
David A. Foster
Examiner (ID: 1112)
| Most Active Art Unit | 2835 |
| Art Unit(s) | 2103, 2835, 2841 |
| Total Applications | 393 |
| Issued Applications | 365 |
| Pending Applications | 18 |
| Abandoned Applications | 9 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1585217
[patent_doc_number] => 06424541
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-23
[patent_title] => 'Electronic device attachment methods and apparatus for forming an assembly'
[patent_app_type] => B1
[patent_app_number] => 09/295562
[patent_app_country] => US
[patent_app_date] => 1999-04-21
[patent_effective_date] => 0000-00-00
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[patent_figures_cnt] => 4
[patent_no_of_words] => 3761
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[pdf_file] => patents/06/424/06424541.pdf
[firstpage_image] =>[orig_patent_app_number] => 09295562
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/295562 | Electronic device attachment methods and apparatus for forming an assembly | Apr 20, 1999 | Issued |
Array
(
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[patent_doc_number] => 06134117
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-17
[patent_title] => 'Method for high resolution trimming of PCB components'
[patent_app_type] => 1
[patent_app_number] => 9/292916
[patent_app_country] => US
[patent_app_date] => 1999-04-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/292916 | Method for high resolution trimming of PCB components | Apr 15, 1999 | Issued |
Array
(
[id] => 4250031
[patent_doc_number] => 06144559
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[patent_kind] => NA
[patent_issue_date] => 2000-11-07
[patent_title] => 'Process for assembling an interposer to probe dense pad arrays'
[patent_app_type] => 1
[patent_app_number] => 9/288343
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[patent_app_date] => 1999-04-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/288343 | Process for assembling an interposer to probe dense pad arrays | Apr 7, 1999 | Issued |
Array
(
[id] => 4368998
[patent_doc_number] => 06219254
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-17
[patent_title] => 'Chip-to-board connection assembly and method therefor'
[patent_app_type] => 1
[patent_app_number] => 9/286282
[patent_app_country] => US
[patent_app_date] => 1999-04-05
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/286282 | Chip-to-board connection assembly and method therefor | Apr 4, 1999 | Issued |
Array
(
[id] => 4419740
[patent_doc_number] => 06229712
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[patent_kind] => NA
[patent_issue_date] => 2001-05-08
[patent_title] => 'Printed circuit board for coupling surface mounted optoelectric semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 9/282307
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[patent_app_date] => 1999-03-31
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[firstpage_image] =>[orig_patent_app_number] => 282307
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/282307 | Printed circuit board for coupling surface mounted optoelectric semiconductor devices | Mar 30, 1999 | Issued |
Array
(
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[patent_doc_number] => 06285563
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[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Support bracket for a printed circuit board connectable to daughter boards'
[patent_app_type] => 1
[patent_app_number] => 9/282673
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Array
(
[id] => 4308716
[patent_doc_number] => 06198634
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[patent_title] => 'Electronic package with stacked connections'
[patent_app_type] => 1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/282842 | Electronic package with stacked connections | Mar 30, 1999 | Issued |
Array
(
[id] => 4201900
[patent_doc_number] => 06154373
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[patent_issue_date] => 2000-11-28
[patent_title] => 'High density cross-connection system'
[patent_app_type] => 1
[patent_app_number] => 9/275332
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[patent_app_date] => 1999-03-24
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[pdf_file] => patents/06/154/06154373.pdf
[firstpage_image] =>[orig_patent_app_number] => 275332
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/275332 | High density cross-connection system | Mar 23, 1999 | Issued |
Array
(
[id] => 4290613
[patent_doc_number] => 06282098
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[patent_issue_date] => 2001-08-28
[patent_title] => 'Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the same'
[patent_app_type] => 1
[patent_app_number] => 9/270842
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Array
(
[id] => 4077672
[patent_doc_number] => 06008996
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[patent_issue_date] => 1999-12-28
[patent_title] => 'Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die'
[patent_app_type] => 1
[patent_app_number] => 9/271752
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/271752 | Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die | Mar 17, 1999 | Issued |
Array
(
[id] => 4109852
[patent_doc_number] => 06097610
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[patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument'
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Array
(
[id] => 4144883
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Array
(
[id] => 1463557
[patent_doc_number] => 06392872
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Array
(
[id] => 4367479
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[patent_title] => 'Mounting system to support electrical components in a stacked relationship to one another'
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Array
(
[id] => 4171010
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Array
(
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Array
(
[id] => 4290382
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Array
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Array
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Array
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