
Dao H. Nguyen
Examiner (ID: 14112, Phone: (571)272-1791 , Office: P/2818 )
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 2283 |
| Issued Applications | 1976 |
| Pending Applications | 142 |
| Abandoned Applications | 191 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |
Array
(
[id] => 13887441
[patent_doc_number] => 10196260
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-02-05
[patent_title] => Wafer-level package with enhanced performance
[patent_app_type] => utility
[patent_app_number] => 15/676415
[patent_app_country] => US
[patent_app_date] => 2017-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 10219
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15676415
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/676415 | Wafer-level package with enhanced performance | Aug 13, 2017 | Issued |