
David A. Foster
Examiner (ID: 1112)
| Most Active Art Unit | 2835 |
| Art Unit(s) | 2103, 2835, 2841 |
| Total Applications | 393 |
| Issued Applications | 365 |
| Pending Applications | 18 |
| Abandoned Applications | 9 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4116560
[patent_doc_number] => 06101098
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-08
[patent_title] => 'Structure and method for mounting an electric part'
[patent_app_type] => 1
[patent_app_number] => 9/249702
[patent_app_country] => US
[patent_app_date] => 1999-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1566
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 72
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/101/06101098.pdf
[firstpage_image] =>[orig_patent_app_number] => 249702
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/249702 | Structure and method for mounting an electric part | Feb 11, 1999 | Issued |
Array
(
[id] => 4245718
[patent_doc_number] => 06075710
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips'
[patent_app_type] => 1
[patent_app_number] => 9/248875
[patent_app_country] => US
[patent_app_date] => 1999-02-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/075/06075710.pdf
[firstpage_image] =>[orig_patent_app_number] => 248875
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/248875 | Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips | Feb 10, 1999 | Issued |
Array
(
[id] => 4363100
[patent_doc_number] => 06215669
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-10
[patent_title] => 'Discrete component in-mold mounting'
[patent_app_type] => 1
[patent_app_number] => 9/248132
[patent_app_country] => US
[patent_app_date] => 1999-02-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/06/215/06215669.pdf
[firstpage_image] =>[orig_patent_app_number] => 248132
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/248132 | Discrete component in-mold mounting | Feb 9, 1999 | Issued |
Array
(
[id] => 4201832
[patent_doc_number] => 06130823
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-10
[patent_title] => 'Stackable ball grid array module and method'
[patent_app_type] => 1
[patent_app_number] => 9/240623
[patent_app_country] => US
[patent_app_date] => 1999-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 2011
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[pdf_file] => patents/06/130/06130823.pdf
[firstpage_image] =>[orig_patent_app_number] => 240623
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/240623 | Stackable ball grid array module and method | Jan 31, 1999 | Issued |
Array
(
[id] => 4368181
[patent_doc_number] => 06175506
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-16
[patent_title] => 'Multilayer printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 9/237246
[patent_app_country] => US
[patent_app_date] => 1999-01-26
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[firstpage_image] =>[orig_patent_app_number] => 237246
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/237246 | Multilayer printed circuit board | Jan 25, 1999 | Issued |
Array
(
[id] => 4250140
[patent_doc_number] => 06081429
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-27
[patent_title] => 'Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods'
[patent_app_type] => 1
[patent_app_number] => 9/234242
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[pdf_file] => patents/06/081/06081429.pdf
[firstpage_image] =>[orig_patent_app_number] => 234242
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/234242 | Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods | Jan 19, 1999 | Issued |
Array
(
[id] => 6947472
[patent_doc_number] => 20010021106
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-09-13
[patent_title] => 'STACKED PRINTED CIRCUIT BOARD MEMORY MODULE'
[patent_app_type] => new
[patent_app_number] => 09/231613
[patent_app_country] => US
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[pdf_file] => publications/A1/0021/20010021106.pdf
[firstpage_image] =>[orig_patent_app_number] => 09231613
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/231613 | Stacked printed circuit board memory module | Jan 13, 1999 | Issued |
Array
(
[id] => 4246718
[patent_doc_number] => 06118664
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-12
[patent_title] => 'Handle for plug-in protectors'
[patent_app_type] => 1
[patent_app_number] => 9/229292
[patent_app_country] => US
[patent_app_date] => 1999-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/118/06118664.pdf
[firstpage_image] =>[orig_patent_app_number] => 229292
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/229292 | Handle for plug-in protectors | Jan 12, 1999 | Issued |
| 09/228027 | ARCADE GAME COMPUTER SYSTEM | Jan 8, 1999 | Abandoned |
Array
(
[id] => 4416615
[patent_doc_number] => 06233157
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-15
[patent_title] => 'Printed circuit board and method for wiring signal lines on the same'
[patent_app_type] => 1
[patent_app_number] => 9/223285
[patent_app_country] => US
[patent_app_date] => 1998-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/06/233/06233157.pdf
[firstpage_image] =>[orig_patent_app_number] => 223285
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/223285 | Printed circuit board and method for wiring signal lines on the same | Dec 29, 1998 | Issued |
Array
(
[id] => 4371897
[patent_doc_number] => 06191948
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-20
[patent_title] => 'Power supply device'
[patent_app_type] => 1
[patent_app_number] => 9/223192
[patent_app_country] => US
[patent_app_date] => 1998-12-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/191/06191948.pdf
[firstpage_image] =>[orig_patent_app_number] => 223192
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/223192 | Power supply device | Dec 29, 1998 | Issued |
Array
(
[id] => 4109836
[patent_doc_number] => 06097609
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-01
[patent_title] => 'Direct BGA socket'
[patent_app_type] => 1
[patent_app_number] => 9/223647
[patent_app_country] => US
[patent_app_date] => 1998-12-30
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[pdf_file] => patents/06/097/06097609.pdf
[firstpage_image] =>[orig_patent_app_number] => 223647
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/223647 | Direct BGA socket | Dec 29, 1998 | Issued |
Array
(
[id] => 4082019
[patent_doc_number] => 06069797
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-30
[patent_title] => 'Power distribution assembly'
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[patent_app_number] => 9/222605
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[pdf_file] => patents/06/069/06069797.pdf
[firstpage_image] =>[orig_patent_app_number] => 222605
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/222605 | Power distribution assembly | Dec 28, 1998 | Issued |
Array
(
[id] => 4417060
[patent_doc_number] => 06172878
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-09
[patent_title] => 'Multi-element module and production process thereof'
[patent_app_type] => 1
[patent_app_number] => 9/221142
[patent_app_country] => US
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[pdf_file] => patents/06/172/06172878.pdf
[firstpage_image] =>[orig_patent_app_number] => 221142
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/221142 | Multi-element module and production process thereof | Dec 27, 1998 | Issued |
Array
(
[id] => 4309328
[patent_doc_number] => 06185107
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-06
[patent_title] => 'MEMS based tile assemblies and methods of fabrication'
[patent_app_type] => 1
[patent_app_number] => 9/220086
[patent_app_country] => US
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[pdf_file] => patents/06/185/06185107.pdf
[firstpage_image] =>[orig_patent_app_number] => 220086
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/220086 | MEMS based tile assemblies and methods of fabrication | Dec 22, 1998 | Issued |
Array
(
[id] => 4196670
[patent_doc_number] => 06160713
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[patent_kind] => NA
[patent_issue_date] => 2000-12-12
[patent_title] => 'Circuit in a selective call radio with improved electromechanical interconnects'
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[firstpage_image] =>[orig_patent_app_number] => 216770
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/216770 | Circuit in a selective call radio with improved electromechanical interconnects | Dec 20, 1998 | Issued |
Array
(
[id] => 4169816
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[patent_country] => US
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[patent_issue_date] => 2000-12-05
[patent_title] => 'Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements'
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[firstpage_image] =>[orig_patent_app_number] => 216978
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/216978 | Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements | Dec 20, 1998 | Issued |
Array
(
[id] => 4219559
[patent_doc_number] => 06219912
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[firstpage_image] =>[orig_patent_app_number] => 216932
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/216932 | Method for manufacture electronic component device | Dec 20, 1998 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/215802 | Flexible interconnection between integrated circuit chip and substrate or printed circuit board | Dec 17, 1998 | Issued |
Array
(
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[firstpage_image] =>[orig_patent_app_number] => 215852
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