Search

Dao H. Nguyen

Examiner (ID: 14112, Phone: (571)272-1791 , Office: P/2818 )

Most Active Art Unit
2818
Art Unit(s)
2818
Total Applications
2283
Issued Applications
1976
Pending Applications
142
Abandoned Applications
191

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
Array ( [id] => 13887441 [patent_doc_number] => 10196260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-05 [patent_title] => Wafer-level package with enhanced performance [patent_app_type] => utility [patent_app_number] => 15/676415 [patent_app_country] => US [patent_app_date] => 2017-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 10219 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/676415
Wafer-level package with enhanced performance Aug 13, 2017 Issued
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