
Daniel V. Venne
Examiner (ID: 394)
| Most Active Art Unit | 3617 |
| Art Unit(s) | 3617, 3615 |
| Total Applications | 2006 |
| Issued Applications | 1406 |
| Pending Applications | 132 |
| Abandoned Applications | 502 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6247221
[patent_doc_number] => 20100025775
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-04
[patent_title] => 'Replacement spacers for mosfet fringe capacatance reduction and processes of making same'
[patent_app_type] => utility
[patent_app_number] => 12/220985
[patent_app_country] => US
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[pdf_file] => publications/A1/0025/20100025775.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/220985 | Replacement spacers for MOSFET fringe capacitance reduction and processes of making same | Jul 29, 2008 | Issued |
Array
(
[id] => 6255124
[patent_doc_number] => 20100029055
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[patent_kind] => A1
[patent_issue_date] => 2010-02-04
[patent_title] => 'METHOD OF MANUFACTURING A DUAL CONTACT TRENCH CAPACITOR.'
[patent_app_type] => utility
[patent_app_number] => 12/181335
[patent_app_country] => US
[patent_app_date] => 2008-07-29
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12181335
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/181335 | Method of manufacturing a dual contact trench capacitor | Jul 28, 2008 | Issued |
Array
(
[id] => 5527304
[patent_doc_number] => 20090197381
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-06
[patent_title] => 'METHOD FOR SELECTIVELY FORMING STRAIN IN A TRANSISTOR BY A STRESS MEMORIZATION TECHNIQUE WITHOUT ADDING ADDITIONAL LITHOGRAPHY STEPS'
[patent_app_type] => utility
[patent_app_number] => 12/179116
[patent_app_country] => US
[patent_app_date] => 2008-07-24
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[patent_drawing_sheets_cnt] => 15
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[pdf_file] => publications/A1/0197/20090197381.pdf
[firstpage_image] =>[orig_patent_app_number] => 12179116
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/179116 | Method for selectively forming strain in a transistor by a stress memorization technique without adding additional lithography steps | Jul 23, 2008 | Issued |
Array
(
[id] => 5416498
[patent_doc_number] => 20090042385
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'METHOD OF MANUFACTURING METAL LINE'
[patent_app_type] => utility
[patent_app_number] => 12/177636
[patent_app_country] => US
[patent_app_date] => 2008-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 978
[patent_no_of_claims] => 20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/177636 | Method of manufacturing metal line | Jul 21, 2008 | Issued |
Array
(
[id] => 6478049
[patent_doc_number] => 20100213485
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-26
[patent_title] => 'VERTICAL LED WITH CONDUCTIVE VIAS'
[patent_app_type] => utility
[patent_app_number] => 12/669679
[patent_app_country] => US
[patent_app_date] => 2008-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[firstpage_image] =>[orig_patent_app_number] => 12669679
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/669679 | Vertical LED with conductive vias | Jul 17, 2008 | Issued |
Array
(
[id] => 6502586
[patent_doc_number] => 20100013036
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'Thin Sacrificial Masking Films for Protecting Semiconductors From Pulsed Laser Process'
[patent_app_type] => utility
[patent_app_number] => 12/173903
[patent_app_country] => US
[patent_app_date] => 2008-07-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0013/20100013036.pdf
[firstpage_image] =>[orig_patent_app_number] => 12173903
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/173903 | Thin Sacrificial Masking Films for Protecting Semiconductors From Pulsed Laser Process | Jul 15, 2008 | Abandoned |
Array
(
[id] => 4644799
[patent_doc_number] => 08022405
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-20
[patent_title] => 'Light-emitting device'
[patent_app_type] => utility
[patent_app_number] => 12/219025
[patent_app_country] => US
[patent_app_date] => 2008-07-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 32
[patent_no_of_words] => 17913
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[pdf_file] => patents/08/022/08022405.pdf
[firstpage_image] =>[orig_patent_app_number] => 12219025
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/219025 | Light-emitting device | Jul 14, 2008 | Issued |
Array
(
[id] => 43470
[patent_doc_number] => 07776624
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-17
[patent_title] => 'Method for improving semiconductor surfaces'
[patent_app_type] => utility
[patent_app_number] => 12/168945
[patent_app_country] => US
[patent_app_date] => 2008-07-08
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[pdf_file] => patents/07/776/07776624.pdf
[firstpage_image] =>[orig_patent_app_number] => 12168945
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/168945 | Method for improving semiconductor surfaces | Jul 7, 2008 | Issued |
Array
(
[id] => 4856557
[patent_doc_number] => 20080265407
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[patent_issue_date] => 2008-10-30
[patent_title] => 'WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE'
[patent_app_type] => utility
[patent_app_number] => 12/168039
[patent_app_country] => US
[patent_app_date] => 2008-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0265/20080265407.pdf
[firstpage_image] =>[orig_patent_app_number] => 12168039
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/168039 | WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE | Jul 2, 2008 | Abandoned |
Array
(
[id] => 4451165
[patent_doc_number] => 07964488
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-06-21
[patent_title] => 'Semiconductor device and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 12/165145
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[patent_app_date] => 2008-06-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/964/07964488.pdf
[firstpage_image] =>[orig_patent_app_number] => 12165145
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/165145 | Semiconductor device and method for fabricating the same | Jun 29, 2008 | Issued |
Array
(
[id] => 6224689
[patent_doc_number] => 20100181580
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[patent_issue_date] => 2010-07-22
[patent_title] => 'LIGHT EMITTING APPARATUS'
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[patent_app_number] => 12/669093
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[firstpage_image] =>[orig_patent_app_number] => 12669093
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/669093 | LIGHT EMITTING APPARATUS | Jun 23, 2008 | Abandoned |
Array
(
[id] => 5395126
[patent_doc_number] => 20090315189
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[patent_issue_date] => 2009-12-24
[patent_title] => 'Layered chip package and method of manufacturing same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/213645 | Layered chip package and method of manufacturing same | Jun 22, 2008 | Issued |
Array
(
[id] => 173774
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/142849 | Sectional field effect devices and method of fabrication | Jun 19, 2008 | Issued |
Array
(
[id] => 23662
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[patent_title] => 'Electronic device manufacturing method and electronic device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/140706 | Electronic device manufacturing method and electronic device | Jun 16, 2008 | Issued |
Array
(
[id] => 6478928
[patent_doc_number] => 20100213584
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[patent_title] => 'ULTRA WIDEBAND HERMETICALLY SEALED SURFACE MOUNT TECHNOLOGY FOR MICROWAVE MONOLITHIC INTEGRATED CIRCUIT PACKAGE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/681617 | Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package | Jun 15, 2008 | Issued |
Array
(
[id] => 5364917
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[patent_issue_date] => 2009-12-10
[patent_title] => 'Structures and Methods to Enhance CU Interconnect Electromigration (EM) Performance'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/132806 | Structures and methods to enhance Cu interconnect electromigration (EM) performance | Jun 3, 2008 | Issued |
Array
(
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[patent_title] => 'SEMICONDUCTOR SUBSTRATE, METHOD OF FABRICATING THE SAME, METHOD OF FABRICATING SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING IMAGE SENSOR'
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/123495 | METHOD OF FABRICATING METAL PATTERN WITHOUT DAMAGING INSULATION LAYER | May 19, 2008 | Abandoned |
Array
(
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