
David A. Foster
Examiner (ID: 6221)
| Most Active Art Unit | 2835 |
| Art Unit(s) | 2835, 2103, 2841 |
| Total Applications | 393 |
| Issued Applications | 365 |
| Pending Applications | 18 |
| Abandoned Applications | 9 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4419735
[patent_doc_number] => 06266249
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Semiconductor flip chip ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 9/375835
[patent_app_country] => US
[patent_app_date] => 1999-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 2003
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/266/06266249.pdf
[firstpage_image] =>[orig_patent_app_number] => 375835
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/375835 | Semiconductor flip chip ball grid array package | Aug 15, 1999 | Issued |
Array
(
[id] => 4325726
[patent_doc_number] => 06317331
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-13
[patent_title] => 'Wiring substrate with thermal insert'
[patent_app_type] => 1
[patent_app_number] => 9/375175
[patent_app_country] => US
[patent_app_date] => 1999-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 3936
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[pdf_file] => patents/06/317/06317331.pdf
[firstpage_image] =>[orig_patent_app_number] => 375175
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/375175 | Wiring substrate with thermal insert | Aug 15, 1999 | Issued |
Array
(
[id] => 4418377
[patent_doc_number] => 06239984
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-29
[patent_title] => 'Backplane circuit board for an electronic chassis'
[patent_app_type] => 1
[patent_app_number] => 9/372489
[patent_app_country] => US
[patent_app_date] => 1999-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2264
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[pdf_file] => patents/06/239/06239984.pdf
[firstpage_image] =>[orig_patent_app_number] => 372489
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/372489 | Backplane circuit board for an electronic chassis | Aug 11, 1999 | Issued |
Array
(
[id] => 4341363
[patent_doc_number] => 06320754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 9/369898
[patent_app_country] => US
[patent_app_date] => 1999-08-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 9
[patent_no_of_words] => 3069
[patent_no_of_claims] => 24
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[pdf_file] => patents/06/320/06320754.pdf
[firstpage_image] =>[orig_patent_app_number] => 369898
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/369898 | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package | Aug 5, 1999 | Issued |
Array
(
[id] => 1552171
[patent_doc_number] => 06347039
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-12
[patent_title] => 'Memory module and memory module socket'
[patent_app_type] => B1
[patent_app_number] => 09/364677
[patent_app_country] => US
[patent_app_date] => 1999-07-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/347/06347039.pdf
[firstpage_image] =>[orig_patent_app_number] => 09364677
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/364677 | Memory module and memory module socket | Jul 29, 1999 | Issued |
Array
(
[id] => 7639211
[patent_doc_number] => 06396706
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-28
[patent_title] => 'Self-heating circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/364684
[patent_app_country] => US
[patent_app_date] => 1999-07-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/396/06396706.pdf
[firstpage_image] =>[orig_patent_app_number] => 09364684
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/364684 | Self-heating circuit board | Jul 29, 1999 | Issued |
Array
(
[id] => 1550140
[patent_doc_number] => 06445589
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-09-03
[patent_title] => 'Method of extending life expectancy of surface mount components'
[patent_app_type] => B2
[patent_app_number] => 09/354755
[patent_app_country] => US
[patent_app_date] => 1999-07-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/445/06445589.pdf
[firstpage_image] =>[orig_patent_app_number] => 09354755
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/354755 | Method of extending life expectancy of surface mount components | Jul 28, 1999 | Issued |
Array
(
[id] => 1433780
[patent_doc_number] => 06341070
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-22
[patent_title] => 'Wafer-scale packing processes for manufacturing integrated circuit (IC) packages'
[patent_app_type] => B1
[patent_app_number] => 09/363071
[patent_app_country] => US
[patent_app_date] => 1999-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/06/341/06341070.pdf
[firstpage_image] =>[orig_patent_app_number] => 09363071
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/363071 | Wafer-scale packing processes for manufacturing integrated circuit (IC) packages | Jul 27, 1999 | Issued |
Array
(
[id] => 4265490
[patent_doc_number] => 06208526
