Search

Daquan Zhao

Examiner (ID: 9543, Phone: (571)270-1119 , Office: P/2484 )

Most Active Art Unit
2484
Art Unit(s)
2621, 2484
Total Applications
1279
Issued Applications
938
Pending Applications
75
Abandoned Applications
286

Applications

Application numberTitle of the applicationFiling DateStatus
08/110538 PANE ANTENNA HAVING AT LEAST ONE WIRE-LIKE ANTENNA CONDUCTOR COMBINED WITH A SET OF HEATING WIRES Aug 22, 1993 Abandoned
Array ( [id] => 3432201 [patent_doc_number] => 05455455 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-03 [patent_title] => 'Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby' [patent_app_type] => 1 [patent_app_number] => 7/962222 [patent_app_country] => US [patent_app_date] => 1993-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 29 [patent_no_of_words] => 5533 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/455/05455455.pdf [firstpage_image] =>[orig_patent_app_number] => 962222 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/962222
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby Aug 19, 1993 Issued
Array ( [id] => 2999998 [patent_doc_number] => 05362986 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-11-08 [patent_title] => 'Vertical chip mount memory package with packaging substrate and memory chip pairs' [patent_app_type] => 1 [patent_app_number] => 8/109230 [patent_app_country] => US [patent_app_date] => 1993-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 4562 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/362/05362986.pdf [firstpage_image] =>[orig_patent_app_number] => 109230 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/109230
Vertical chip mount memory package with packaging substrate and memory chip pairs Aug 18, 1993 Issued
Array ( [id] => 3062378 [patent_doc_number] => 05357262 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-10-18 [patent_title] => 'Auxiliary antenna connector' [patent_app_type] => 1 [patent_app_number] => 8/108175 [patent_app_country] => US [patent_app_date] => 1993-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 6 [patent_no_of_words] => 2255 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/357/05357262.pdf [firstpage_image] =>[orig_patent_app_number] => 108175 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/108175
Auxiliary antenna connector Aug 16, 1993 Issued
Array ( [id] => 3072289 [patent_doc_number] => 05353040 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-10-04 [patent_title] => '4-wire helical antenna' [patent_app_type] => 1 [patent_app_number] => 8/109001 [patent_app_country] => US [patent_app_date] => 1993-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 25 [patent_no_of_words] => 3967 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/353/05353040.pdf [firstpage_image] =>[orig_patent_app_number] => 109001 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/109001
4-wire helical antenna Aug 15, 1993 Issued
08/106974 LOW NOISE DUAL POLARIZATION ELECTROMAGNETIC POWER RECEPTION AND CONVERSION SYSTEM Aug 15, 1993 Abandoned
Array ( [id] => 3427329 [patent_doc_number] => 05459335 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-10-17 [patent_title] => 'Semiconductor substrate having a thin film semiconductor layer bonded on a support substrate through an adhesive layer' [patent_app_type] => 1 [patent_app_number] => 8/106408 [patent_app_country] => US [patent_app_date] => 1993-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 3597 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/459/05459335.pdf [firstpage_image] =>[orig_patent_app_number] => 106408 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/106408
Semiconductor substrate having a thin film semiconductor layer bonded on a support substrate through an adhesive layer Aug 12, 1993 Issued
08/103208 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Aug 8, 1993 Abandoned
Array ( [id] => 3450266 [patent_doc_number] => 05420460 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-30 [patent_title] => 'Thin cavity down ball grid array package based on wirebond technology' [patent_app_type] => 1 [patent_app_number] => 8/102638 [patent_app_country] => US [patent_app_date] => 1993-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4714 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 243 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/420/05420460.pdf [firstpage_image] =>[orig_patent_app_number] => 102638 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/102638
Thin cavity down ball grid array package based on wirebond technology Aug 4, 1993 Issued
Array ( [id] => 3119320 [patent_doc_number] => 05410174 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-04-25 [patent_title] => 'Contact structure for integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/102529 [patent_app_country] => US [patent_app_date] => 1993-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2345 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/410/05410174.pdf [firstpage_image] =>[orig_patent_app_number] => 102529 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/102529
Contact structure for integrated circuits Aug 3, 1993 Issued
08/099282 REVERSE FIELD PLATE, JUNCTION-TERMINATING STRUCTURE Jul 28, 1993 Pending
08/100620 METHOD FOR USING A FIELD IMPLANT MASK TO CORRECT LOW DOPING LEVELS AT THE OUTSIDE EDGES OF THE BASE IN A WALLED-EMITTER TRANSISTOR STRUCTURE Jul 28, 1993 Pending
08/092910 METHOD OF LASER CONNECTION OF A CONDUCTOR TO A DOPED REGION OF THE SUBSTRATE OF AN INTEGRATED CIRCUIT, AND INTEGRATED CIRCUIT USING THE METHOD Jul 18, 1993 Pending
Array ( [id] => 3494276 [patent_doc_number] => 05440157 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-08 [patent_title] => 'Semiconductor integrated-circuit capacitor having a carbon film electrode' [patent_app_type] => 1 [patent_app_number] => 8/094422 [patent_app_country] => US [patent_app_date] => 1993-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 30 [patent_no_of_words] => 6916 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/440/05440157.pdf [firstpage_image] =>[orig_patent_app_number] => 094422 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/094422
Semiconductor integrated-circuit capacitor having a carbon film electrode Jul 15, 1993 Issued
Array ( [id] => 3538167 [patent_doc_number] => 05557146 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-09-17 [patent_title] => 'Ohmic contact using binder paste with semiconductor material dispersed therein' [patent_app_type] => 1 [patent_app_number] => 8/091648 [patent_app_country] => US [patent_app_date] => 1993-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2899 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/557/05557146.pdf [firstpage_image] =>[orig_patent_app_number] => 091648 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/091648
Ohmic contact using binder paste with semiconductor material dispersed therein Jul 13, 1993 Issued
08/088597 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Jul 8, 1993 Pending
08/085970 INTERCONNECT FOR INTEGRATED CIRCUITS Jun 29, 1993 Pending
08/083867 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR DEVICE Jun 27, 1993 Pending
08/082757 SEMICONDUCTOR DEVICE Jun 24, 1993 Pending
08/083080 TRENCH ISOLATION STRESS RELIEF Jun 23, 1993 Pending
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