
Daniel A. Hess
Examiner (ID: 9166, Phone: (571)272-2392 , Office: P/2876 )
| Most Active Art Unit | 2876 |
| Art Unit(s) | 2876 |
| Total Applications | 2022 |
| Issued Applications | 1569 |
| Pending Applications | 141 |
| Abandoned Applications | 348 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5909024
[patent_doc_number] => 20060125074
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-15
[patent_title] => 'Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package'
[patent_app_type] => utility
[patent_app_number] => 11/012561
[patent_app_country] => US
[patent_app_date] => 2004-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 4307
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0125/20060125074.pdf
[firstpage_image] =>[orig_patent_app_number] => 11012561
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/012561 | Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package | Dec 14, 2004 | Abandoned |
Array
(
[id] => 645279
[patent_doc_number] => 07119002
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-10
[patent_title] => 'Solder bump composition for flip chip'
[patent_app_type] => utility
[patent_app_number] => 11/012032
[patent_app_country] => US
[patent_app_date] => 2004-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/07/119/07119002.pdf
[firstpage_image] =>[orig_patent_app_number] => 11012032
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/012032 | Solder bump composition for flip chip | Dec 13, 2004 | Issued |
Array
(
[id] => 7097940
[patent_doc_number] => 20050130399
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-16
[patent_title] => 'Method of forming metal line in semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/008152
[patent_app_country] => US
[patent_app_date] => 2004-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/008152 | Method of forming metal line in semiconductor device | Dec 9, 2004 | Issued |
Array
(
[id] => 749691
[patent_doc_number] => 07022583
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-04-04
[patent_title] => 'Method of forming a shallow trench isolation device to prevent kick effect'
[patent_app_type] => utility
[patent_app_number] => 10/996362
[patent_app_country] => US
[patent_app_date] => 2004-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/07/022/07022583.pdf
[firstpage_image] =>[orig_patent_app_number] => 10996362
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/996362 | Method of forming a shallow trench isolation device to prevent kick effect | Nov 25, 2004 | Issued |
Array
(
[id] => 525852
[patent_doc_number] => 07183209
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[patent_kind] => B2
[patent_issue_date] => 2007-02-27
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/998221
[patent_app_country] => US
[patent_app_date] => 2004-11-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/183/07183209.pdf
[firstpage_image] =>[orig_patent_app_number] => 10998221
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/998221 | Semiconductor device and manufacturing method thereof | Nov 25, 2004 | Issued |
Array
(
[id] => 5727015
[patent_doc_number] => 20060057775
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-16
[patent_title] => 'METHOD OF FORMING A WAFER BACKSIDE INTERCONNECTING WIRE'
[patent_app_type] => utility
[patent_app_number] => 10/904621
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10904621
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/904621 | Method of forming a wafer backside interconnecting wire | Nov 18, 2004 | Issued |
Array
(
[id] => 482610
[patent_doc_number] => 07220642
[patent_country] => US
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[patent_issue_date] => 2007-05-22
[patent_title] => 'Protection of active layers of memory cells during processing of other elements'
[patent_app_type] => utility
[patent_app_number] => 10/987262
[patent_app_country] => US
[patent_app_date] => 2004-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/07/220/07220642.pdf
[firstpage_image] =>[orig_patent_app_number] => 10987262
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/987262 | Protection of active layers of memory cells during processing of other elements | Nov 11, 2004 | Issued |
Array
(
[id] => 411483
[patent_doc_number] => 07282376
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-16
[patent_title] => 'System, method, and apparatus for electrically testing lead-to-lead shorting during magnetoresistive sensor fabrication'
[patent_app_type] => utility
[patent_app_number] => 10/975273
[patent_app_country] => US
[patent_app_date] => 2004-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/07/282/07282376.pdf
[firstpage_image] =>[orig_patent_app_number] => 10975273
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/975273 | System, method, and apparatus for electrically testing lead-to-lead shorting during magnetoresistive sensor fabrication | Oct 27, 2004 | Issued |
Array
(
[id] => 5743223
[patent_doc_number] => 20060088948
[patent_country] => US
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[patent_issue_date] => 2006-04-27
[patent_title] => 'Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel'
[patent_app_type] => utility
[patent_app_number] => 10/972542
[patent_app_country] => US
[patent_app_date] => 2004-10-25
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[firstpage_image] =>[orig_patent_app_number] => 10972542
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/972542 | Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel | Oct 24, 2004 | Issued |
Array
(
[id] => 5814165
[patent_doc_number] => 20060084210
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-20
[patent_title] => 'METHOD OF FORMING A LOW THERMAL RESISTANCE DEVICE AND STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 10/964021
[patent_app_country] => US
[patent_app_date] => 2004-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0084/20060084210.pdf
[firstpage_image] =>[orig_patent_app_number] => 10964021
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964021 | Method of forming a low thermal resistance device and structure | Oct 13, 2004 | Issued |
Array
(
[id] => 6936602
[patent_doc_number] => 20050110163
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same'
[patent_app_type] => utility
[patent_app_number] => 10/964371
[patent_app_country] => US
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[pdf_file] => publications/A1/0110/20050110163.pdf
[firstpage_image] =>[orig_patent_app_number] => 10964371
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964371 | Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same | Oct 12, 2004 | Issued |
Array
(
[id] => 6952319
[patent_doc_number] => 20050227414
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[patent_issue_date] => 2005-10-13
[patent_title] => 'Packaging method for integrated circuits'
[patent_app_type] => utility
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Array
(
[id] => 715490
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[patent_title] => 'Non-volatile memory cell and method of manufacturing a non-volatile memory cell'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/959388 | Non-volatile memory cell and method of manufacturing a non-volatile memory cell | Oct 5, 2004 | Issued |
Array
(
[id] => 919664
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[patent_issue_date] => 2008-01-22
[patent_title] => 'Manufacturing method of semiconductor device'
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Array
(
[id] => 679581
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[patent_title] => 'Method of observation by transmission electron microscopy'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/944842 | Method of observation by transmission electron microscopy | Sep 20, 2004 | Issued |
Array
(
[id] => 6990987
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[patent_title] => 'System and method for developing production nano-material'
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Array
(
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[patent_title] => 'Localized halo implant region formed using tilt pre-amorphization implant and laser thermal anneal'
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Array
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Array
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[patent_title] => 'System and method using in situ scatterometry to detect photoresist pattern integrity during the photolithography process'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/934192 | System and method using in situ scatterometry to detect photoresist pattern integrity during the photolithography process | Sep 2, 2004 | Issued |
Array
(
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[patent_title] => 'High heat dissipation LED device and its manufacturing method'
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[firstpage_image] =>[orig_patent_app_number] => 10928322
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/928322 | High heat dissipation LED device and its manufacturing method | Aug 29, 2004 | Abandoned |