, 2006 | Issued |
Array
(
[id] => 5688373
[patent_doc_number] => 20060286688
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[patent_issue_date] => 2006-12-21
[patent_title] => 'Integrated circuitry and method for manufacturing the same'
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[patent_app_number] => 11/467769
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/467769 | Integrated circuitry and method for manufacturing the same | Aug 27, 2006 | Issued |
Array
(
[id] => 296015
[patent_doc_number] => 07541285
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-02
[patent_title] => 'Substrate processing apparatus and substrate processing method'
[patent_app_type] => utility
[patent_app_number] => 11/464622
[patent_app_country] => US
[patent_app_date] => 2006-08-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464622 | Substrate processing apparatus and substrate processing method | Aug 14, 2006 | Issued |
Array
(
[id] => 5599662
[patent_doc_number] => 20060290007
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[patent_title] => 'Flip Chip Die Assembly Using Thin Flexible Substrates'
[patent_app_type] => utility
[patent_app_number] => 11/464779
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464779 | Flip chip die assembly using thin flexible substrates | Aug 14, 2006 | Issued |
Array
(
[id] => 5625411
[patent_doc_number] => 20060263916
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[patent_title] => 'Infrared thermopile detector system for semiconductor process monitoring and control'
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[patent_app_number] => 11/494193
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/494193 | Infrared thermopile detector system for semiconductor process monitoring and control | Jul 26, 2006 | Abandoned |
Array
(
[id] => 7692101
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Array
(
[id] => 820492
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Array
(
[id] => 5051439
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Array
(
[id] => 5532533
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[patent_title] => 'ACOUSTIC SIGNAL PROCESSING APPARATUS, ACOUSTIC SIGNAL PROCESSING METHOD, ACOUSTIC SIGNAL PROCESSING PROGRAM, AND COMPUTER READABLE RECORDING MEDIUM'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/994067 | Audio signal processing apparatus, audio signal processing method, audio signal processing program, and computer-readable recording medium | Jun 13, 2006 | Issued |
Array
(
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Array
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