Search

Daniel Petkovsek

Examiner (ID: 10347, Phone: (571)272-4174 , Office: P/2874 )

Most Active Art Unit
2874
Art Unit(s)
2874
Total Applications
2428
Issued Applications
1973
Pending Applications
149
Abandoned Applications
353

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19995688 [patent_doc_number] => 20250133910 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-04-24 [patent_title] => Display Panel and Display Apparatus [patent_app_type] => utility [patent_app_number] => 18/691579 [patent_app_country] => US [patent_app_date] => 2022-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16290 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18691579 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/691579
Display Panel and Display Apparatus Sep 6, 2022 Pending
Array ( [id] => 19356903 [patent_doc_number] => 12057359 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/884499 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 5248 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17884499 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/884499
Semiconductor package and method of fabricating the same Aug 8, 2022 Issued
Array ( [id] => 18237824 [patent_doc_number] => 20230070134 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-09 [patent_title] => SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE [patent_app_type] => utility [patent_app_number] => 17/818093 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11396 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818093 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/818093
SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE Aug 7, 2022 Pending
Array ( [id] => 18024398 [patent_doc_number] => 20220375897 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES [patent_app_type] => utility [patent_app_number] => 17/881998 [patent_app_country] => US [patent_app_date] => 2022-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3024 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17881998 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/881998
Semiconductor device assemblies including multiple stacks of different semiconductor dies Aug 4, 2022 Issued
Array ( [id] => 18767000 [patent_doc_number] => 11817410 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Integrated circuit package and method [patent_app_type] => utility [patent_app_number] => 17/876159 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10554 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17876159 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/876159
Integrated circuit package and method Jul 27, 2022 Issued
Array ( [id] => 17993409 [patent_doc_number] => 20220359446 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/872000 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11048 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17872000 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/872000
Package structure and method of manufacturing the same Jul 24, 2022 Issued
Array ( [id] => 19138079 [patent_doc_number] => 11973055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Wafer bonding method [patent_app_type] => utility [patent_app_number] => 17/869977 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 26 [patent_no_of_words] => 10761 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869977 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869977
Wafer bonding method Jul 20, 2022 Issued
Array ( [id] => 17993449 [patent_doc_number] => 20220359486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => 3D Semiconductor Package Including Memory Array [patent_app_type] => utility [patent_app_number] => 17/814194 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14444 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17814194 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/814194
3D semiconductor package including memory array Jul 20, 2022 Issued
Array ( [id] => 19138079 [patent_doc_number] => 11973055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Wafer bonding method [patent_app_type] => utility [patent_app_number] => 17/869977 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 26 [patent_no_of_words] => 10761 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869977 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869977
Wafer bonding method Jul 20, 2022 Issued
Array ( [id] => 19138079 [patent_doc_number] => 11973055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Wafer bonding method [patent_app_type] => utility [patent_app_number] => 17/869977 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 26 [patent_no_of_words] => 10761 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869977 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869977
Wafer bonding method Jul 20, 2022 Issued
Array ( [id] => 19138079 [patent_doc_number] => 11973055 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Wafer bonding method [patent_app_type] => utility [patent_app_number] => 17/869977 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 26 [patent_no_of_words] => 10761 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869977 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869977
Wafer bonding method Jul 20, 2022 Issued
Array ( [id] => 20111567 [patent_doc_number] => 12362303 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-15 [patent_title] => Semiconductor memory device [patent_app_type] => utility [patent_app_number] => 17/813812 [patent_app_country] => US [patent_app_date] => 2022-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 43 [patent_no_of_words] => 12779 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 336 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17813812 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/813812
Semiconductor memory device Jul 19, 2022 Issued
Array ( [id] => 17986013 [patent_doc_number] => 20220352050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/866866 [patent_app_country] => US [patent_app_date] => 2022-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5117 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17866866 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/866866
Semiconductor package Jul 17, 2022 Issued
Array ( [id] => 18228670 [patent_doc_number] => 20230067664 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/865399 [patent_app_country] => US [patent_app_date] => 2022-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13572 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17865399 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/865399
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Jul 14, 2022 Pending
Array ( [id] => 18570619 [patent_doc_number] => 20230260956 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CONNECTION STRUCTURES AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/864092 [patent_app_country] => US [patent_app_date] => 2022-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11765 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -35 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864092 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/864092
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CONNECTION STRUCTURES AND METHOD OF FABRICATING THE SAME Jul 12, 2022 Pending
Array ( [id] => 19552905 [patent_doc_number] => 12136618 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-11-05 [patent_title] => Three-dimensional memory device with backside source contact [patent_app_type] => utility [patent_app_number] => 17/858695 [patent_app_country] => US [patent_app_date] => 2022-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 12446 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17858695 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/858695
Three-dimensional memory device with backside source contact Jul 5, 2022 Issued
Array ( [id] => 17986084 [patent_doc_number] => 20220352121 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER [patent_app_type] => utility [patent_app_number] => 17/858031 [patent_app_country] => US [patent_app_date] => 2022-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6173 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17858031 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/858031
SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER Jul 4, 2022 Pending
Array ( [id] => 19239505 [patent_doc_number] => 20240196701 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-13 [patent_title] => DISPLAY DEVICE AND MOBILE TERMINAL [patent_app_type] => utility [patent_app_number] => 17/798966 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8046 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17798966 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/798966
Display device and mobile terminal Jun 29, 2022 Issued
Array ( [id] => 20244243 [patent_doc_number] => 12424575 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-23 [patent_title] => Three-dimensional semiconductor device [patent_app_type] => utility [patent_app_number] => 17/855241 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17855241 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/855241
Three-dimensional semiconductor device Jun 29, 2022 Issued
Array ( [id] => 18177634 [patent_doc_number] => 20230038363 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-09 [patent_title] => THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING [patent_app_type] => utility [patent_app_number] => 17/848844 [patent_app_country] => US [patent_app_date] => 2022-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11774 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17848844 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/848844
Three-dimensional storage device using wafer-to-wafer bonding Jun 23, 2022 Issued
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