
Daniel A. Hess
Examiner (ID: 9166, Phone: (571)272-2392 , Office: P/2876 )
| Most Active Art Unit | 2876 |
| Art Unit(s) | 2876 |
| Total Applications | 2022 |
| Issued Applications | 1569 |
| Pending Applications | 141 |
| Abandoned Applications | 348 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 307303
[patent_doc_number] => 07531369
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-12
[patent_title] => 'Process endpoint detection method using broadband reflectometry'
[patent_app_type] => utility
[patent_app_number] => 11/203365
[patent_app_country] => US
[patent_app_date] => 2005-08-12
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[pdf_file] => patents/07/531/07531369.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/203365 | Process endpoint detection method using broadband reflectometry | Aug 11, 2005 | Issued |
Array
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[patent_doc_number] => 20050263605
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[patent_issue_date] => 2005-12-01
[patent_title] => 'Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip'
[patent_app_type] => utility
[patent_app_number] => 11/194487
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/194487 | Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip | Aug 1, 2005 | Issued |
Array
(
[id] => 518259
[patent_doc_number] => 07189655
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[patent_kind] => B2
[patent_issue_date] => 2007-03-13
[patent_title] => 'Method of correcting amplitude defect in multilayer film of EUVL mask'
[patent_app_type] => utility
[patent_app_number] => 11/195982
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/195982 | Method of correcting amplitude defect in multilayer film of EUVL mask | Aug 1, 2005 | Issued |
Array
(
[id] => 5880992
[patent_doc_number] => 20060030075
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[patent_kind] => A1
[patent_issue_date] => 2006-02-09
[patent_title] => 'Manufacturing method of semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/187981
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Array
(
[id] => 5817982
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[patent_issue_date] => 2006-02-02
[patent_title] => 'Evaluation method and manufacturing method of semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/186831 | Evaluation method and manufacturing method of semiconductor device | Jul 21, 2005 | Abandoned |
Array
(
[id] => 7229702
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[patent_issue_date] => 2005-11-17
[patent_title] => 'Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment'
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Array
(
[id] => 285929
[patent_doc_number] => 07550858
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[patent_issue_date] => 2009-06-23
[patent_title] => 'Random sequence generation using alpha particle emission'
[patent_app_type] => utility
[patent_app_number] => 11/184311
[patent_app_country] => US
[patent_app_date] => 2005-07-19
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[firstpage_image] =>[orig_patent_app_number] => 11184311
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/184311 | Random sequence generation using alpha particle emission | Jul 18, 2005 | Issued |
Array
(
[id] => 543625
[patent_doc_number] => 07163841
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[patent_kind] => B2
[patent_issue_date] => 2007-01-16
[patent_title] => 'Method of manufacturing circuit device'
[patent_app_type] => utility
[patent_app_number] => 11/179431
[patent_app_country] => US
[patent_app_date] => 2005-07-11
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[firstpage_image] =>[orig_patent_app_number] => 11179431
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Array
(
[id] => 5602392
[patent_doc_number] => 20060292737
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[patent_issue_date] => 2006-12-28
[patent_title] => 'Grid array connection device and method'
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[patent_app_number] => 11/167922
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[firstpage_image] =>[orig_patent_app_number] => 11167922
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/167922 | Grid array connection device and method | Jun 26, 2005 | Issued |
Array
(
[id] => 475097
[patent_doc_number] => 07226821
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[patent_kind] => B2
[patent_issue_date] => 2007-06-05
[patent_title] => 'Flip chip die assembly using thin flexible substrates'
[patent_app_type] => utility
[patent_app_number] => 11/166461
[patent_app_country] => US
[patent_app_date] => 2005-06-24
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[pdf_file] => patents/07/226/07226821.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/166461 | Flip chip die assembly using thin flexible substrates | Jun 23, 2005 | Issued |
Array
(
[id] => 7530787
[patent_doc_number] => 07843010
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[patent_issue_date] => 2010-11-30
[patent_title] => 'Crystalline semiconductor film and method for manufacturing the same'
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Array
(
[id] => 6923444
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[patent_title] => 'Method of forming a support frame for semiconductor packages'
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Array
(
[id] => 404604
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[patent_title] => 'Method of making assemblies having stacked semiconductor chips'
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Array
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Array
(
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Array
(
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Array
(
[id] => 5793627
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Array
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