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Mounting multiple substrate frame and leadless surface mountable assembly using same'
[patent_app_type] => 1
[patent_app_number] => 9/360116
[patent_app_country] => US
[patent_app_date] => 1999-07-23
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[pdf_file] => patents/06/208/06208526.pdf
[firstpage_image] =>[orig_patent_app_number] => 360116
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/360116 | Mounting multiple substrate frame and leadless surface mountable assembly using same | Jul 22, 1999 | Issued |
Array
(
[id] => 1465076
[patent_doc_number] => 06351390
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-26
[patent_title] => 'Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly'
[patent_app_type] => B1
[patent_app_number] => 09/331135
[patent_app_country] => US
[patent_app_date] => 1999-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/351/06351390.pdf
[firstpage_image] =>[orig_patent_app_number] => 09331135
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/331135 | Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly | Jul 21, 1999 | Issued |
Array
(
[id] => 4286231
[patent_doc_number] => 06324066
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-27
[patent_title] => 'Surface mountable electronic device'
[patent_app_type] => 1
[patent_app_number] => 9/356435
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[patent_app_date] => 1999-07-19
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[pdf_file] => patents/06/324/06324066.pdf
[firstpage_image] =>[orig_patent_app_number] => 356435
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/356435 | Surface mountable electronic device | Jul 18, 1999 | Issued |
Array
(
[id] => 4419751
[patent_doc_number] => 06266251
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Cavity-down ball grid array module'
[patent_app_type] => 1
[patent_app_number] => 9/356982
[patent_app_country] => US
[patent_app_date] => 1999-07-19
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[pdf_file] => patents/06/266/06266251.pdf
[firstpage_image] =>[orig_patent_app_number] => 356982
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/356982 | Cavity-down ball grid array module | Jul 18, 1999 | Issued |
Array
(
[id] => 1517581
[patent_doc_number] => 06421248
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-16
[patent_title] => 'Chip card module'
[patent_app_type] => B1
[patent_app_number] => 09/354134
[patent_app_country] => US
[patent_app_date] => 1999-07-15
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[pdf_file] => patents/06/421/06421248.pdf
[firstpage_image] =>[orig_patent_app_number] => 09354134
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/354134 | Chip card module | Jul 14, 1999 | Issued |
Array
(
[id] => 4366490
[patent_doc_number] => 06292372
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-18
[patent_title] => 'Solder thieving pad for wave soldered through-hole components'
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[patent_app_number] => 9/353386
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[firstpage_image] =>[orig_patent_app_number] => 353386
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/353386 | Solder thieving pad for wave soldered through-hole components | Jul 14, 1999 | Issued |
Array
(
[id] => 4308251
[patent_doc_number] => 06326553
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-04
[patent_title] => 'Scheme to avoid electrostatic discharge damage to MR/GMR head gimbal/stack assembly in hard disk applications'
[patent_app_type] => 1
[patent_app_number] => 9/353249
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/353249 | Scheme to avoid electrostatic discharge damage to MR/GMR head gimbal/stack assembly in hard disk applications | Jul 13, 1999 | Issued |
Array
(
[id] => 1479987
[patent_doc_number] => 06344973
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[patent_kind] => B1
[patent_issue_date] => 2002-02-05
[patent_title] => 'Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same'
[patent_app_type] => B1
[patent_app_number] => 09/341527
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Array
(
[id] => 4229334
[patent_doc_number] => 06111759
[patent_country] => US
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[patent_issue_date] => 2000-08-29
[patent_title] => 'Display with an array of electromagnetically operable elements'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/351337 | Display with an array of electromagnetically operable elements | Jul 11, 1999 | Issued |
Array
(
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Array
(
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Array
(
[id] => 4373579
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[pdf_file] => patents/06/256/06256207.pdf
[firstpage_image] =>[orig_patent_app_number] => 347909
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/347909 | Chip-sized semiconductor device and process for making same | Jul 5, 1999 | Issued |