
Daquan Zhao
Examiner (ID: 9543, Phone: (571)270-1119 , Office: P/2484 )
| Most Active Art Unit | |
| Art Unit(s) | |
| Total Applications | |
| Issued Applications | |
| Pending Applications | |
| Abandoned Applications |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
| 08/110538 | PANE ANTENNA HAVING AT LEAST ONE WIRE-LIKE ANTENNA CONDUCTOR COMBINED WITH A SET OF HEATING WIRES | Aug 22, 1993 | Abandoned |
| 07/962222 | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby | Aug 19, 1993 | Issued |
| 08/109230 | Vertical chip mount memory package with packaging substrate and memory chip pairs | Aug 18, 1993 | Issued |
| 08/108175 | Auxiliary antenna connector | Aug 16, 1993 | Issued |
| 08/109001 | 4-wire helical antenna | Aug 15, 1993 | Issued |
| 08/106974 | LOW NOISE DUAL POLARIZATION ELECTROMAGNETIC POWER RECEPTION AND CONVERSION SYSTEM | Aug 15, 1993 | Abandoned |
| 08/106408 | Semiconductor substrate having a thin film semiconductor layer bonded on a support substrate through an adhesive layer | Aug 12, 1993 | Issued |
| 08/103208 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Aug 8, 1993 | Abandoned |
| 08/102638 | Thin cavity down ball grid array package based on wirebond technology | Aug 4, 1993 | Issued |
| 08/102529 | Contact structure for integrated circuits | Aug 3, 1993 | Issued |
| 08/099282 | REVERSE FIELD PLATE, JUNCTION-TERMINATING STRUCTURE | Jul 28, 1993 | Pending |
| 08/100620 | METHOD FOR USING A FIELD IMPLANT MASK TO CORRECT LOW DOPING LEVELS AT THE OUTSIDE EDGES OF THE BASE IN A WALLED-EMITTER TRANSISTOR STRUCTURE | Jul 28, 1993 | Pending |
| 08/092910 | METHOD OF LASER CONNECTION OF A CONDUCTOR TO A DOPED REGION OF THE SUBSTRATE OF AN INTEGRATED CIRCUIT, AND INTEGRATED CIRCUIT USING THE METHOD | Jul 18, 1993 | Pending |
| 08/094422 | Semiconductor integrated-circuit capacitor having a carbon film electrode | Jul 15, 1993 | Issued |
| 08/091648 | Ohmic contact using binder paste with semiconductor material dispersed therein | Jul 13, 1993 | Issued |
| 08/088597 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | Jul 8, 1993 | Pending |
| 08/085970 | INTERCONNECT FOR INTEGRATED CIRCUITS | Jun 29, 1993 | Pending |
| 08/083867 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR DEVICE | Jun 27, 1993 | Pending |
| 08/082757 | SEMICONDUCTOR DEVICE | Jun 24, 1993 | Pending |
| 08/083080 | TRENCH ISOLATION STRESS RELIEF | Jun 23, 1993 | Pending |